ATE531246T1 - Geschichteter wärmeartikel - Google Patents

Geschichteter wärmeartikel

Info

Publication number
ATE531246T1
ATE531246T1 AT06784340T AT06784340T ATE531246T1 AT E531246 T1 ATE531246 T1 AT E531246T1 AT 06784340 T AT06784340 T AT 06784340T AT 06784340 T AT06784340 T AT 06784340T AT E531246 T1 ATE531246 T1 AT E531246T1
Authority
AT
Austria
Prior art keywords
layered heat
heat article
article
layered
graphite
Prior art date
Application number
AT06784340T
Other languages
English (en)
Inventor
David S Flaherty
Gary D Shives
Original Assignee
Graftech Int Holdings Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Graftech Int Holdings Inc filed Critical Graftech Int Holdings Inc
Application granted granted Critical
Publication of ATE531246T1 publication Critical patent/ATE531246T1/de

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/02Constructions of heat-exchange apparatus characterised by the selection of particular materials of carbon, e.g. graphite
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/20Arrangements for cooling
    • H10W40/25Arrangements for cooling characterised by their materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/20Arrangements for cooling
    • H10W40/25Arrangements for cooling characterised by their materials
    • H10W40/255Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029Heat sinks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Thermotherapy And Cooling Therapy Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
AT06784340T 2005-04-11 2006-03-31 Geschichteter wärmeartikel ATE531246T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/103,348 US20060225874A1 (en) 2005-04-11 2005-04-11 Sandwiched thermal article
PCT/US2006/012102 WO2006132695A2 (en) 2005-04-11 2006-03-31 Sandwiched thermal article

Publications (1)

Publication Number Publication Date
ATE531246T1 true ATE531246T1 (de) 2011-11-15

Family

ID=37082062

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06784340T ATE531246T1 (de) 2005-04-11 2006-03-31 Geschichteter wärmeartikel

Country Status (5)

Country Link
US (1) US20060225874A1 (de)
EP (1) EP1875790B1 (de)
AT (1) ATE531246T1 (de)
ES (1) ES2375375T3 (de)
WO (1) WO2006132695A2 (de)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
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WO2007122198A1 (en) 2006-04-21 2007-11-01 Oce-Technologies B.V. Heat exchange laminate
JP4885269B2 (ja) 2006-04-21 2012-02-29 オセ−テクノロジーズ ビーブイ 印刷システムのための熱交換ユニット
EP2034520B1 (de) * 2006-06-08 2013-04-03 International Business Machines Corporation Hochwärmeleitfähiges flexibles blatt
CN101679294B (zh) 2007-05-30 2012-08-08 弗·哈夫曼-拉罗切有限公司 非核苷逆转录酶抑制剂
US8081468B2 (en) 2009-06-17 2011-12-20 Laird Technologies, Inc. Memory modules including compliant multilayered thermally-conductive interface assemblies
US20100321897A1 (en) * 2009-06-17 2010-12-23 Laird Technologies, Inc. Compliant multilayered thermally-conductive interface assemblies
TW201136502A (en) * 2010-04-07 2011-10-16 Ascend Top Entpr Co Ltd Thin type heat dissipation device
US8372532B2 (en) * 2010-05-04 2013-02-12 GM Global Technology Operations LLC Secondary battery module and composite article thereof
US20120033384A1 (en) * 2010-08-06 2012-02-09 Pillai Unnikrishnan G Graphite wrapped heat spreading pillow
KR101584872B1 (ko) * 2010-10-26 2016-01-13 헨켈 아이피 앤드 홀딩 게엠베하 기판 수준 emi 차폐를 위한 복합 필름
JP5978457B2 (ja) * 2012-03-19 2016-08-24 パナソニックIpマネジメント株式会社 熱伝導体
US20130327508A1 (en) * 2012-06-07 2013-12-12 Mark A. Zaffetti Cold plate assembly incorporating thermal heat spreader
EP2979136B1 (de) 2013-03-29 2017-10-18 OCE-Technologies B.V. Wärmeaustauschlaminat
JP2016517035A (ja) 2013-03-29 2016-06-09 オセ−テクノロジーズ ビーブイ 熱交換ラミネート
US9312580B2 (en) 2013-07-30 2016-04-12 Johnson Controls Technology Company Battery module with phase change material
US8861191B1 (en) 2013-09-30 2014-10-14 Google Inc. Apparatus related to a structure of a base portion of a computing device
US9430006B1 (en) 2013-09-30 2016-08-30 Google Inc. Computing device with heat spreader
US20150096731A1 (en) * 2013-10-04 2015-04-09 Specialty Minerals (Michigan) Inc. Device and System for Dissipating Heat, and Method of Making Same
US9706684B2 (en) 2013-12-26 2017-07-11 Terrella Energy Systems Ltd. Exfoliated graphite materials and composite materials and devices for thermal management
US9700968B2 (en) 2013-12-26 2017-07-11 Terrella Energy Systems Ltd. Apparatus and methods for processing exfoliated graphite materials
US9442514B1 (en) 2014-07-23 2016-09-13 Google Inc. Graphite layer between carbon layers
US10281043B2 (en) * 2015-07-10 2019-05-07 Lockheed Martin Corporation Carbon nanotube based thermal gasket for space vehicles
JP2017028280A (ja) * 2015-07-20 2017-02-02 アールエヌユー カンパニー リミテッド 高性能電磁波シールド及び高放熱複合機能シート
ES2746161T3 (es) * 2015-09-07 2020-03-04 Hak Sik Joo Lámina compleja para la absorción/extinción y el blindaje contra las ondas electromagnéticas, y para la elevada disipación de calor de un dispositivo electrónico y procedimiento de fabricación de la misma
US9736923B1 (en) * 2017-01-17 2017-08-15 Northrop Grumman Systems Corporation Alloy bonded graphene sheets for enhanced thermal spreaders
EP3392906A1 (de) * 2017-04-19 2018-10-24 Siemens Aktiengesellschaft Verfahren zur herstellung einer kühlplatte für einen leistungshalbleiter
US11840013B2 (en) 2018-02-27 2023-12-12 Matthews International Corporation Graphite materials and devices with surface micro-texturing
JP2020053531A (ja) * 2018-09-26 2020-04-02 スリーエム イノベイティブ プロパティズ カンパニー 熱伝導性シート前駆体、並びに該前駆体から得られる熱伝導性シート及びその製造方法
US11483948B2 (en) 2019-08-28 2022-10-25 Laird Technologies, Inc. Thermal interface materials including memory foam cores
JP7654003B2 (ja) * 2020-02-28 2025-03-31 ネオグラフ ソリューションズ,リミティド ライアビリティ カンパニー 熱管理システム
US12209664B2 (en) 2020-12-10 2025-01-28 Laird Technologies (Shenzhen) Ltd. Electrically and thermally conductive gaskets
EP4013203B1 (de) 2020-12-10 2024-07-31 Laird Technologies (Shenzhen) Ltd. Elektrisch und thermisch leitende dichtungen

