ATE534946T1 - Optoelektronisches modul, das mit mindestens einem fotorezeptor-schaltkreis ausgestattet ist - Google Patents

Optoelektronisches modul, das mit mindestens einem fotorezeptor-schaltkreis ausgestattet ist

Info

Publication number
ATE534946T1
ATE534946T1 AT08150841T AT08150841T ATE534946T1 AT E534946 T1 ATE534946 T1 AT E534946T1 AT 08150841 T AT08150841 T AT 08150841T AT 08150841 T AT08150841 T AT 08150841T AT E534946 T1 ATE534946 T1 AT E534946T1
Authority
AT
Austria
Prior art keywords
photoreceptor circuit
optoelectronic module
module equipped
former
connection terminals
Prior art date
Application number
AT08150841T
Other languages
English (en)
Inventor
Victorio Quercia
Andre Grandjean
Abdul-Hamid Kayal
Original Assignee
Em Microelectronic Marin Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Em Microelectronic Marin Sa filed Critical Em Microelectronic Marin Sa
Application granted granted Critical
Publication of ATE534946T1 publication Critical patent/ATE534946T1/de

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/0304—Detection arrangements using opto-electronic means
    • G06F3/0317—Detection arrangements using opto-electronic means in co-operation with a patterned surface, e.g. absolute position or relative movement detection for an optical mouse or pen positioned with respect to a coded surface
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/033—Pointing devices displaced or positioned by the user, e.g. mice, trackballs, pens or joysticks; Accessories therefor
    • G06F3/0354—Pointing devices displaced or positioned by the user, e.g. mice, trackballs, pens or joysticks; Accessories therefor with detection of two-dimensional [2D] relative movements between the device, or an operating part thereof, and a plane or surface, e.g. 2D mice, trackballs, pens or pucks
    • G06F3/03543—Mice or pucks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Position Input By Displaying (AREA)
  • Combinations Of Printed Boards (AREA)
  • Switches Operated By Changes In Physical Conditions (AREA)
  • Power Sources (AREA)
AT08150841T 2007-02-22 2008-01-30 Optoelektronisches modul, das mit mindestens einem fotorezeptor-schaltkreis ausgestattet ist ATE534946T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH00308/07A CH713513B1 (fr) 2007-02-22 2007-02-22 Module optoélectronique muni d'au moins un circuit photorécepteur.

Publications (1)

Publication Number Publication Date
ATE534946T1 true ATE534946T1 (de) 2011-12-15

Family

ID=39375590

Family Applications (1)

Application Number Title Priority Date Filing Date
AT08150841T ATE534946T1 (de) 2007-02-22 2008-01-30 Optoelektronisches modul, das mit mindestens einem fotorezeptor-schaltkreis ausgestattet ist

Country Status (6)

Country Link
US (1) US8183521B2 (de)
EP (1) EP1962173B1 (de)
CN (1) CN101252109B (de)
AT (1) ATE534946T1 (de)
CH (1) CH713513B1 (de)
TW (1) TWI447612B (de)

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CN101995965B (zh) * 2009-08-26 2012-10-24 华信光电科技股份有限公司 光学装置
US8791489B2 (en) * 2012-04-05 2014-07-29 Heptagon Micro Optics Pte. Ltd. Opto-electronic module
US9063005B2 (en) 2012-04-05 2015-06-23 Heptagon Micro Optics Pte. Ltd. Reflowable opto-electronic module
TWI471584B (zh) * 2012-12-24 2015-02-01 Qisda Corp 遙控感測模組
TWI498585B (zh) * 2013-03-12 2015-09-01 光學距離感測裝置及其組裝方法
CN103327730A (zh) * 2013-05-23 2013-09-25 上海摩软通讯技术有限公司 具有感光功能的电子设备、柔性线路板及插座
US9529079B1 (en) 2015-03-26 2016-12-27 Google Inc. Multiplexed multichannel photodetector
JP6579316B2 (ja) * 2015-09-16 2019-09-25 セイコープレシジョン株式会社 羽根駆動装置および光学機器
US10410760B2 (en) * 2016-01-11 2019-09-10 Raytheon Company Rigid-flex assembly for high-speed sensor module comprising a flexible wiring section with dual flexible strips stacked and attached together
CN111123238A (zh) * 2018-10-31 2020-05-08 三赢科技（深圳）有限公司 镜头模组及应用其的电子设备
CN113552959B (zh) * 2021-08-17 2025-07-04 珀吉有限责任公司 一种光电ic位置可调节的鼠标

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JPH0665788B2 (ja) * 1989-07-18 1994-08-24 住友ベークライト株式会社 遮音床材
US5285062A (en) * 1992-04-14 1994-02-08 Hoetron, Inc. Laser/detector hybrid with mirror source and diffracted return beam
US5783818A (en) * 1995-05-08 1998-07-21 Matsushita Electric Industrial Co., Ltd. Integrated type optical pickup having packaging with gas-tight seal
US7375757B1 (en) 1999-09-03 2008-05-20 Sony Corporation Imaging element, imaging device, camera module and camera system
JP3738824B2 (ja) * 2000-12-26 2006-01-25 セイコーエプソン株式会社 光学装置及びその製造方法並びに電子機器
GB2373633B (en) * 2001-03-20 2005-02-02 Mitel Semiconductor Ab Optical carrier
EP1271395A1 (de) * 2001-06-13 2003-01-02 EM Microelectronic-Marin SA Vorrichtung zur Detektion der Verschiebung einer Oberfäche eines Objektes
US6661410B2 (en) * 2001-09-07 2003-12-09 Microsoft Corporation Capacitive sensing and data input device power management
US20050018978A1 (en) * 2001-12-21 2005-01-27 Tyco Electronics Corporation Opto-electric module and method of assembling
US20030142075A1 (en) * 2002-01-29 2003-07-31 Unity Opto Technology Co., Ltd. Modulated optical mouse for a personal computer
EP1339012B1 (de) 2002-02-14 2013-10-16 Unity Opto Technology Co., Ltd. Modulare optische Maus für ein Personal-Rechner
US20030201951A1 (en) 2002-04-25 2003-10-30 Unity Opto Technology Co., Ltd. Wireless optic mouse
KR100718421B1 (ko) 2002-06-28 2007-05-14 교세라 가부시키가이샤 소형 모듈 카메라, 카메라 모듈, 카메라 모듈 제조 방법 및 촬상 소자의 패키징 방법
JP3867785B2 (ja) * 2002-10-15 2007-01-10 セイコーエプソン株式会社 光モジュール
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KR100784883B1 (ko) * 2005-03-04 2007-12-14 정현주 광좌표 입력장치, 광센서 모듈 및 그 조립방법

Also Published As

Publication number Publication date
EP1962173A1 (de) 2008-08-27
TWI447612B (zh) 2014-08-01
TW200907763A (en) 2009-02-16
CN101252109A (zh) 2008-08-27
CN101252109B (zh) 2011-11-16
EP1962173B1 (de) 2011-11-23
US8183521B2 (en) 2012-05-22
CH713513B1 (fr) 2018-08-31
US20080204416A1 (en) 2008-08-28

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