ATE534486T1 - Verfahren zum betreiben einer doppelseitenschleifmaschine sowie doppelseitenschleifmaschine - Google Patents

Verfahren zum betreiben einer doppelseitenschleifmaschine sowie doppelseitenschleifmaschine

Info

Publication number
ATE534486T1
ATE534486T1 AT09012601T AT09012601T ATE534486T1 AT E534486 T1 ATE534486 T1 AT E534486T1 AT 09012601 T AT09012601 T AT 09012601T AT 09012601 T AT09012601 T AT 09012601T AT E534486 T1 ATE534486 T1 AT E534486T1
Authority
AT
Austria
Prior art keywords
grinding machine
double side
side grinding
torque
measured
Prior art date
Application number
AT09012601T
Other languages
English (en)
Inventor
Bechtolsheim Conrad Von
Original Assignee
Wolters Peter Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wolters Peter Gmbh filed Critical Wolters Peter Gmbh
Application granted granted Critical
Publication of ATE534486T1 publication Critical patent/ATE534486T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
    • B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q15/00—Automatic control or regulation of feed movement, cutting velocity or position of tool or work
    • B23Q15/007—Automatic control or regulation of feed movement, cutting velocity or position of tool or work while the tool acts upon the workpiece
    • B23Q15/12—Adaptive control, i.e. adjusting itself to have a performance which is optimum according to a preassigned criterion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
AT09012601T 2008-11-22 2009-10-06 Verfahren zum betreiben einer doppelseitenschleifmaschine sowie doppelseitenschleifmaschine ATE534486T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102008058638A DE102008058638A1 (de) 2008-11-22 2008-11-22 Verfahren zum Betreiben einer Doppelseitenschleifmaschine sowie Doppelseitenschleifmaschine

Publications (1)

Publication Number Publication Date
ATE534486T1 true ATE534486T1 (de) 2011-12-15

Family

ID=41666601

Family Applications (1)

Application Number Title Priority Date Filing Date
AT09012601T ATE534486T1 (de) 2008-11-22 2009-10-06 Verfahren zum betreiben einer doppelseitenschleifmaschine sowie doppelseitenschleifmaschine

Country Status (3)

Country Link
EP (1) EP2189240B1 (de)
AT (1) ATE534486T1 (de)
DE (1) DE102008058638A1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011082857B4 (de) * 2011-09-16 2020-02-20 Siltronic Ag Verfahren zur gleichzeitigen beidseitigen Material abtragenden Bearbeitung wenigstens dreier Werkstücke
MY186276A (en) 2015-05-13 2021-07-02 Shinetsu Chemical Co Method for producing substrates
CN109623485B (zh) * 2019-01-24 2021-07-20 江门市奥斯龙机械有限公司 一种数控机床刀具长度补偿系统及方法
CN112192144B (zh) * 2020-10-21 2024-09-13 大连东鼎工业设备有限公司 一种风电偏航制动盘修复装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3818159A1 (de) * 1988-05-28 1989-11-30 Wolters Peter Fa Verfahren und vorrichtung zur steuerung des betriebs von hon- oder schleifmaschinen
JP2000052234A (ja) * 1998-08-11 2000-02-22 Sony Corp 研磨装置
US6623334B1 (en) * 1999-05-05 2003-09-23 Applied Materials, Inc. Chemical mechanical polishing with friction-based control
US6967166B2 (en) * 2002-04-12 2005-11-22 Asm Nutool, Inc. Method for monitoring and controlling force applied on workpiece surface during electrochemical mechanical processing
US7052371B2 (en) * 2003-05-29 2006-05-30 Tbw Industries Inc. Vacuum-assisted pad conditioning system and method utilizing an apertured conditioning disk
JP5245319B2 (ja) * 2007-08-09 2013-07-24 富士通株式会社 研磨装置及び研磨方法、基板及び電子機器の製造方法

Also Published As

Publication number Publication date
DE102008058638A1 (de) 2010-05-27
EP2189240B1 (de) 2011-11-23
EP2189240A1 (de) 2010-05-26

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