ATE529903T1 - Phasenwechselspeicher mit verringertem stromverbrauch und herstellungsverfahren dafür - Google Patents
Phasenwechselspeicher mit verringertem stromverbrauch und herstellungsverfahren dafürInfo
- Publication number
- ATE529903T1 ATE529903T1 AT07752977T AT07752977T ATE529903T1 AT E529903 T1 ATE529903 T1 AT E529903T1 AT 07752977 T AT07752977 T AT 07752977T AT 07752977 T AT07752977 T AT 07752977T AT E529903 T1 ATE529903 T1 AT E529903T1
- Authority
- AT
- Austria
- Prior art keywords
- power consumption
- reduced power
- phase
- production method
- changing storage
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000012782 phase change material Substances 0.000 abstract 4
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/20—Multistable switching devices, e.g. memristors
- H10N70/231—Multistable switching devices, e.g. memristors based on solid-state phase change, e.g. between amorphous and crystalline phases, Ovshinsky effect
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0004—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements comprising amorphous/crystalline phase transition cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/011—Manufacture or treatment of multistable switching devices
- H10N70/041—Modification of switching materials after formation, e.g. doping
- H10N70/043—Modification of switching materials after formation, e.g. doping by implantation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/821—Device geometry
- H10N70/826—Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/881—Switching materials
- H10N70/882—Compounds of sulfur, selenium or tellurium, e.g. chalcogenides
- H10N70/8825—Selenides, e.g. GeSe
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/881—Switching materials
- H10N70/882—Compounds of sulfur, selenium or tellurium, e.g. chalcogenides
- H10N70/8828—Tellurides, e.g. GeSbTe
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/881—Switching materials
- H10N70/884—Switching materials based on at least one element of group IIIA, IVA or VA, e.g. elemental or compound semiconductors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Semiconductor Memories (AREA)
- Secondary Cells (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/377,664 US7723712B2 (en) | 2006-03-17 | 2006-03-17 | Reduced power consumption phase change memory and methods for forming the same |
| PCT/US2007/006316 WO2007109021A1 (en) | 2006-03-17 | 2007-03-14 | Reduced power consumption phase change memory and methods for forming the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE529903T1 true ATE529903T1 (de) | 2011-11-15 |
Family
ID=38232247
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT07752977T ATE529903T1 (de) | 2006-03-17 | 2007-03-14 | Phasenwechselspeicher mit verringertem stromverbrauch und herstellungsverfahren dafür |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US7723712B2 (de) |
| EP (2) | EP2383811B9 (de) |
| JP (1) | JP5110401B2 (de) |
| KR (1) | KR101051520B1 (de) |
| CN (1) | CN101405883B (de) |
| AT (1) | ATE529903T1 (de) |
| WO (1) | WO2007109021A1 (de) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7479671B2 (en) * | 2006-08-29 | 2009-01-20 | International Business Machines Corporation | Thin film phase change memory cell formed on silicon-on-insulator substrate |
| US20090072218A1 (en) * | 2007-09-18 | 2009-03-19 | Semyon Savransky | Higher threshold voltage phase change memory |
