ATE533180T1 - Umspritzung für eine elektronische baugruppe - Google Patents

Umspritzung für eine elektronische baugruppe

Info

Publication number
ATE533180T1
ATE533180T1 AT08830081T AT08830081T ATE533180T1 AT E533180 T1 ATE533180 T1 AT E533180T1 AT 08830081 T AT08830081 T AT 08830081T AT 08830081 T AT08830081 T AT 08830081T AT E533180 T1 ATE533180 T1 AT E533180T1
Authority
AT
Austria
Prior art keywords
backplate
circuit substrate
assembly
electronic assembly
electrical connector
Prior art date
Application number
AT08830081T
Other languages
English (en)
Inventor
Thomas Degenkolb
Scott Brandenburg
Larry Mandel
Kin Chow
Ching Fang
Sim Yong
Original Assignee
Delphi Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delphi Tech Inc filed Critical Delphi Tech Inc
Application granted granted Critical
Publication of ATE533180T1 publication Critical patent/ATE533180T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0034—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having an overmolded housing covering the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/065—Hermetically-sealed casings sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0064—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a polymeric substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Measuring Pulse, Heart Rate, Blood Pressure Or Blood Flow (AREA)
  • Casings For Electric Apparatus (AREA)
AT08830081T 2007-09-14 2008-09-12 Umspritzung für eine elektronische baugruppe ATE533180T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/901,042 US7616448B2 (en) 2007-09-14 2007-09-14 Wrap-around overmold for electronic assembly
PCT/US2008/010689 WO2009035681A1 (en) 2007-09-14 2008-09-12 Wrap-around overmold for electronic assembly

Publications (1)

Publication Number Publication Date
ATE533180T1 true ATE533180T1 (de) 2011-11-15

Family

ID=40452360

Family Applications (1)

Application Number Title Priority Date Filing Date
AT08830081T ATE533180T1 (de) 2007-09-14 2008-09-12 Umspritzung für eine elektronische baugruppe

Country Status (4)

Country Link
US (1) US7616448B2 (de)
EP (1) EP2191506B1 (de)
AT (1) ATE533180T1 (de)
WO (1) WO2009035681A1 (de)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004052497A1 (de) * 2004-10-28 2006-05-24 Endress + Hauser Flowtec Ag Gehäuse mit einem Anzeige- und/oder Bedienelement
AT502834B1 (de) * 2006-03-02 2007-06-15 Siemens Ag Oesterreich Elektrisches gerät mit einem auf einem schaltungsträger angeordneten kunststoffsteckerteil
DE102006036792A1 (de) * 2006-08-07 2008-02-14 Trw Automotive Gmbh Verfahren zum Herstellen eines Sensors und Sensor
US7819004B2 (en) * 2006-09-27 2010-10-26 Tk Holdings, Inc. Vehicle sensor
EP2226185B1 (de) * 2007-11-29 2017-04-26 Ngk Spark Plug Co., Ltd. Metall-harz-verbundglied
US20090268414A1 (en) * 2008-04-23 2009-10-29 Bo Lu Over-molded electronic module
JP5321806B2 (ja) * 2009-01-13 2013-10-23 株式会社リコー 画像形成装置の操作装置及び画像形成装置
US20100263900A1 (en) * 2009-04-20 2010-10-21 Divincenzo Gregory Reconfigurable full authority digital electronic control housing
US8081466B2 (en) * 2009-07-06 2011-12-20 Rockwell Automation Technologies, Inc. Overmolded electronics enclosure
JP2011100718A (ja) * 2009-10-05 2011-05-19 Yazaki Corp コネクタ
USD626958S1 (en) * 2009-10-30 2010-11-09 Spx Corporation Dongle
EP2502475B1 (de) * 2009-11-19 2018-07-04 Parker-Hannifin Corporation Leitfähige kunststoffüberform auf einem abgeschirmten kunststofffenster
US9504175B2 (en) * 2012-12-12 2016-11-22 Fourte Internatinal, Ltd. Solid-state drive housing, a solid-state disk using the same and an assembling process thereof
JP5892088B2 (ja) * 2013-03-01 2016-03-23 株式会社デンソー 車両用電子制御ユニット
KR101449271B1 (ko) * 2013-04-19 2014-10-08 현대오트론 주식회사 오버몰딩을 이용한 차량의 전자 제어 장치 및 그 제조 방법
KR101428933B1 (ko) * 2013-07-05 2014-08-08 현대오트론 주식회사 방열판을 이용한 차량의 전자 제어 장치 및 그 제조 방법
US9622355B2 (en) * 2013-07-08 2017-04-11 Delphi Technologies, Inc. Environmentally sealed electrical housing assembly with integrated connector
EP2835876A1 (de) * 2013-08-05 2015-02-11 Continental Automotive GmbH Modulgehäuse für elektronische Baugruppe
US10403801B2 (en) * 2013-11-13 2019-09-03 Rohinni, LLC Substrate insert molding with deposited light-generating sources
DE102014205744B4 (de) * 2014-01-24 2019-05-29 Eberspächer Climate Control Systems GmbH & Co. KG Steuergerät für ein Fahrzeugheizgerät
US9579511B2 (en) 2014-12-15 2017-02-28 Medtronic, Inc. Medical device with surface mounted lead connector
US9293870B1 (en) * 2015-03-10 2016-03-22 Continental Automotive Systems, Inc. Electronic control module having a cover allowing for inspection of right angle press-fit pins
DE102015209468A1 (de) * 2015-05-22 2016-11-24 Continental Teves Ag & Co. Ohg Anordnung zum Schutz von Elektronik gegenüber Störstrahlung
DE102015213405A1 (de) * 2015-07-16 2017-01-19 Conti Temic Microelectronic Gmbh Schaltungskomponententräger-Anordnung, Verfahren zu dessen Herstellung und Kombination mit einem Montagekörper
US10251297B2 (en) * 2016-12-21 2019-04-02 Robert Bosch Llc Printed circuit board housing including guiding ribs
CN207459230U (zh) * 2017-10-16 2018-06-05 富顶精密组件（深圳）有限公司 电连接器组件
JP2019192861A (ja) * 2018-04-27 2019-10-31 アイシン精機株式会社 コネクタ付きプリント基板の筐体構造
US11309676B2 (en) * 2020-05-12 2022-04-19 Tactotek Oy Integrated multilayer structure and a method for manufacturing a multilayer structure
DE102024201563B3 (de) * 2024-02-21 2025-07-03 Schaeffler Technologies AG & Co. KG Partiell umspritze Leiterplatte, Verwendung der Leiterplatte und Herstellung der Leiterplatte

