ATE535017T1 - Hochleistungshalbleitergehäuse mit zweiseitiger kühlung - Google Patents

Hochleistungshalbleitergehäuse mit zweiseitiger kühlung

Info

Publication number
ATE535017T1
ATE535017T1 AT08153955T AT08153955T ATE535017T1 AT E535017 T1 ATE535017 T1 AT E535017T1 AT 08153955 T AT08153955 T AT 08153955T AT 08153955 T AT08153955 T AT 08153955T AT E535017 T1 ATE535017 T1 AT E535017T1
Authority
AT
Austria
Prior art keywords
substrate
circuit board
heat sink
upper substrate
double
Prior art date
Application number
AT08153955T
Other languages
English (en)
Inventor
Todd P Oman
Original Assignee
Delphi Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delphi Tech Inc filed Critical Delphi Tech Inc
Application granted granted Critical
Publication of ATE535017T1 publication Critical patent/ATE535017T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H10W74/117—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations the substrate having spherical bumps for external connection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07354—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/341—Dispositions of die-attach connectors, e.g. layouts
    • H10W72/347—Dispositions of multiple die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
AT08153955T 2007-05-03 2008-04-02 Hochleistungshalbleitergehäuse mit zweiseitiger kühlung ATE535017T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/799,916 US7659615B2 (en) 2007-05-03 2007-05-03 High power package with dual-sided heat sinking

Publications (1)

Publication Number Publication Date
ATE535017T1 true ATE535017T1 (de) 2011-12-15

Family

ID=39640945

Family Applications (1)

Application Number Title Priority Date Filing Date
AT08153955T ATE535017T1 (de) 2007-05-03 2008-04-02 Hochleistungshalbleitergehäuse mit zweiseitiger kühlung

Country Status (3)

Country Link
US (1) US7659615B2 (de)
EP (1) EP1988571B1 (de)
AT (1) ATE535017T1 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7706144B2 (en) * 2007-12-17 2010-04-27 Lynch Thomas W Heat dissipation system and related method
US8730408B2 (en) * 2011-06-02 2014-05-20 Sharp Kabushiki Kaisha Lighting device, display device, and television receiver
US8514576B1 (en) * 2011-06-14 2013-08-20 Juniper Networks, Inc. Dual sided system in a package
JP5168393B2 (ja) * 2011-08-18 2013-03-21 第一精工株式会社 基板用端子及び基板用コネクタ
US9391029B2 (en) * 2014-06-12 2016-07-12 Kabushiki Kaisha Toshiba Electronic device
US9693488B2 (en) * 2015-02-13 2017-06-27 Deere & Company Electronic assembly with one or more heat sinks
CA2978795A1 (en) 2015-03-16 2016-09-22 Dana Canada Corporation Heat exchangers with plates having surface patterns for enhancing flatness and methods for manufacturing same
US12087659B2 (en) * 2020-08-28 2024-09-10 Delphi Technologies Ip Limited Electronic power package and heat sink/cold rail arrangement
JP7675595B2 (ja) * 2021-08-18 2025-05-13 三菱電機株式会社 半導体モジュール
US12150236B2 (en) 2022-05-12 2024-11-19 Infineon Technologies Austria Ag Voltage regulator module with inductor-cooled power stage
US12532737B2 (en) 2022-05-12 2026-01-20 Infineon Technologies Ag Semiconductor device package thermally coupled to passive element
US12431367B2 (en) 2023-03-17 2025-09-30 Infineon Technologies Ag Embedded package with shielding pad
US12575023B2 (en) 2023-03-17 2026-03-10 Infineon Technologies Austria Ag Voltage regulator module having a power stage

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW373308B (en) * 1995-02-24 1999-11-01 Agere Systems Inc Thin packaging of multi-chip modules with enhanced thermal/power management
US6075700A (en) * 1999-02-02 2000-06-13 Compaq Computer Corporation Method and system for controlling radio frequency radiation in microelectronic packages using heat dissipation structures
US6219243B1 (en) * 1999-12-14 2001-04-17 Intel Corporation Heat spreader structures for enhanced heat removal from both sides of chip-on-flex packaged units
US6490161B1 (en) * 2002-01-08 2002-12-03 International Business Machines Corporation Peripheral land grid array package with improved thermal performance
DE10231091A1 (de) * 2002-07-10 2004-01-22 Robert Bosch Gmbh Aktivgleichrichter-Modul für Drehstromgeneratoren von Fahrzeugen
DE10303103B4 (de) * 2003-01-28 2009-07-09 Ixys Semiconductor Gmbh Halbleiterbauteil, insbesondere Leistungshalbleiterbauteil
US7268425B2 (en) * 2003-03-05 2007-09-11 Intel Corporation Thermally enhanced electronic flip-chip packaging with external-connector-side die and method
US7005734B2 (en) * 2003-05-05 2006-02-28 Ixys Corporation Double-sided cooling isolated packaged power semiconductor device
DE10329101A1 (de) * 2003-06-27 2005-01-27 eupec Europäische Gesellschaft für Leistungshalbleiter mbH Halbleiteranordnung und Verfahren zum Herstellen einer Halbleiteranordnung
US7002247B2 (en) * 2004-06-18 2006-02-21 International Business Machines Corporation Thermal interposer for thermal management of semiconductor devices
US7538424B2 (en) * 2004-07-08 2009-05-26 Rambus Inc. System and method for dissipating heat from a semiconductor module
US7235880B2 (en) * 2004-09-01 2007-06-26 Intel Corporation IC package with power and signal lines on opposing sides
DE102004050792A1 (de) * 2004-10-19 2006-04-20 Robert Bosch Gmbh Bauelemente-Modul für Hochtemperaturanwendungen und Verfahren zum Herstellen eines derartigen Bauelemente-Moduls

Also Published As

Publication number Publication date
EP1988571A2 (de) 2008-11-05
EP1988571B1 (de) 2011-11-23
EP1988571A3 (de) 2010-07-21
US7659615B2 (en) 2010-02-09
US20080272483A1 (en) 2008-11-06

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