| US7852658B2 (en) * | 2008-03-14 | 2010-12-14 | Micron Technology, Inc. | Phase change memory cell with constriction structure |
| KR101604041B1 (ko) * | 2009-08-27 | 2016-03-16 | 삼성전자주식회사 | 상변화 물질을 포함하는 비휘발성 메모리 소자 |
| US8467239B2 (en) | 2010-12-02 | 2013-06-18 | Intel Corporation | Reversible low-energy data storage in phase change memory |
| CN102637821B (zh) * | 2011-02-12 | 2014-04-02 | 中芯国际集成电路制造(上海)有限公司 | 一种相变存储单元及其形成方法 |
| US8971089B2 (en) | 2012-06-27 | 2015-03-03 | Intel Corporation | Low power phase change memory cell |
| CN105247677B (zh) * | 2014-04-30 | 2018-03-09 | 华为技术有限公司 | 相变存储器 |
| US20160181515A1 (en) * | 2014-12-18 | 2016-06-23 | Stmicroelectronics S.R.I. | Embedded phase change memory devices and related methods |
| US9564585B1 (en) * | 2015-09-03 | 2017-02-07 | HGST Netherlands B.V. | Multi-level phase change device |
| CN110729400B (zh) * | 2019-09-03 | 2021-02-23 | 华中科技大学 | Ti-Ga-Sb相变材料、相变存储器及Ti-Ga-Sb相变材料的制备方法 |
| US11621394B2 (en) * | 2020-12-29 | 2023-04-04 | International Business Machines Corporation | Multi-layer phase change memory device |
| CN112786784B (zh) * | 2021-01-18 | 2022-11-01 | 长江先进存储产业创新中心有限责任公司 | 相变存储装置及其制作方法 |
| CN115101667B (zh) * | 2021-09-13 | 2024-10-22 | 华为技术有限公司 | 一种相变存储单元及相变存储器 |
| US12219885B2 (en) | 2021-11-19 | 2025-02-04 | International Business Machines Corporation | Reducing contact resistance of phase change memory bridge cell |
Family Cites Families (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4177475A (en) * | 1977-10-31 | 1979-12-04 | Burroughs Corporation | High temperature amorphous memory device for an electrically alterable read-only memory |
| JP2573854B2 (ja) * | 1987-12-12 | 1997-01-22 | 日興バイオ技研株式会社 | 超精密装置の超精密洗浄方法 |
| US5536947A (en) * | 1991-01-18 | 1996-07-16 | Energy Conversion Devices, Inc. | Electrically erasable, directly overwritable, multibit single cell memory element and arrays fabricated therefrom |
| US5405769A (en) * | 1993-04-08 | 1995-04-11 | National Research Council Of Canada | Construction of thermostable mutants of a low molecular mass xylanase |
| US5714768A (en) * | 1995-10-24 | 1998-02-03 | Energy Conversion Devices, Inc. | Second-layer phase change memory array on top of a logic device |
| US5759840A (en) * | 1996-09-09 | 1998-06-02 | National Research Council Of Canada | Modification of xylanase to improve thermophilicity, alkalophilicity and thermostability |
| US6087674A (en) | 1996-10-28 | 2000-07-11 | Energy Conversion Devices, Inc. | Memory element with memory material comprising phase-change material and dielectric material |
| US6682923B1 (en) * | 1999-05-12 | 2004-01-27 | Xencor | Thermostable alkaliphilic xylanase |
| DK200001852A (da) * | 1999-12-14 | 2001-06-15 | Asahi Optical Co Ltd | Manipuleringssektion til et endoskopisk behandlingsinstrument |
| GB0004827D0 (en) * | 2000-02-29 | 2000-04-19 | Quadrant Holdings Cambridge | Compositions |
| DE10021871A1 (de) * | 2000-05-05 | 2001-11-15 | Infineon Technologies Ag | Verfahren zum Herstellen einer Barriereschicht in einem elektronischen Bauelement und Verfahren zum Herstellen eines elektronischen Bauelements mit einer Barriereschicht |
| JP4025527B2 (ja) * | 2000-10-27 | 2007-12-19 | 松下電器産業株式会社 | メモリ、書き込み装置、読み出し装置およびその方法 |
| US6809362B2 (en) * | 2002-02-20 | 2004-10-26 | Micron Technology, Inc. | Multiple data state memory cell |