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US4591659A (en) * 1983-12-22 1986-05-27 Trw Inc. Multilayer printed circuit board structure
US4895713A (en) * 1987-08-31 1990-01-23 Union Carbide Corporation Intercalation of graphite
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JPH0721308Y2 (ja) 1990-10-30 1995-05-17 信越化学工業株式会社 熱伝導性シート
US5375655A (en) * 1993-03-31 1994-12-27 Lee; Yong N. Heat sink apparatus
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US5902762A (en) * 1997-04-04 1999-05-11 Ucar Carbon Technology Corporation Flexible graphite composite
US6026895A (en) * 1998-02-06 2000-02-22 Fujitsu Limited Flexible foil finned heatsink structure and method of making same
US6245400B1 (en) * 1998-10-07 2001-06-12 Ucar Graph-Tech Inc. Flexible graphite with non-carrier pressure sensitive adhesive backing and release liner
US6482520B1 (en) * 2000-02-25 2002-11-19 Jing Wen Tzeng Thermal management system
US6503626B1 (en) * 2000-02-25 2003-01-07 Graftech Inc. Graphite-based heat sink
US20020157818A1 (en) * 2001-04-04 2002-10-31 Julian Norley Anisotropic thermal solution
US6538892B2 (en) * 2001-05-02 2003-03-25 Graftech Inc. Radial finned heat sink
US6777086B2 (en) * 2001-08-31 2004-08-17 Julian Norley Laminates prepared from impregnated flexible graphite sheets
JP3938681B2 (ja) * 2001-11-21 2007-06-27 信越化学工業株式会社 放熱構造体
US6749010B2 (en) * 2002-06-28 2004-06-15 Advanced Energy Technology Inc. Composite heat sink with metal base and graphite fins
US6771502B2 (en) * 2002-06-28 2004-08-03 Advanced Energy Technology Inc. Heat sink made from longer and shorter graphite sheets
US20050155743A1 (en) * 2002-06-28 2005-07-21 Getz George Jr. Composite heat sink with metal base and graphite fins
US20040076810A1 (en) * 2002-10-17 2004-04-22 Ucar Carbon Company Inc. Composite high temperature insulator
DE202004007473U1 (de) 2004-05-10 2004-07-29 Richard Wöhr GmbH Lüfterloses Kühlsystem mit Wärmeleitrohr und mit doppelseitigem Mehrschichtenkühler
US7393587B2 (en) * 2004-09-17 2008-07-01 Graftech International Holdings Inc. Sandwiched finstock

Also Published As

Publication number Publication date
ES2375375T3 (es) 2012-02-29
US20060225874A1 (en) 2006-10-12
EP1875790B1 (de) 2011-10-26
EP1875790A4 (de) 2009-10-21
WO2006132695A3 (en) 2007-10-25
EP1875790A2 (de) 2008-01-09
WO2006132695A2 (en) 2006-12-14

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties