ATE534149T1 - Lichtemittierende vorrichtung - Google Patents

Lichtemittierende vorrichtung

Info

Publication number
ATE534149T1
ATE534149T1 AT05844850T AT05844850T ATE534149T1 AT E534149 T1 ATE534149 T1 AT E534149T1 AT 05844850 T AT05844850 T AT 05844850T AT 05844850 T AT05844850 T AT 05844850T AT E534149 T1 ATE534149 T1 AT E534149T1
Authority
AT
Austria
Prior art keywords
resin material
lens
recess
encapsulation member
led chip
Prior art date
Application number
AT05844850T
Other languages
English (en)
Inventor
Mikio Masui
Youji Urano
Original Assignee
Panasonic Elec Works Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Elec Works Co Ltd filed Critical Panasonic Elec Works Co Ltd
Application granted granted Critical
Publication of ATE534149T1 publication Critical patent/ATE534149T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Surgical Instruments (AREA)
AT05844850T 2005-11-21 2005-12-28 Lichtemittierende vorrichtung ATE534149T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005336192A JP4013077B2 (ja) 2005-11-21 2005-11-21 発光装置およびその製造方法
PCT/JP2005/024033 WO2007057984A1 (ja) 2005-11-21 2005-12-28 発光装置

Publications (1)

Publication Number Publication Date
ATE534149T1 true ATE534149T1 (de) 2011-12-15

Family

ID=38048376

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05844850T ATE534149T1 (de) 2005-11-21 2005-12-28 Lichtemittierende vorrichtung

Country Status (8)

Country Link
US (1) US8278678B2 (de)
EP (2) EP1953835B1 (de)
JP (1) JP4013077B2 (de)
KR (1) KR101010229B1 (de)
CN (1) CN101313415B (de)
AT (1) ATE534149T1 (de)
ES (1) ES2374927T3 (de)
WO (1) WO2007057984A1 (de)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7804147B2 (en) * 2006-07-31 2010-09-28 Cree, Inc. Light emitting diode package element with internal meniscus for bubble free lens placement
US20080029774A1 (en) * 2006-08-04 2008-02-07 Acol Technologies S.A. Semiconductor light source packages with broadband and angular uniformity support
JP5665160B2 (ja) * 2008-03-26 2015-02-04 パナソニックＩｐマネジメント株式会社 発光装置および照明器具
JP5187746B2 (ja) * 2008-06-10 2013-04-24 Ｎｅｃライティング株式会社 発光装置
JP2010095633A (ja) * 2008-10-16 2010-04-30 Omron Corp 接着方法、接着構造、光学モジュールの製造方法および光学モジュール
CN101749553B (zh) * 2008-12-11 2012-07-11 上海恒烁光电科技有限公司 Led小功率发光芯片的封装模块
US20100252853A1 (en) * 2009-03-19 2010-10-07 Christy Alexander C Thermal Energy Dissipating Arrangement for a Light Emitting Diode
JP2011018863A (ja) * 2009-07-10 2011-01-27 Sharp Corp 発光素子モジュール及びその製造方法、並びに、バックライト装置
DE102009035370A1 (de) * 2009-07-30 2011-02-03 Osram Gesellschaft mit beschränkter Haftung Lampe
US8318545B2 (en) * 2010-01-28 2012-11-27 Freescale Semiconductor, Inc. Method of making a mounted gallium nitride device
DE112011100650B4 (de) * 2010-02-24 2020-12-31 Citizen Electronics Co., Ltd. Trägerplatine und struktur von dieser
US8350453B2 (en) * 2010-05-25 2013-01-08 Nepes Led Corporation Lamp cover including a phosphor mixed structure for light emitting device
CN102299231B (zh) * 2010-06-23 2013-11-06 九江正展光电有限公司 发光二极管封装结构及其制造方法
CN103026518B (zh) * 2010-07-23 2016-04-20 京瓷株式会社 光照射设备、光照射模块以及印刷装置
CN101958390A (zh) * 2010-08-13 2011-01-26 李刚 发光芯片封装结构
JP5767062B2 (ja) * 2010-09-30 2015-08-19 日東電工株式会社 発光ダイオード封止材、および、発光ダイオード装置の製造方法
CN102447042A (zh) * 2010-10-15 2012-05-09 展晶科技(深圳)有限公司 Led封装结构及制程
CN102456804A (zh) * 2010-10-20 2012-05-16 展晶科技(深圳)有限公司 封装体、发光二极管封装结构及封装体的制造方法
EP2482333A1 (de) 2011-01-31 2012-08-01 AZURSPACE Solar Power GmbH Solarzellenempfänger
DE102011100028A1 (de) * 2011-04-29 2012-10-31 Osram Opto Semiconductors Gmbh Bauelement und Verfahren zur Herstellung eines Bauelements
CN103378252B (zh) * 2012-04-16 2016-01-06 展晶科技(深圳)有限公司 发光二极管模组
CN103375736A (zh) * 2012-04-28 2013-10-30 Ge医疗系统环球技术有限公司 Led灯及包括led灯的限束器和x射线设备
JP2014135350A (ja) * 2013-01-09 2014-07-24 Ntec Co Ltd ヒートシンク
ES2535586B2 (es) * 2014-04-22 2016-04-27 Fernando RUÍZ DE APODACA CARDEÑOSA Sistema óptico para luminarias y lámparas LED.
US10103300B2 (en) * 2014-05-21 2018-10-16 Lumileds Llc Method of attaching a lens to an LED module with high alignment accuracy
US10622522B2 (en) * 2014-09-05 2020-04-14 Theodore Lowes LED packages with chips having insulated surfaces
KR20160038568A (ko) * 2014-09-30 2016-04-07 (주)포인트엔지니어링 복수의 곡면 캐비티를 포함하는 칩 기판
CN105870307A (zh) * 2016-04-30 2016-08-17 浙江单色电子科技有限公司 一种低光衰紫光led及其制造方法
JP6297741B1 (ja) * 2017-03-31 2018-03-20 旭化成エレクトロニクス株式会社 光デバイス及びその製造方法
CN107833947B (zh) * 2017-11-28 2020-12-18 浙江清华柔性电子技术研究院 一种led封装方法
CN107819064A (zh) * 2017-11-28 2018-03-20 西安科锐盛创新科技有限公司 Led封装结构
CN107833948A (zh) * 2017-11-28 2018-03-23 西安科锐盛创新科技有限公司 Led封装结构及其方法
CN107833952A (zh) * 2017-11-28 2018-03-23 西安科锐盛创新科技有限公司 一种大功率led封装工艺
CN110179218A (zh) * 2019-06-24 2019-08-30 连云港市龙腾科技广告有限公司 一种建筑物墙面悬挂式整体内发光徽标及其制作方法
TWI790671B (zh) * 2021-07-04 2023-01-21 郭明騰 光源模組