| US6579760B1 (en) * | 2002-03-28 | 2003-06-17 | Macronix International Co., Ltd. | Self-aligned, programmable phase change memory |
| JP3624291B2 (ja) | 2002-04-09 | 2005-03-02 | 松下電器産業株式会社 | 不揮発性メモリおよびその製造方法 |
| US6867996B2 (en) * | 2002-08-29 | 2005-03-15 | Micron Technology, Inc. | Single-polarity programmable resistance-variable memory element |
| US6856002B2 (en) * | 2002-08-29 | 2005-02-15 | Micron Technology, Inc. | Graded GexSe100-x concentration in PCRAM |
| US7307267B2 (en) * | 2002-12-19 | 2007-12-11 | Nxp B.V. | Electric device with phase change material and parallel heater |
| KR100486306B1 (ko) | 2003-02-24 | 2005-04-29 | 삼성전자주식회사 | 셀프 히터 구조를 가지는 상변화 메모리 소자 |
| US7402851B2 (en) * | 2003-02-24 | 2008-07-22 | Samsung Electronics Co., Ltd. | Phase changeable memory devices including nitrogen and/or silicon and methods for fabricating the same |
| KR100543445B1 (ko) * | 2003-03-04 | 2006-01-23 | 삼성전자주식회사 | 상변화 기억 소자 및 그 형성방법 |
| JP2004311728A (ja) * | 2003-04-08 | 2004-11-04 | Mitsubishi Materials Corp | 電気抵抗が高い相変化記録膜 |
| JP2004311729A (ja) * | 2003-04-08 | 2004-11-04 | Mitsubishi Materials Corp | 電気抵抗が高い相変化記録膜 |
| US7893419B2 (en) * | 2003-08-04 | 2011-02-22 | Intel Corporation | Processing phase change material to improve programming speed |
| KR100532462B1 (ko) | 2003-08-22 | 2005-12-01 | 삼성전자주식회사 | 상 변화 메모리 장치의 기입 전류 량을 제어하는프로그래밍 방법 및 프로그래밍 방법을 구현하는 기입드라이버 회로 |
| US6927410B2 (en) | 2003-09-04 | 2005-08-09 | Silicon Storage Technology, Inc. | Memory device with discrete layers of phase change memory material |
| US7485891B2 (en) * | 2003-11-20 | 2009-02-03 | International Business Machines Corporation | Multi-bit phase change memory cell and multi-bit phase change memory including the same, method of forming a multi-bit phase change memory, and method of programming a multi-bit phase change memory |
| KR100733147B1 (ko) | 2004-02-25 | 2007-06-27 | 삼성전자주식회사 | 상변화 메모리 장치 및 그 제조 방법 |
| DE102004020575B3 (de) | 2004-04-27 | 2005-08-25 | Infineon Technologies Ag | Halbleiterspeicherbauelement in Cross-Point-Architektur |
| DE102004040751B4 (de) * | 2004-08-23 | 2009-03-12 | Qimonda Ag | Resistiv schaltende nicht-flüchtige Speicherzelle auf der Basis von Alkali-Ionendrift, Verfahren zur Herstellung und Verwendung einer Verbindung zur Herstellung |
| JP2006108645A (ja) * | 2004-10-08 | 2006-04-20 | Ind Technol Res Inst | マルチレベル相変化メモリ、及びその動作方法並びに製造方法 |
| JP2006156886A (ja) | 2004-12-01 | 2006-06-15 | Renesas Technology Corp | 半導体集積回路装置およびその製造方法 |
| US6972429B1 (en) * | 2004-12-16 | 2005-12-06 | Macronix International Co, Ltd. | Chalcogenide random access memory and method of fabricating the same |
| US7973384B2 (en) * | 2005-11-02 | 2011-07-05 | Qimonda Ag | Phase change memory cell including multiple phase change material portions |
| US7692272B2 (en) | 2006-01-19 | 2010-04-06 | Elpida Memory, Inc. | Electrically rewritable non-volatile memory element and method of manufacturing the same |
| JP2007214419A (ja) | 2006-02-10 | 2007-08-23 | Toshiba Corp | 半導体装置 |
-
2006
- 2006-03-17 US US11/377,664 patent/US7723712B2/en active Active
-
2007
- 2007-03-14 WO PCT/US2007/006316 patent/WO2007109021A1/en not_active Ceased
- 2007-03-14 EP EP11175411.5A patent/EP2383811B9/de active Active
- 2007-03-14 AT AT07752977T patent/ATE529903T1/de not_active IP Right Cessation
- 2007-03-14 KR KR1020087024794A patent/KR101051520B1/ko active Active
- 2007-03-14 EP EP07752977A patent/EP2002491B1/de active Active
