ATE528343T1 - Teilkristallines polymer enthaltende zusammensetzung und daraus hergestellter artikel - Google Patents

Teilkristallines polymer enthaltende zusammensetzung und daraus hergestellter artikel

Info

Publication number
ATE528343T1
ATE528343T1 AT05821467T AT05821467T ATE528343T1 AT E528343 T1 ATE528343 T1 AT E528343T1 AT 05821467 T AT05821467 T AT 05821467T AT 05821467 T AT05821467 T AT 05821467T AT E528343 T1 ATE528343 T1 AT E528343T1
Authority
AT
Austria
Prior art keywords
crystalline polymer
composition containing
made therefrom
article made
partially crystalline
Prior art date
Application number
AT05821467T
Other languages
English (en)
Inventor
Christie Crowe
Glenn Cupta
Original Assignee
Solvay Advanced Polymers Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Solvay Advanced Polymers Llc filed Critical Solvay Advanced Polymers Llc
Application granted granted Critical
Publication of ATE528343T1 publication Critical patent/ATE528343T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
AT05821467T 2004-12-17 2005-12-15 Teilkristallines polymer enthaltende zusammensetzung und daraus hergestellter artikel ATE528343T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US63653104P 2004-12-17 2004-12-17
US71016105P 2005-08-23 2005-08-23
PCT/EP2005/056803 WO2006064032A1 (en) 2004-12-17 2005-12-15 Semi-crystalline polymer composition and article manufactured therefrom

Publications (1)

Publication Number Publication Date
ATE528343T1 true ATE528343T1 (de) 2011-10-15

Family

ID=35985388

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05821467T ATE528343T1 (de) 2004-12-17 2005-12-15 Teilkristallines polymer enthaltende zusammensetzung und daraus hergestellter artikel

Country Status (8)

Country Link
US (1) US20090286914A1 (de)
EP (1) EP1833897B1 (de)
JP (1) JP5054540B2 (de)
KR (1) KR20070087612A (de)
CN (1) CN101080446B (de)
AT (1) ATE528343T1 (de)
TW (1) TW200635993A (de)
WO (1) WO2006064032A1 (de)

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TWI321857B (en) * 2006-07-21 2010-03-11 Epistar Corp A light emitting device
EP2170982A1 (de) * 2007-07-23 2010-04-07 DSM IP Assets B.V. Kunststoffbauteil für ein beleuchtungssystem
TW201030087A (en) * 2008-10-30 2010-08-16 Solvay Advanced Polymers Llc Power LED device with a reflector made of aromatic polyester and/or wholly aromatic polyester
US20120099204A1 (en) * 2010-10-26 2012-04-26 Fusion Optix, Inc. Thermally Stable Optical Element
US8552101B2 (en) 2011-02-25 2013-10-08 Sabic Innovative Plastics Ip B.V. Thermally conductive and electrically insulative polymer compositions containing a low thermally conductive filler and uses thereof
US8741998B2 (en) 2011-02-25 2014-06-03 Sabic Innovative Plastics Ip B.V. Thermally conductive and electrically insulative polymer compositions containing a thermally insulative filler and uses thereof
CN103890098B (zh) * 2011-09-20 2016-08-17 提克纳有限责任公司 聚亚芳基硫醚/液晶聚合物合金和包括其的组合物
US9922749B2 (en) * 2011-09-27 2018-03-20 Rhodia Operations Polyamide composition having high thermal conductivity
EP2765163A1 (de) * 2013-02-12 2014-08-13 Solvay Specialty Polymers USA, LLC. Mobile elektronische Vorrichtung
US9227347B2 (en) 2013-02-25 2016-01-05 Sabic Global Technologies B.V. Method of making a heat sink assembly, heat sink assemblies made therefrom, and illumants using the heat sink assembly
US20150101570A1 (en) * 2013-10-14 2015-04-16 General Electric Company Electrical lead frame with protective coating and method of applying same
WO2015091588A1 (en) * 2013-12-18 2015-06-25 Solvay Specialty Polymers Usa, Llc Oil and gas recovery articles
US11634542B2 (en) * 2020-07-05 2023-04-25 Ht Materials Corporation High temperature semicrystalline poly(aryl ether ketone) copolymers

Family Cites Families (21)

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Publication number Priority date Publication date Assignee Title
US5642779A (en) * 1909-06-30 1997-07-01 Sumitomo Electric Industries, Ltd. Heat sink and a process for the production of the same
USRE31883E (en) * 1969-12-16 1985-05-14 General Electric Company Resinoid grinding wheels containing nickel-coated cubic boron nitride particles
JPS5461253A (en) * 1977-10-25 1979-05-17 Hitachi Cable Ltd Electrical insulator having improved thermal conductivity
US5196471A (en) * 1990-11-19 1993-03-23 Sulzer Plasma Technik, Inc. Thermal spray powders for abradable coatings, abradable coatings containing solid lubricants and methods of fabricating abradable coatings
JPH04198265A (ja) * 1990-11-26 1992-07-17 Toyobo Co Ltd 電子部品封止用樹脂組成物
US5710475A (en) * 1995-11-22 1998-01-20 General Electric Company Insulation of high thermal conductivity and apparatus containing same
US5709960A (en) * 1996-06-21 1998-01-20 Motorola, Inc. Mold compound
US5929138A (en) * 1996-11-05 1999-07-27 Raychem Corporation Highly thermally conductive yet highly comformable alumina filled composition and method of making the same
US5781412A (en) * 1996-11-22 1998-07-14 Parker-Hannifin Corporation Conductive cooling of a heat-generating electronic component using a cured-in-place, thermally-conductive interlayer having a filler of controlled particle size
US5900447A (en) * 1997-05-01 1999-05-04 Edison Polymer Innovation Corporation Composition for forming high thermal conductivity polybenzoxazine-based material and method
US5908889A (en) * 1997-12-03 1999-06-01 Nalco Chemical Company Polyamide binders for ceramics manufacture
US6236061B1 (en) * 1999-01-08 2001-05-22 Lakshaman Mahinda Walpita Semiconductor crystallization on composite polymer substrates
US6048919A (en) * 1999-01-29 2000-04-11 Chip Coolers, Inc. Thermally conductive composite material
US6165612A (en) * 1999-05-14 2000-12-26 The Bergquist Company Thermally conductive interface layers
US6481874B2 (en) * 2001-03-29 2002-11-19 Gelcore Llc Heat dissipation system for high power LED lighting system
US6600633B2 (en) * 2001-05-10 2003-07-29 Seagate Technology Llc Thermally conductive overmold for a disc drive actuator assembly
US20030040563A1 (en) * 2001-08-23 2003-02-27 Sagal E. Mikhail Substantially non-abrasive thermally conductive polymer composition containing boron nitride
US6693793B2 (en) * 2001-10-15 2004-02-17 Mitsui Mining & Smelting Co., Ltd. Double-sided copper clad laminate for capacitor layer formation and its manufacturing method
JP2004059638A (ja) * 2002-07-25 2004-02-26 Kuraray Co Ltd ポリアミド組成物
US20050049350A1 (en) * 2003-08-25 2005-03-03 Sandeep Tonapi Thin bond-line silicone adhesive composition and method for preparing the same
JP4906243B2 (ja) * 2004-06-02 2012-03-28 電気化学工業株式会社 無機質粉末及びその用途

Also Published As

Publication number Publication date
US20090286914A1 (en) 2009-11-19
CN101080446A (zh) 2007-11-28
JP5054540B2 (ja) 2012-10-24
WO2006064032A1 (en) 2006-06-22
EP1833897A1 (de) 2007-09-19
EP1833897B1 (de) 2011-10-12
TW200635993A (en) 2006-10-16
JP2008524362A (ja) 2008-07-10
CN101080446B (zh) 2012-01-04
KR20070087612A (ko) 2007-08-28

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Legal Events

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