ATE532399T1 - Anordnung für eine motorsteuerung - Google Patents

Anordnung für eine motorsteuerung

Info

Publication number
ATE532399T1
ATE532399T1 AT10156044T AT10156044T ATE532399T1 AT E532399 T1 ATE532399 T1 AT E532399T1 AT 10156044 T AT10156044 T AT 10156044T AT 10156044 T AT10156044 T AT 10156044T AT E532399 T1 ATE532399 T1 AT E532399T1
Authority
AT
Austria
Prior art keywords
arrangement
centre axis
power semiconductors
cooling
cooling elements
Prior art date
Application number
AT10156044T
Other languages
English (en)
Inventor
Matti Kauranen
Mika Silvennoinen
Original Assignee
Abb Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Abb Oy filed Critical Abb Oy
Application granted granted Critical
Publication of ATE532399T1 publication Critical patent/ATE532399T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components
    • H05K7/20918—Forced ventilation, e.g. on heat dissipaters coupled to components the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/43—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing gases, e.g. forced air cooling
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Inverter Devices (AREA)
  • Control Of Direct Current Motors (AREA)
  • Reciprocating, Oscillating Or Vibrating Motors (AREA)
AT10156044T 2009-03-13 2010-03-10 Anordnung für eine motorsteuerung ATE532399T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20095265A FI122215B (fi) 2009-03-13 2009-03-13 Järjestely moottoriohjainta varten

Publications (1)

Publication Number Publication Date
ATE532399T1 true ATE532399T1 (de) 2011-11-15

Family

ID=40510263

Family Applications (1)

Application Number Title Priority Date Filing Date
AT10156044T ATE532399T1 (de) 2009-03-13 2010-03-10 Anordnung für eine motorsteuerung

Country Status (5)

Country Link
US (1) US8004836B2 (de)
EP (1) EP2229044B1 (de)
CN (1) CN101834560B (de)
AT (1) ATE532399T1 (de)
FI (1) FI122215B (de)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8174826B2 (en) * 2010-05-27 2012-05-08 International Business Machines Corporation Liquid cooling system for stackable modules in energy-efficient computing systems
US8279597B2 (en) 2010-05-27 2012-10-02 International Business Machines Corporation Heatsink allowing in-situ maintenance in a stackable module
US8179674B2 (en) 2010-05-28 2012-05-15 International Business Machines Corporation Scalable space-optimized and energy-efficient computing system
US8358503B2 (en) 2010-05-28 2013-01-22 International Business Machines Corporation Stackable module for energy-efficient computing systems
GB2490495B (en) * 2011-04-28 2014-11-12 Sevcon Ltd A modular and stackable motor controller
EP3073630B1 (de) 2011-04-28 2019-07-10 Sevcon Limited Elektromotor und motorsteuerung
EP2672618A1 (de) * 2012-06-04 2013-12-11 ABB Oy Modularer Motorwechselrichter mit durch Kühlkörper gebildeten inneren Kühlkanal und ringförmigen Kondensator auf der Aussenseite
US8780562B2 (en) * 2012-07-20 2014-07-15 Tai-Her Yang Heat dissipater having heat conductive rib with interval forming as flow guide hole and applied in electric luminous body
JP5657716B2 (ja) * 2013-01-15 2015-01-21 ファナック株式会社 放熱器を備えたモータ駆動装置
US9578788B2 (en) * 2013-03-15 2017-02-21 Atieva, Inc. Inverter power module packaging with cold plate
US10389211B2 (en) * 2014-10-08 2019-08-20 Borgwarner Inc. Axially extending electric machine electronics cooling tower
CN106796928B (zh) * 2014-10-08 2019-09-06 瑞美技术有限责任公司 用于mosfet模块的基座表面
US9680385B2 (en) * 2014-11-04 2017-06-13 Ge Aviation Systems Llc Power converter
WO2016151804A1 (ja) * 2015-03-25 2016-09-29 三菱電機株式会社 電力変換装置
JP2017045775A (ja) * 2015-08-24 2017-03-02 株式会社東芝 送信機および電子機器
DE102015115421A1 (de) * 2015-09-14 2017-03-16 Sma Solar Technology Ag Wechselrichter mit einem mehrteiligen Gehäuse und innenliegendem Kühlluftkanal
DE102017206775A1 (de) * 2017-04-21 2018-10-25 Lenze Automation Gmbh Elektrisches Steuergerät
EP3490352B1 (de) 2017-11-24 2020-11-11 Siemens Aktiengesellschaft Niederspannungsschaltgerät mit einer asymmetrisch geführten luftstromkühlung
DE102017222024A1 (de) * 2017-12-06 2019-06-06 Zf Friedrichshafen Ag Wechselrichter
US10813255B2 (en) * 2017-12-26 2020-10-20 Mitsubishi Electric Corporation Motor drive device
FR3083050B1 (fr) 2018-06-26 2020-09-18 Zodiac Aero Electric Dispositif de transformation et de redressement de tension polyphasee
DE102019111366B3 (de) * 2019-05-02 2020-05-14 Fachhochschule Kiel Kompaktes Leistungselektronik-Modul mit vergrößerter Kühlfläche
DE102019126002A1 (de) * 2019-09-26 2021-04-01 Bayerische Motoren Werke Aktiengesellschaft Inverter mit prismatischem Kühlkörper
US11342749B1 (en) * 2019-11-22 2022-05-24 Smart Wires Inc. Integration of a power flow control unit
US12302528B2 (en) * 2020-11-18 2025-05-13 New Focus Lighting & Power Technology (Shanghai) Co., Ltd. Cooling apparatus
DE102024122418A1 (de) 2024-08-06 2026-02-12 Connaught Electronics Ltd. Steuergerätekühlkörper und Steuergerätekühlanordnung sowie elektronisches Steuergerät mit einer Steuergerätekühlanordnung

