ATE528799T1 - Verfahren zum betreiben einer halbleiteranordnung mit graben-gate - Google Patents

Verfahren zum betreiben einer halbleiteranordnung mit graben-gate

Info

Publication number
ATE528799T1
ATE528799T1 AT03725542T AT03725542T ATE528799T1 AT E528799 T1 ATE528799 T1 AT E528799T1 AT 03725542 T AT03725542 T AT 03725542T AT 03725542 T AT03725542 T AT 03725542T AT E528799 T1 ATE528799 T1 AT E528799T1
Authority
AT
Austria
Prior art keywords
operating
trench gate
semiconductor arrangement
semiconductor
arrangement
Prior art date
Application number
AT03725542T
Other languages
English (en)
Inventor
Steven T Peake
Philip Rutter
Raymond J Grover
Original Assignee
Nxp Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nxp Bv filed Critical Nxp Bv
Priority claimed from PCT/IB2003/002233 external-priority patent/WO2003103056A2/en
Application granted granted Critical
Publication of ATE528799T1 publication Critical patent/ATE528799T1/de

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/64Double-diffused metal-oxide semiconductor [DMOS] FETs
    • H10D30/66Vertical DMOS [VDMOS] FETs
    • H10D30/668Vertical DMOS [VDMOS] FETs having trench gate electrodes, e.g. UMOS transistors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/01Manufacture or treatment
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/411Insulated-gate bipolar transistors [IGBT]
    • H10D12/441Vertical IGBTs
    • H10D12/461Vertical IGBTs having non-planar surfaces, e.g. having trenches, recesses or pillars in the surfaces of the emitter, base or collector regions
    • H10D12/481Vertical IGBTs having non-planar surfaces, e.g. having trenches, recesses or pillars in the surfaces of the emitter, base or collector regions having gate structures on slanted surfaces, on vertical surfaces, or in grooves, e.g. trench gate IGBTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/01Manufacture or treatment
    • H10D30/021Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/028Manufacture or treatment of FETs having insulated gates [IGFET] of double-diffused metal oxide semiconductor [DMOS] FETs
    • H10D30/0291Manufacture or treatment of FETs having insulated gates [IGFET] of double-diffused metal oxide semiconductor [DMOS] FETs of vertical DMOS [VDMOS] FETs
    • H10D30/0297Manufacture or treatment of FETs having insulated gates [IGFET] of double-diffused metal oxide semiconductor [DMOS] FETs of vertical DMOS [VDMOS] FETs using recessing of the gate electrodes, e.g. to form trench gate electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/64Double-diffused metal-oxide semiconductor [DMOS] FETs
    • H10D30/66Vertical DMOS [VDMOS] FETs
    • H10D30/665Vertical DMOS [VDMOS] FETs having edge termination structures
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/111Field plates
AT03725542T 2002-05-31 2003-05-21 Verfahren zum betreiben einer halbleiteranordnung mit graben-gate ATE528799T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GBGB0212564.9A GB0212564D0 (en) 2002-05-31 2002-05-31 Trench-gate semiconductor device
GBGB0228809.0A GB0228809D0 (en) 2002-05-31 2002-12-11 Trench-gate semiconductor devices
PCT/IB2003/002233 WO2003103056A2 (en) 2002-05-31 2003-05-21 Trench-gate semiconductor device,corresponding module and apparatus ,and method of operating the device

Publications (1)

Publication Number Publication Date
ATE528799T1 true ATE528799T1 (de) 2011-10-15

Family

ID=9937768

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03725542T ATE528799T1 (de) 2002-05-31 2003-05-21 Verfahren zum betreiben einer halbleiteranordnung mit graben-gate

Country Status (3)

Country Link
KR (2) KR20050006283A (de)
AT (1) ATE528799T1 (de)
GB (3) GB0212564D0 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7442609B2 (en) * 2004-09-10 2008-10-28 Infineon Technologies Ag Method of manufacturing a transistor and a method of forming a memory device with isolation trenches
US7319256B1 (en) * 2006-06-19 2008-01-15 Fairchild Semiconductor Corporation Shielded gate trench FET with the shield and gate electrodes being connected together
KR100741919B1 (ko) * 2006-09-12 2007-07-24 동부일렉트로닉스 주식회사 Pn 접합 게이트 전극을 포함하는 트렌치형 모스트랜지스터 및 그 제조 방법
JP5138274B2 (ja) 2007-05-25 2013-02-06 三菱電機株式会社 半導体装置
KR101275458B1 (ko) * 2011-12-26 2013-06-17 삼성전기주식회사 반도체 소자 및 그 제조 방법
DE102016114229B3 (de) 2016-08-01 2017-12-07 Infineon Technologies Austria Ag Transistorbauelement mit einer zwei schichten umfassenden feldelektrodeund sein herstellverfahren
US11189698B2 (en) * 2017-12-29 2021-11-30 Suzhou Oriental Semiconductor Co., Ltd Semiconductor power device
US11031478B2 (en) 2018-01-23 2021-06-08 Infineon Technologies Austria Ag Semiconductor device having body contacts with dielectric spacers and corresponding methods of manufacture

Also Published As

Publication number Publication date
GB0212564D0 (en) 2002-07-10
KR20040111710A (ko) 2004-12-31
GB0303162D0 (en) 2003-03-19
KR20050006283A (ko) 2005-01-15
GB0228809D0 (en) 2003-01-15

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Legal Events

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