- 2007-03-14 JP JP2009500433A patent/JP5110401B2/ja active Active
- 2007-03-14 CN CN200780009465.1A patent/CN101405883B/zh active Active
-
2010
- 2010-04-19 US US12/762,692 patent/US8173988B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US20070221905A1 (en) | 2007-09-27 |
| EP2383811A2 (de) | 2011-11-02 |
| EP2383811B1 (de) | 2013-11-13 |
| WO2007109021A1 (en) | 2007-09-27 |
| CN101405883B (zh) | 2012-01-18 |
| EP2002491B1 (de) | 2011-10-19 |
| CN101405883A (zh) | 2009-04-08 |
| KR20080114793A (ko) | 2008-12-31 |
| JP2009530817A (ja) | 2009-08-27 |
| KR101051520B1 (ko) | 2011-07-22 |
| US8173988B2 (en) | 2012-05-08 |
| US7723712B2 (en) | 2010-05-25 |
| US20100193759A1 (en) | 2010-08-05 |
| EP2002491A1 (de) | 2008-12-17 |
| EP2383811A3 (de) | 2012-07-11 |
| JP5110401B2 (ja) | 2012-12-26 |
| EP2383811B9 (de) | 2014-06-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| ATE529903T1 (de) | Phasenwechselspeicher mit verringertem stromverbrauch und herstellungsverfahren dafür | |
| DE602004026674D1 (de) | Kleinstaktuator mit Direktantrieb und Herstellungsverfahren für denselben | |
| DE602006005829D1 (de) | Wärmeerzeuger mit einem magnetokalorischen material | |
| DE60210953D1 (de) | Reibungsmaterial mit Reibungsveräanderungsschicht | |
| SG119269A1 (en) | A material architecture for the fabrication of lowtemperature transistor | |
| PL1627094T3 (pl) | Przedmiot obrabiany z warstwą z bardzo twardego materiału zawierającego AlCr | |
| IL177322A (en) | Power semiconductor packaging structure | |
| DE602005014209D1 (de) | Ununterbrechbare stromversorgungen mit mehreren betriebsarten und betriebsverfahren dafür | |
| PL2205774T3 (pl) | Ciała powleczone twardym materiałem i sposób ich wytwarzania | |
| IL205955A (en) | Artificial dielectric material and method of manufacture | |
| EP1758168A4 (de) | Soi-substrat und herstellungsverfahren dafür | |
| WO2008129683A1 (ja) | 情報記録再生装置 | |
| GB2433512B (en) | Polar semiconductive hole transporting material | |
| EP2012972A4 (de) | Strukturierter schleifartikel sowie verfahren zu seiner herstellung und verwendung | |
| EP1598441A4 (de) | Film aus amorphem kohlenstoff, herstellungsverfahren daf r und damit beschichtetes material | |
| EP1948722A4 (de) | Poröses material und herstellungsverfahren dafür | |
| EP1959503A4 (de) | Halbleiter-leuchtelement und verfahren zur herstellung eines halbleiter-leuchtelements | |
| EP1830614A4 (de) | Verfahren zur herstellung eines substrats mit mit leitfähigem material gefülltem durchgangsloch | |
| IL200488A0 (en) | Memory storage devices comprising different ferromagnetic material layers, and methods of making and using the same | |
| TW200733360A (en) | Non-volatile memory element and method of manufacturing the same | |
| EP2146979A4 (de) | Neues verfahren zur herstellung der verbindung 2-hydroxy-3-[5-(morpholin-4-ylmethyl)pyridin-2-yl]1h-indol-5-carbonitril 701 | |
| DE602005009276D1 (de) | Gegenstand mit eingegossenem Einsatz und Herstellungsverfahren | |
| GB2403705B (en) | A container with double layers made of different materials | |
| EP2191520B8 (de) | Lichtemittierende dünnfilm-diode mit einer spiegelschicht und verfahren zu deren herstellung | |
| NO20052263L (no) | Fremgangsmate for a danne ferroelektriske tynnfilmer, bruk av fremgangsmaten og minne med ferroelektrisk oligomer som minnemateriale |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |