ATE536735T1 - Verfahren zur bildung einer lotschicht auf einer leiterplatte und schlammentladungsvorrichtung - Google Patents

Verfahren zur bildung einer lotschicht auf einer leiterplatte und schlammentladungsvorrichtung

Info

Publication number
ATE536735T1
ATE536735T1 AT10006438T AT10006438T ATE536735T1 AT E536735 T1 ATE536735 T1 AT E536735T1 AT 10006438 T AT10006438 T AT 10006438T AT 10006438 T AT10006438 T AT 10006438T AT E536735 T1 ATE536735 T1 AT E536735T1
Authority
AT
Austria
Prior art keywords
tank
slurry
forming
solder layer
circuit board
Prior art date
Application number
AT10006438T
Other languages
English (en)
Inventor
Takashi Shoji
Takekazu Sakai
Original Assignee
Showa Denko Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko Kk filed Critical Showa Denko Kk
Application granted granted Critical
Publication of ATE536735T1 publication Critical patent/ATE536735T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3485—Application of solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0638—Solder feeding devices for viscous material feeding, e.g. solder paste feeding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
    • H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
AT10006438T 2006-10-17 2007-10-12 Verfahren zur bildung einer lotschicht auf einer leiterplatte und schlammentladungsvorrichtung ATE536735T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006282328 2006-10-17

Publications (1)

Publication Number Publication Date
ATE536735T1 true ATE536735T1 (de) 2011-12-15

Family

ID=39314101

Family Applications (2)

Application Number Title Priority Date Filing Date
AT10006438T ATE536735T1 (de) 2006-10-17 2007-10-12 Verfahren zur bildung einer lotschicht auf einer leiterplatte und schlammentladungsvorrichtung
AT07830129T ATE543374T1 (de) 2006-10-17 2007-10-12 Schlämmenabgabeeinrichtung

Family Applications After (1)

Application Number Title Priority Date Filing Date
AT07830129T ATE543374T1 (de) 2006-10-17 2007-10-12 Schlämmenabgabeeinrichtung

Country Status (8)

Country Link
US (1) US20100009070A1 (de)
EP (2) EP2082630B1 (de)
JP (1) JP5001113B2 (de)
KR (1) KR101108960B1 (de)
CN (1) CN101536620B (de)
AT (2) ATE536735T1 (de)
TW (1) TWI411363B (de)
WO (1) WO2008047888A1 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4576270B2 (ja) * 2005-03-29 2010-11-04 昭和電工株式会社 ハンダ回路基板の製造方法
US20090041990A1 (en) * 2005-09-09 2009-02-12 Showa Denko K.K. Method for attachment of solder powder to electronic circuit board and soldered electronic circuit board
JP4920401B2 (ja) * 2006-12-27 2012-04-18 昭和電工株式会社 導電性回路基板の製造方法
JP6285909B2 (ja) * 2013-03-14 2018-02-28 武蔵エンジニアリング株式会社 液体材料吐出装置、その塗布装置および塗布方法
CN106425004A (zh) * 2016-10-18 2017-02-22 成都言行果科技有限公司 电子设备熔接装置的多点位焊料送料装置
CN106363267A (zh) * 2016-10-18 2017-02-01 成都言行果科技有限公司 电子设备熔接装置的过滤型焊料送料装置
US11766729B2 (en) * 2017-09-28 2023-09-26 International Business Machines Corporation Molten solder injection head with vacuum filter and differential gauge system
CN110557897A (zh) * 2019-10-09 2019-12-10 新野县立新电子有限公司 一种环保印刷线路板生产工艺
JP7336491B2 (ja) * 2020-09-25 2023-08-31 株式会社タムラ製作所 プリント配線基板の表面処理方法、およびプリント配線基板の製造方法

