ATE534143T1 - Vorrichtung zum vorheizen einer abgekühlten komponente durch wärmeleitung und/oder konvektion - Google Patents

Vorrichtung zum vorheizen einer abgekühlten komponente durch wärmeleitung und/oder konvektion

Info

Publication number
ATE534143T1
ATE534143T1 AT09155008T AT09155008T ATE534143T1 AT E534143 T1 ATE534143 T1 AT E534143T1 AT 09155008 T AT09155008 T AT 09155008T AT 09155008 T AT09155008 T AT 09155008T AT E534143 T1 ATE534143 T1 AT E534143T1
Authority
AT
Austria
Prior art keywords
heat
conducting piece
convection
preheating
heat conduction
Prior art date
Application number
AT09155008T
Other languages
English (en)
Inventor
Philippe M Oconte
Serge M Tissot
Michel M Ritondale
Original Assignee
Kontron Modular Computers
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kontron Modular Computers filed Critical Kontron Modular Computers
Application granted granted Critical
Publication of ATE534143T1 publication Critical patent/ATE534143T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Yarns And Mechanical Finishing Of Yarns Or Ropes (AREA)
  • Resistance Heating (AREA)
  • Secondary Cells (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
AT09155008T 2008-03-18 2009-03-12 Vorrichtung zum vorheizen einer abgekühlten komponente durch wärmeleitung und/oder konvektion ATE534143T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0801483A FR2929070B1 (fr) 2008-03-18 2008-03-18 Dispositif de prechauffage d'un composant refroidi par conduction et/ou par convection

Publications (1)

Publication Number Publication Date
ATE534143T1 true ATE534143T1 (de) 2011-12-15

Family

ID=39714004

Family Applications (1)

Application Number Title Priority Date Filing Date
AT09155008T ATE534143T1 (de) 2008-03-18 2009-03-12 Vorrichtung zum vorheizen einer abgekühlten komponente durch wärmeleitung und/oder konvektion

Country Status (5)

Country Link
US (1) US20090236081A1 (de)
EP (1) EP2104139B1 (de)
AT (1) ATE534143T1 (de)
CA (1) CA2659017A1 (de)
FR (1) FR2929070B1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201126125A (en) * 2010-01-22 2011-08-01 Jun-Guang Luo Heat dissipation body
FR2956280A1 (fr) 2010-02-09 2011-08-12 Kontron Modular Computers Sa Dispositif auxiliaire d'evacuation par conduction de la chaleur produite par une carte electronique
US20130319635A1 (en) * 2011-02-10 2013-12-05 Mitsubishi Electric Corporation Cooling device and power conversion device
WO2014085993A1 (en) * 2012-12-05 2014-06-12 Telefonaktiebolaget L M Ericsson (Publ) System and method for regulating temperature of electronic component
DE102013010088A1 (de) 2013-06-18 2014-12-18 VENSYS Elektrotechnik GmbH Kühlvorrichtung für ein Stromumrichtermodul
CN119268860B (zh) * 2024-11-06 2025-07-29 浙江金盾电器有限公司 一种过热保护预警装置及高低压配电柜

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4198559A (en) * 1977-12-20 1980-04-15 Clairol Incorporated Heat retaining appliance
US4696338A (en) * 1982-06-01 1987-09-29 Thermal Energy Stroage, Inc. Latent heat storage and transfer system and method
US4936377A (en) * 1986-12-11 1990-06-26 The Boeing Company Food storage cart with thermo wall
JP3224930B2 (ja) * 1993-12-28 2001-11-05 株式会社東芝 半導体装置の再生方法
US5901040A (en) * 1997-07-30 1999-05-04 Hewlett-Packard Company Heat sink and Faraday Cage assembly for a semiconductor module and a power converter
US5896259A (en) * 1997-08-05 1999-04-20 Raytheon Company Preheating device for electronic circuits
US6230790B1 (en) * 1999-05-10 2001-05-15 Lockheed Martin Corporation Thermal control system for spacecraft
US6883337B2 (en) * 2000-06-02 2005-04-26 University Of Florida Research Foundation, Inc. Thermal management device
US6452798B1 (en) * 2001-09-12 2002-09-17 Harris Corporation Electronic module including a cooling substrate having a fluid cooling circuit therein and related methods
US20030196787A1 (en) * 2002-04-19 2003-10-23 Mahoney William G. Passive thermal regulator for temperature sensitive components
US6631755B1 (en) * 2002-07-17 2003-10-14 Compal Electronics, Inc. Thermal module with temporary heat storage

Also Published As

Publication number Publication date
FR2929070A1 (fr) 2009-09-25
EP2104139A1 (de) 2009-09-23
CA2659017A1 (en) 2009-09-18
EP2104139B1 (de) 2011-11-16
US20090236081A1 (en) 2009-09-24
FR2929070B1 (fr) 2010-03-12

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