ATE534271T1 - Luftströmungsverwaltungssystem für ein elektronikchassis - Google Patents

Luftströmungsverwaltungssystem für ein elektronikchassis

Info

Publication number
ATE534271T1
ATE534271T1 AT06840129T AT06840129T ATE534271T1 AT E534271 T1 ATE534271 T1 AT E534271T1 AT 06840129 T AT06840129 T AT 06840129T AT 06840129 T AT06840129 T AT 06840129T AT E534271 T1 ATE534271 T1 AT E534271T1
Authority
AT
Austria
Prior art keywords
fans
airflow
management system
chassis
fan units
Prior art date
Application number
AT06840129T
Other languages
English (en)
Inventor
Younes Shabany
Original Assignee
Flextronics Ap Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Flextronics Ap Llc filed Critical Flextronics Ap Llc
Application granted granted Critical
Publication of ATE534271T1 publication Critical patent/ATE534271T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20554—Forced ventilation of a gaseous coolant
    • H05K7/20572—Forced ventilation of a gaseous coolant within cabinets for removing heat from sub-racks, e.g. plenum
    • H05K7/20581—Cabinets including a drawer for fans

Landscapes

  • Engineering & Computer Science (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)
  • Control Of Positive-Displacement Air Blowers (AREA)
  • Cold Air Circulating Systems And Constructional Details In Refrigerators (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Details Of Measuring And Other Instruments (AREA)
  • Ventilation (AREA)
AT06840129T 2005-12-14 2006-12-06 Luftströmungsverwaltungssystem für ein elektronikchassis ATE534271T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US75021705P 2005-12-14 2005-12-14
US11/383,153 US7430117B2 (en) 2005-12-14 2006-05-12 Airflow system for electronics chassis
PCT/US2006/061695 WO2007070758A2 (en) 2005-12-14 2006-12-06 Airflow management system for electronics chassis

Publications (1)

Publication Number Publication Date
ATE534271T1 true ATE534271T1 (de) 2011-12-15

Family

ID=38139046

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06840129T ATE534271T1 (de) 2005-12-14 2006-12-06 Luftströmungsverwaltungssystem für ein elektronikchassis

Country Status (7)

Country Link
US (1) US7430117B2 (de)
EP (1) EP1969912B1 (de)
JP (1) JP5043037B2 (de)
CN (1) CN101502194B (de)
AT (1) ATE534271T1 (de)
TW (1) TW200746985A (de)
WO (1) WO2007070758A2 (de)