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51120692U (de) * 1975-03-26 1976-09-30
JP3492178B2 (ja) * 1997-01-15 2004-02-03 株式会社東芝 半導体発光装置及びその製造方法
US6274890B1 (en) * 1997-01-15 2001-08-14 Kabushiki Kaisha Toshiba Semiconductor light emitting device and its manufacturing method
EP0976589A4 (de) 1997-03-18 2006-11-08 Acol Technologies S A Lumineszierende diode
US6407461B1 (en) * 1997-06-27 2002-06-18 International Business Machines Corporation Injection molded integrated circuit chip assembly
US6204523B1 (en) * 1998-11-06 2001-03-20 Lumileds Lighting, U.S., Llc High stability optical encapsulation and packaging for light-emitting diodes in the green, blue, and near UV range
JP4306846B2 (ja) * 1998-11-20 2009-08-05 株式会社朝日ラバー 照明装置
JP3349111B2 (ja) * 1999-03-15 2002-11-20 株式会社シチズン電子 表面実装型発光ダイオード及びその製造方法
JP2001085748A (ja) 1999-09-14 2001-03-30 Matsushita Electric Works Ltd 発光装置
JP2001148514A (ja) 1999-11-18 2001-05-29 Matsushita Electric Works Ltd 照明光源
US6517218B2 (en) * 2000-03-31 2003-02-11 Relume Corporation LED integrated heat sink
JP4432275B2 (ja) * 2000-07-13 2010-03-17 パナソニック電工株式会社 光源装置
US6541800B2 (en) * 2001-02-22 2003-04-01 Weldon Technologies, Inc. High power LED
US6498355B1 (en) * 2001-10-09 2002-12-24 Lumileds Lighting, U.S., Llc High flux LED array
US7224000B2 (en) * 2002-08-30 2007-05-29 Lumination, Llc Light emitting diode component
US6744077B2 (en) * 2002-09-27 2004-06-01 Lumileds Lighting U.S., Llc Selective filtering of wavelength-converted semiconductor light emitting devices
JP2004207660A (ja) 2002-12-26 2004-07-22 Toyoda Gosei Co Ltd 発光ダイオード
US6998777B2 (en) * 2002-12-24 2006-02-14 Toyoda Gosei Co., Ltd. Light emitting diode and light emitting diode array
JP4645071B2 (ja) * 2003-06-20 2011-03-09 日亜化学工業株式会社 パッケージ成型体およびそれを用いた半導体装置
JP4238693B2 (ja) * 2003-10-17 2009-03-18 豊田合成株式会社 光デバイス
JP4444609B2 (ja) * 2003-09-26 2010-03-31 スタンレー電気株式会社 Ｌｅｄランプ及び製造方法
JP4192742B2 (ja) * 2003-09-30 2008-12-10 豊田合成株式会社 発光装置
JP2005136224A (ja) * 2003-10-30 2005-05-26 Asahi Kasei Electronics Co Ltd 発光ダイオード照明モジュール
JP2005159045A (ja) * 2003-11-26 2005-06-16 Sumitomo Electric Ind Ltd 半導体発光素子搭載部材とそれを用いた発光ダイオード
US8174036B2 (en) * 2003-12-30 2012-05-08 Osram Opto Semiconductors Gmbh Lighting device
TWM268733U (en) * 2004-09-10 2005-06-21 Sen Tech Co Ltd LED packaging structure containing fluorescent plate
WO2006067885A1 (ja) * 2004-12-24 2006-06-29 Kyocera Corporation 発光装置および照明装置
WO2007004572A1 (ja) * 2005-06-30 2007-01-11 Matsushita Electric Works, Ltd. 発光装置
US7956372B2 (en) * 2005-09-20 2011-06-07 Panasonic Electric Works Co., Ltd. Light emitting device
JP5199623B2 (ja) * 2007-08-28 2013-05-15 パナソニック株式会社 発光装置

