ATE529823T1 - Prozessfensterbewusste detektion und korrektur von lithografischen druckproblemen auf maskenniveau - Google Patents

Prozessfensterbewusste detektion und korrektur von lithografischen druckproblemen auf maskenniveau

Info

Publication number
ATE529823T1
ATE529823T1 AT08738102T AT08738102T ATE529823T1 AT E529823 T1 ATE529823 T1 AT E529823T1 AT 08738102 T AT08738102 T AT 08738102T AT 08738102 T AT08738102 T AT 08738102T AT E529823 T1 ATE529823 T1 AT E529823T1
Authority
AT
Austria
Prior art keywords
print
optical
process window
failure
sampling point
Prior art date
Application number
AT08738102T
Other languages
English (en)
Inventor
Amandine Borjon
Original Assignee
Nxp Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nxp Bv filed Critical Nxp Bv
Application granted granted Critical
Publication of ATE529823T1 publication Critical patent/ATE529823T1/de

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/36—Masks having proximity correction features; Preparation thereof, e.g. optical proximity correction [OPC] design processes

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Accessory Devices And Overall Control Thereof (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
AT08738102T 2007-05-23 2008-05-09 Prozessfensterbewusste detektion und korrektur von lithografischen druckproblemen auf maskenniveau ATE529823T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP07290703 2007-05-23
PCT/IB2008/051863 WO2008142604A2 (en) 2007-05-23 2008-05-09 Process-window aware detection and correction of lithographic printing issues at mask level

Publications (1)

Publication Number Publication Date
ATE529823T1 true ATE529823T1 (de) 2011-11-15

Family

ID=40002964

Family Applications (1)

Application Number Title Priority Date Filing Date
AT08738102T ATE529823T1 (de) 2007-05-23 2008-05-09 Prozessfensterbewusste detektion und korrektur von lithografischen druckproblemen auf maskenniveau

Country Status (5)

Country Link
US (1) US8230371B2 (de)
EP (1) EP2153376B1 (de)
CN (1) CN101720474A (de)
AT (1) ATE529823T1 (de)
WO (1) WO2008142604A2 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8103990B2 (en) * 2008-02-28 2012-01-24 Arm Limited Characterising circuit cell performance variability in response to perturbations in manufacturing process parameters
US8099684B2 (en) * 2009-01-08 2012-01-17 International Business Machines Corporation Methodology of placing printing assist feature for random mask layout
US8276102B2 (en) * 2010-03-05 2012-09-25 International Business Machines Corporation Spatial correlation-based estimation of yield of integrated circuits
US20120054694A1 (en) * 2010-08-24 2012-03-01 Ayman Yehia Hamouda Aerial Image Signatures
IT1401439B1 (it) * 2010-08-24 2013-07-26 Università Degli Studi Di Bergamo Metodo e sistema per l'identificazione assistita di fenomeni tecnici.
US8739076B2 (en) 2012-09-11 2014-05-27 Synopsys, Inc. Method and apparatus for process window modeling
KR101924487B1 (ko) 2013-12-17 2018-12-03 에이에스엠엘 네델란즈 비.브이. 수율 추산 및 제어
CN110344003B (zh) * 2014-06-06 2022-03-15 大日本印刷株式会社 蒸镀掩模及其前体、以及有机半导体元件的制造方法
US10339259B2 (en) * 2014-09-26 2019-07-02 Synopsys, Inc. Method for organizing, controlling, and reporting on design mismatch information in IC physical design data
EP3133553B1 (de) 2015-08-17 2021-08-04 Imec Vzw Verfahren zur verifizierung eines musters von merkmalen, die von einem lithografieverfahren gedruckt wurden
EP3385735B1 (de) * 2017-04-04 2019-12-04 Secure-IC SAS Vorrichtung und verfahren zur erkennung von fehlerpunkten
WO2022002599A1 (en) * 2020-07-03 2022-01-06 Asml Netherlands B.V. Process window based on failure rate
WO2022017705A1 (en) * 2020-07-22 2022-01-27 Asml Netherlands B.V. Method for controlling a manufacturing process and associated apparatuses
CN111984208B (zh) * 2020-08-20 2022-10-18 江苏南锦电子材料有限公司 一种光学扩散膜片led灯条侧消光处理方法
WO2023169806A1 (en) * 2022-03-09 2023-09-14 Asml Netherlands B.V. Methods, systems, and software for determination of failure rates of lithographic processes
CN115877671B (zh) * 2022-12-31 2026-02-17 全芯智造技术股份有限公司 与工艺参数有关的方法、设备和介质

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003526110A (ja) 1997-09-17 2003-09-02 ニューメリカル テクノロジーズ インコーポレイテッド 設計ルールの照合システム及び方法
JP3615182B2 (ja) * 2001-11-26 2005-01-26 株式会社東芝 光近接効果補正方法及び光近接効果補正システム
US6839125B2 (en) * 2003-02-11 2005-01-04 Asml Netherlands B.V. Method for optimizing an illumination source using full resist simulation and process window response metric
WO2005073807A1 (en) * 2004-01-29 2005-08-11 Kla-Tencor Technologies Corporation Computer-implemented methods for detecting defects in reticle design data
WO2005081910A2 (en) 2004-02-26 2005-09-09 Pdf Solutions, Inc. Generalization of the photo process window and its application to opc test pattern design
US8799830B2 (en) * 2004-05-07 2014-08-05 Mentor Graphics Corporation Integrated circuit layout design methodology with process variation bands
US7418683B1 (en) * 2005-09-21 2008-08-26 Cadence Design Systems, Inc Constraint assistant for circuit design
US8102408B2 (en) * 2006-06-29 2012-01-24 Kla-Tencor Technologies Corp. Computer-implemented methods and systems for determining different process windows for a wafer printing process for different reticle designs

Also Published As

Publication number Publication date
US20100293413A1 (en) 2010-11-18
EP2153376B1 (de) 2011-10-19
WO2008142604A2 (en) 2008-11-27
CN101720474A (zh) 2010-06-02
US8230371B2 (en) 2012-07-24
WO2008142604A8 (en) 2010-02-18
WO2008142604A3 (en) 2009-02-26
EP2153376A2 (de) 2010-02-17

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