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007047998A (ja) * 2005-08-09 2007-02-22 Sony Corp 電子部品冷却構造及び情報処理装置
US7573713B2 (en) * 2005-09-13 2009-08-11 Pacific Star Communications High velocity air cooling for electronic equipment
US7817589B2 (en) 2006-02-21 2010-10-19 Pacific Star Communications, Inc. Self-contained portable broadband communications system
US20090239460A1 (en) * 2006-04-27 2009-09-24 Wright Line, Llc Assembly for Extracting Heat from a Housing for Electronic Equipment
US7508664B2 (en) * 2006-07-28 2009-03-24 International Business Machines Corporation Mechanical assembly to support orthogonal airflow devices in a normal airflow slot of a server chassis
US7408774B1 (en) * 2007-03-06 2008-08-05 International Business Machines Corporation Real time adaptive active fluid flow cooling
US7430118B1 (en) 2007-06-04 2008-09-30 Yahoo! Inc. Cold row encapsulation for server farm cooling system
JP2009059033A (ja) * 2007-08-30 2009-03-19 Hitachi Ltd 記憶制御装置
US8139358B2 (en) * 2007-09-25 2012-03-20 International Business Machines Corporation Apparatus for externally changing the direction of air flowing through electronic equipment
DE502008001254D1 (de) * 2008-03-03 2010-10-14 Schroff Gmbh Gehäuse zur Aufnahme von elektronischen Steckbaugruppen
JP2010027642A (ja) * 2008-07-15 2010-02-04 Nec Tohoku Ltd 電子装置
US7643290B1 (en) 2008-07-23 2010-01-05 Cisco Technology, Inc. Techniques utilizing thermal, EMI and FIPS friendly electronic modules
WO2010018635A1 (ja) * 2008-08-14 2010-02-18 富士通株式会社 冷却方法及び計算機
JP4994503B2 (ja) * 2008-12-02 2012-08-08 株式会社日立製作所 演算処理装置
US20100159816A1 (en) * 2008-12-23 2010-06-24 International Business Machines Corporation Converging segments cooling
US10212858B2 (en) 2009-04-21 2019-02-19 Excalibur Ip, Llc Cold row encapsulation for server farm cooling system
US8054625B2 (en) 2009-04-21 2011-11-08 Yahoo! Inc. Cold row encapsulation for server farm cooling system
US20110007474A1 (en) * 2010-06-30 2011-01-13 Detore Richard E Combined computer device and facility air purification
WO2011141950A1 (en) * 2010-05-10 2011-11-17 Hitachi, Ltd. Storage apparatus
TW201206301A (en) * 2010-07-29 2012-02-01 Hon Hai Prec Ind Co Ltd Enclosure of an electronic device
US8737067B1 (en) * 2011-04-01 2014-05-27 Juniper Networks, Inc. Connectivity scheme and cooling scheme for a large rack system
CN103064481A (zh) * 2011-10-21 2013-04-24 鸿富锦精密工业（深圳）有限公司 服务器
US20130295834A1 (en) * 2012-05-07 2013-11-07 Microsoft Corporation Multi-chassis climate regulator plenum
US8885341B2 (en) * 2012-08-28 2014-11-11 Motorola Mobility Llc Compact front to back horizontal cooling for rack mounted chassis
US9204576B2 (en) * 2012-09-14 2015-12-01 Cisco Technolgy, Inc. Apparatus, system, and method for configuring a system of electronic chassis
GB2511278A (en) * 2012-11-02 2014-09-03 Greg James Compton Computing equipment enclosure
US9215831B2 (en) * 2012-11-22 2015-12-15 Huawei Technologies Co., Ltd. Heat dissipation system
US10036396B2 (en) 2013-03-08 2018-07-31 Coriant Operations, Inc. Field configurable fan operational profiles
DE102013217446A1 (de) * 2013-09-02 2015-03-05 Siemens Aktiengesellschaft Datenverarbeitungssystem
CN104717869B (zh) * 2013-12-13 2017-06-23 赛恩倍吉科技顾问（深圳）有限公司 电子装置及其散热模组
US9999161B2 (en) * 2014-12-15 2018-06-12 Intel Corporation Reversible fan assembly
US9839162B2 (en) 2015-03-09 2017-12-05 Vapor IO Inc. Cooling system for data center rack
CN105992505B (zh) * 2015-03-24 2018-06-12 杭州迪普科技股份有限公司 网络设备
US9763361B2 (en) 2015-09-14 2017-09-12 Google Inc. Blower tray
US11041500B2 (en) * 2015-09-22 2021-06-22 International Business Machines Corporation Parallel-series hybrid fan cooling apparatus and optimization
JP2018017409A (ja) * 2016-07-25 2018-02-01 株式会社富士通ゼネラル 空気調和機の室外機
US20180220551A1 (en) * 2017-01-27 2018-08-02 Vertiv Energy Systems, Inc. Telecommunications equipment enclosures having heat exchangers
US10852786B2 (en) * 2017-05-03 2020-12-01 Dell Products, L.P. Venting grate for an information handling system
JP7048146B2 (ja) * 2017-09-05 2022-04-05 Ｎｅｃプラットフォームズ株式会社 電子機器、電子機器におけるファンユニットの交換方法
US11071235B2 (en) * 2018-12-18 2021-07-20 International Business Machines Corporation Airflow balancing assembly
US11659692B2 (en) * 2019-12-20 2023-05-23 Microsoft Technology Licensing, Llc Rack assembly for vertical airflow cooled devices
JP7376368B2 (ja) * 2020-01-14 2023-11-08 株式会社三社電機製作所 電気機器
JP7463243B2 (ja) 2020-09-17 2024-04-08 株式会社東芝 電子機器
US12328131B2 (en) 2021-10-04 2025-06-10 Shure Acquisition Holdings, Inc. Airflow arrangement in a wireless audio transceiver housing
CN115968158B (zh) * 2021-10-09 2025-06-06 华为技术有限公司 一种机柜