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US3149666A (en) * 1961-06-15 1964-09-22 Wakefield Eng Inc Cooler
NL122287C (de) 1962-08-29
GB9301049D0 (en) * 1993-01-20 1993-03-10 The Technology Partnership Plc Mounting assembly
US5648892A (en) * 1995-09-29 1997-07-15 Allen-Bradley Company, Inc. Wireless circuit board system for a motor controller
DE10058574B4 (de) * 2000-11-24 2005-09-15 Danfoss Drives A/S Kühlgerät für Leistungshalbleiter
US7148452B2 (en) * 2001-04-03 2006-12-12 Emerson Electric Co. Heat sink for printed circuit board components
DE10140328B4 (de) 2001-08-16 2006-02-02 Siemens Ag Kühlanordnung zur Kühlung elektronischer Bauelemente
US6580608B1 (en) * 2001-12-21 2003-06-17 Intel Corporation Method and apparatus for thermally controlling multiple electronic components
TW545623U (en) * 2001-12-27 2003-08-01 Chin-Wen Wang Rotation type CPU cooling device
JP2005328659A (ja) 2004-05-14 2005-11-24 Sansha Electric Mfg Co Ltd 電子負荷装置および電源装置の防塵冷却構造
TWM259940U (en) * 2004-05-31 2005-03-21 Glacialtech Inc Heat dissipating device
DE102005031759A1 (de) 2005-07-07 2007-01-18 Semikron Elektronik Gmbh & Co. Kg Stromrichteranordnung mit Kühleinrichtung
JP4940883B2 (ja) * 2005-10-31 2012-05-30 豊田合成株式会社 発光装置
US7646606B2 (en) * 2008-05-13 2010-01-12 Honeywell International Inc. IGBT packaging and cooling using PCM and liquid

Also Published As

Publication number Publication date
FI122215B (fi) 2011-10-14
US20100232106A1 (en) 2010-09-16
US8004836B2 (en) 2011-08-23
EP2229044B1 (de) 2011-11-02
EP2229044A3 (de) 2010-10-27
FI20095265A0 (fi) 2009-03-13
CN101834560B (zh) 2012-08-29
FI20095265L (fi) 2010-09-14
CN101834560A (zh) 2010-09-15
EP2229044A2 (de) 2010-09-15

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