Also Published As

Publication number Publication date
EP2264797A2 (de) 2010-12-22
EP1953835B1 (de) 2011-11-16
US8278678B2 (en) 2012-10-02
WO2007057984A1 (ja) 2007-05-24
CN101313415A (zh) 2008-11-26
US20090095967A1 (en) 2009-04-16
EP1953835A4 (de) 2010-01-20
EP2264797B1 (de) 2018-04-18
JP4013077B2 (ja) 2007-11-28
KR101010229B1 (ko) 2011-01-21
EP2264797A3 (de) 2011-08-03
CN101313415B (zh) 2011-08-17
KR20080073344A (ko) 2008-08-08
ES2374927T3 (es) 2012-02-23
EP1953835A1 (de) 2008-08-06
JP2007142281A (ja) 2007-06-07

Similar Documents

Publication Publication Date Title
ATE534149T1 (de) Lichtemittierende vorrichtung
MX2010004707A (es) Dispositivo de iluminacion modular en estado solido.
CA2651040A1 (en) Embedded led light source
US9976706B2 (en) Lighting device having semiconductor light sources and a common diffusor
WO2006135496A3 (en) Led package
ATE429710T1 (de) Halbleiter-lichtemissionsbauelement, beleuchtungsmodul, beleuchtungsvorrichtung, oberflächenanbringungs-led und bullet-led
TW200742115A (en) Package module of light emitting diode
WO2008041150A3 (en) A light module package
TW200630710A (en) A light emitting diode backlight package background of the invention
ATE470242T1 (de) Verfahren zum kapseln eines lichtemittierenden bauelements und gekapselte lichtemittierende bauelemente
TW200642527A (en) OLED device having improved light output
EP2119316B8 (de) Led-modul
US20140284650A1 (en) Light-emitting diode package and method for manufacturing same
WO2009022491A1 (ja) 光素子の樹脂封止成形方法およびそれに用いられる装置
CN102052591A (zh) 固态照明灯具
SG124374A1 (en) Led assembly having overmolded lens on treated leadframe and method therefor
TW200644296A (en) Light source with glass housing
WO2009051093A1 (ja) 半導体発光モジュール
KR20100115343A (ko) Ｌｅｄ 다이를 가지는 발광체 및 그의 제조
DE602006010826D1 (de) Optoelektronisches Modul und Beleuchtungsvorrichtung mit einem solchen Modul
TW200736538A (en) Lighting device and method for directing light
WO2006117346A3 (de) Optisches modul mit integrierter lichtquelle
DE60239313D1 (de) Integrierte Kamera und Beleuchtungsvorrichtung
TW200709473A (en) Illumination system with LEDs
WO2007121198A3 (en) Light-emitting diode with low thermal resistance

Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification

Ref document number: 1953835

Country of ref document: EP