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1986000842A1 (en) * 1984-07-18 1986-02-13 American Telephone & Telegraph Company Method and apparatus for multipoint dispensing of viscous material
US4572103A (en) * 1984-12-20 1986-02-25 Engel Harold J Solder paste dispenser for SMD circuit boards
JPS61155075U (de) * 1985-03-12 1986-09-26
JPH03152A (ja) * 1989-05-24 1991-01-07 Sanyo Electric Co Ltd 塗布装置
DE4092642C1 (de) * 1990-07-10 1995-11-23 Musashi Engineering Inc Flüssigkeitsausgabevorrichtung
US6476487B2 (en) * 1992-10-30 2002-11-05 Showa Denko K.K. Solder circuit
JP2592757B2 (ja) 1992-10-30 1997-03-19 昭和電工株式会社 はんだ回路基板及びその形成方法
US5346118A (en) * 1993-09-28 1994-09-13 At&T Bell Laboratories Surface mount solder assembly of leadless integrated circuit packages to substrates
JPH11163501A (ja) * 1997-12-02 1999-06-18 Rohm Co Ltd 電子部品の実装方法、およびその方法によって製造された電子回路装置
JP2000062138A (ja) 1998-08-19 2000-02-29 Matsushita Electric Ind Co Ltd 印刷装置
US6386433B1 (en) * 1999-08-24 2002-05-14 Kulicke & Soffa Investments, Inc. Solder ball delivery and reflow apparatus and method
US6873268B2 (en) * 2000-01-21 2005-03-29 Medtronic Minimed, Inc. Microprocessor controlled ambulatory medical apparatus with hand held communication device
SE518642C2 (sv) * 2000-07-11 2002-11-05 Mydata Automation Ab Förfarande, anordning för att förse ett substrat med visköst medium, anordning för korrigering av applikationsfel samt användningen av utskjutnings- organ för korrigering av appliceringsfel
JP2003000152A (ja) * 2001-06-25 2003-01-07 Mitsubishi Heavy Ind Ltd ソフトクリームフリーザ
JP2004221378A (ja) * 2003-01-16 2004-08-05 Matsushita Electric Ind Co Ltd 電子部品の実装方法
EP1624521B1 (de) * 2003-03-31 2013-04-24 Tokyo Gas Company Limited Verfahren zur herstellung eines festoxid-brennstoffzellenmoduls
TWI259626B (en) * 2004-06-11 2006-08-01 Hon Hai Prec Ind Co Ltd Electrical card connector
US7381371B2 (en) * 2004-01-16 2008-06-03 Heathrow Scientific Llc Pipette device with pivotable nozzle assembly
JP2006064545A (ja) * 2004-08-27 2006-03-09 Mitsubishi Chemicals Corp 流体吐出機構及び流体吐出方法並びに流体分注装置
JP4688475B2 (ja) * 2004-11-15 2011-05-25 株式会社タムラ製作所 はんだ材料供給装置及びこれを用いたはんだ材料供給方法
JP4576270B2 (ja) * 2005-03-29 2010-11-04 昭和電工株式会社 ハンダ回路基板の製造方法
JP4670436B2 (ja) 2005-03-31 2011-04-13 株式会社豊田自動織機 産業車両のヘッドガード
TWM275090U (en) * 2005-04-22 2005-09-11 Neng-Kuei Ye Low speed material supply device for mixing materials
US20090041990A1 (en) * 2005-09-09 2009-02-12 Showa Denko K.K. Method for attachment of solder powder to electronic circuit board and soldered electronic circuit board

Also Published As

Publication number Publication date
ATE543374T1 (de) 2012-02-15
JP2008124447A (ja) 2008-05-29
TWI411363B (zh) 2013-10-01
EP2237651A1 (de) 2010-10-06
EP2082630B1 (de) 2012-01-25
CN101536620B (zh) 2011-04-06
US20100009070A1 (en) 2010-01-14
KR101108960B1 (ko) 2012-01-31
EP2237651B1 (de) 2011-12-07
EP2082630A1 (de) 2009-07-29
JP5001113B2 (ja) 2012-08-15
TW200838374A (en) 2008-09-16
WO2008047888A1 (en) 2008-04-24
EP2082630A4 (de) 2009-12-30
KR20090079902A (ko) 2009-07-22
CN101536620A (zh) 2009-09-16

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