Family Cites Families (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4502100A (en) * 1982-11-24 1985-02-26 International Business Machines Corporation Cooling system with counter flow of coolant
JPH07307962A (ja) * 1994-03-17 1995-11-21 Fujitsu Ltd 回路基板の実装構造
JP3741779B2 (ja) * 1996-06-10 2006-02-01 富士通株式会社 ファンユニット
US6496366B1 (en) * 1999-10-26 2002-12-17 Rackable Systems, Llc High density computer equipment storage system
DE20006847U1 (de) * 2000-04-13 2000-08-31 Enlight Corp., Takang Kwei-Shan, Taoyuan Leicht demontierbarer und auswechselbarer Ventilator
US6388880B1 (en) 2000-10-19 2002-05-14 Fijitsu Network Communications, Inc. Removable fan tray assembly with latching features
TW475749U (en) * 2000-10-23 2002-02-01 Delta Electronics Inc Fan plate with fast-plugging/unplugging fan body
US6592449B2 (en) * 2001-02-24 2003-07-15 International Business Machines Corporation Smart fan modules and system
US6535382B2 (en) 2001-04-12 2003-03-18 Johnson Controls Technology Company Cooling system for electronic equipment cabinets
US6690576B2 (en) * 2001-07-31 2004-02-10 Hewlett Packard Development Company, L.P. Externally mounted on-line replaceable fan module
US6714411B2 (en) 2001-12-31 2004-03-30 Hewlett-Packard Development Company, L.P. Computer server hot plug fan tray assembly and method of fan removal
US6594148B1 (en) * 2002-01-16 2003-07-15 Cisco Technology, Inc. Airflow system
US6813152B2 (en) * 2002-01-18 2004-11-02 Apw Ltd. Method for improving airflow in subrack mechanics by using a hybrid serial/parallel fan configuration
DK1367878T3 (da) * 2002-05-27 2007-05-07 Zyxel Communications Corp Varmeudstrålende ventilatormodul af den strömningsstyrende type
US6801428B2 (en) * 2002-05-31 2004-10-05 Racksaver, Inc. Rack mountable computer component fan cooling arrangement and method
DE10224273B4 (de) * 2002-05-31 2004-07-15 Fujitsu Siemens Computers Gmbh Kühlanordnung für einen Tower-PC
KR100913511B1 (ko) * 2002-05-31 2009-08-21 베라리 시스템즈, 인코포레이티드 능동 부품용 히트 싱크
US6867966B2 (en) * 2002-05-31 2005-03-15 Verari Systems, Inc. Method and apparatus for rack mounting computer components
US6961248B2 (en) * 2002-06-10 2005-11-01 Sun Microsystems, Inc. Electronics assembly
US6878874B2 (en) 2002-06-10 2005-04-12 Sun Microsystems, Inc. Electronics assembly
TW520144U (en) * 2002-06-10 2003-02-01 Delta Electronics Inc Display circuit board of a heat dissipation system
US6839233B2 (en) 2003-01-02 2005-01-04 Dell Products L.P. Removable fan bay
US6932696B2 (en) * 2003-01-08 2005-08-23 Sun Microsystems, Inc. Cooling system including redundant fan controllers
JP4012091B2 (ja) * 2003-02-20 2007-11-21 富士通株式会社 電子装置の冷却構造及び情報処理装置
US20040264145A1 (en) 2003-05-08 2004-12-30 Miller Greg F. Compact electronic component system and method
US6961242B2 (en) 2003-07-31 2005-11-01 Hewlett-Packard Development Company, L.P. System fan management based on system loading options for a system having replaceable electronics modules
US6987673B1 (en) 2003-09-09 2006-01-17 Emc Corporation Techniques for cooling a set of circuit boards within a rack mount cabinet
US6912129B2 (en) 2003-09-10 2005-06-28 Intel Corporation Chassis cooling system
US7016193B1 (en) * 2003-09-16 2006-03-21 Cisco Technology, Inc. High efficiency counter-flow shelf cooling system
US20050071689A1 (en) 2003-09-26 2005-03-31 Continuous Computing Corporation Independently powered slots architecture and method
US20050068731A1 (en) * 2003-09-29 2005-03-31 Wen Wei Hot-swap fan module configuration
TW200516208A (en) * 2003-11-14 2005-05-16 Delta Electronics Inc Contact device for hot swap fan
US7508663B2 (en) * 2003-12-29 2009-03-24 Rackable Systems, Inc. Computer rack cooling system with variable airflow impedance
US7259961B2 (en) 2004-06-24 2007-08-21 Intel Corporation Reconfigurable airflow director for modular blade chassis
US7420804B2 (en) * 2004-06-30 2008-09-02 Intel Corporation Liquid cooling system including hot-swappable components
US7209351B2 (en) 2004-06-30 2007-04-24 Intel Corporation Telecom equipment chassis using modular air cooling system
US20060203446A1 (en) * 2005-03-08 2006-09-14 Intel Corporation Fan for use in an electronic system
US7885062B2 (en) * 2005-12-09 2011-02-08 Nvidia Corporation Computer chassis with partitions for improved airflow
US8257155B2 (en) * 2006-01-20 2012-09-04 Chatsworth Products, Inc. Selectively routing air within an electronic equipment enclosure

Also Published As

Publication number Publication date
EP1969912A2 (de) 2008-09-17
US20070133168A1 (en) 2007-06-14
WO2007070758A2 (en) 2007-06-21
CN101502194B (zh) 2012-01-25
JP2009523316A (ja) 2009-06-18
EP1969912A4 (de) 2010-04-21
WO2007070758A3 (en) 2009-04-16
JP5043037B2 (ja) 2012-10-10
CN101502194A (zh) 2009-08-05
TW200746985A (en) 2007-12-16
US7430117B2 (en) 2008-09-30
EP1969912B1 (de) 2011-11-16

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