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2907914B2 (ja) * 1989-01-16 1999-06-21 シーメンス、アクチエンゲゼルシヤフト 電気又は電子デバイス又はモジユールの封止方法とパツケージ
US5477426A (en) * 1993-12-15 1995-12-19 Itt Corporation IC card with board positioning means
US5861602A (en) * 1995-07-24 1999-01-19 International Business Machines Corporation Snap together PCMCIA cards with laser tack welded seams
US5548485A (en) * 1995-09-29 1996-08-20 Itt Corporation IC card rigidized cover
JP3168901B2 (ja) * 1996-02-22 2001-05-21 株式会社日立製作所 パワー半導体モジュール
JPH09315062A (ja) * 1996-03-25 1997-12-09 Mitsubishi Electric Corp Ｉｃカード
US5673181A (en) * 1996-04-23 1997-09-30 Hsu; Fu-Yu IC card assembly
US6091605A (en) * 1996-04-26 2000-07-18 Ramey; Samuel C. Memory card connector and cover apparatus and method
US6128194A (en) * 1997-08-05 2000-10-03 3Com Corporation PC card with electromagnetic and thermal management
JPH11261254A (ja) * 1998-03-13 1999-09-24 Japan Aviation Electronics Ind Ltd プリント基板の取付構造
US6180045B1 (en) * 1998-05-20 2001-01-30 Delco Electronics Corporation Method of forming an overmolded electronic assembly
JP3669224B2 (ja) 1999-09-17 2005-07-06 株式会社デンソー 電子制御機器のケース
US6307749B1 (en) * 2000-10-23 2001-10-23 Delphi Technologies, Inc. Overmolded electronic module with underfilled surface-mount components
US6565604B2 (en) * 2000-12-05 2003-05-20 F & E Gesellschaft Fur Bekleidungs-Innovation Gmbh & Co. Kg Symmetrical breast prosthesis
US6717051B2 (en) * 2001-02-21 2004-04-06 Denso Corporation Electronic control unit for use in automotive vehicle
JP4149152B2 (ja) * 2001-09-17 2008-09-10 本田技研工業株式会社 自動二輪車におけるエンジン補器類の配置構造
US6779260B1 (en) * 2003-03-28 2004-08-24 Delphi Technologies, Inc. Overmolded electronic package including circuit-carrying substrate
EP1511368B1 (de) * 2003-08-29 2015-05-20 Hirschmann Car Communication GmbH Sandwich Gehäuse für einen Antennenverstärker
JP4161860B2 (ja) * 2003-09-12 2008-10-08 国産電機株式会社 モールド形電子制御ユニット及びその製造方法
US8465175B2 (en) 2005-11-29 2013-06-18 GE Lighting Solutions, LLC LED lighting assemblies with thermal overmolding

Also Published As

Publication number Publication date
EP2191506A4 (de) 2011-01-12
WO2009035681A1 (en) 2009-03-19
US7616448B2 (en) 2009-11-10
US20090073663A1 (en) 2009-03-19
EP2191506A1 (de) 2010-06-02
EP2191506B1 (de) 2011-11-09

Similar Documents

Publication Publication Date Title
ATE533180T1 (de) Umspritzung für eine elektronische baugruppe
JP2015233164A5 (de)
WO2008093414A1 (ja) 半導体装置及びその製造方法
WO2008157143A3 (en) Edge connection structure for printed circuit boards
EP1970722A3 (de) Schutzleiterplatte für eine Sekundärbatterie
TWD143765S1 (zh) 電卡緣連接器
WO2010038179A3 (en) An oled device and an electronic circuit
GB2490072A (en) printed circuit board
TW200644343A (en) Printed circuit board, connector, and electronic device
WO2008114546A1 (ja) 配線板モジュール及び該配線板モジュールの製造方法
WO2010059977A3 (en) Solderless electronic component or capacitor mount assembly
IN2012DN05096A (de)
MY168453A (en) Engine control unit
SG170744A1 (en) Circuit board and connection substrate
EP2088841A3 (de) Umgossene elektronische Baugruppe mit Metalldichtring
TW200733824A (en) Wiring circuit board
EP2804452A3 (de) Leiterplatte und Plattenmodul
JP2008078677A5 (de)
DE502006004213D1 (de) Bauteil mit einer elektrischen Flachbaugruppe
EP2086296A3 (de) Leiterplatte und Herstellungsverfahren dafür
ATE451706T1 (de) Elektrisches/elektronisches installationsgerät
WO2012007348A3 (de) Gehäuse einer elektronischen schaltung für eine kraftstoffpumpe
TW200744431A (en) Electronic device
TWD143764S1 (zh) 電卡緣連接器
WO2008039990A3 (en) Electronic control module