ATE540087T1 - Zusammensetzung für wärmehärtbares silikonharz - Google Patents

Zusammensetzung für wärmehärtbares silikonharz

Info

Publication number
ATE540087T1
ATE540087T1 AT10155492T AT10155492T ATE540087T1 AT E540087 T1 ATE540087 T1 AT E540087T1 AT 10155492 T AT10155492 T AT 10155492T AT 10155492 T AT10155492 T AT 10155492T AT E540087 T1 ATE540087 T1 AT E540087T1
Authority
AT
Austria
Prior art keywords
composition
silicone resin
thermosetting silicone
heat current
photosemiconductor
Prior art date
Application number
AT10155492T
Other languages
English (en)
Inventor
Hiroyuki Katayama
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Application granted granted Critical
Publication of ATE540087T1 publication Critical patent/ATE540087T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/045—Polysiloxanes containing less than 25 silicon atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Led Device Packages (AREA)
AT10155492T 2009-03-04 2010-03-04 Zusammensetzung für wärmehärtbares silikonharz ATE540087T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009050995A JP2010202801A (ja) 2009-03-04 2009-03-04 熱硬化性シリコーン樹脂用組成物

Publications (1)

Publication Number Publication Date
ATE540087T1 true ATE540087T1 (de) 2012-01-15

Family

ID=42060478

Family Applications (1)

Application Number Title Priority Date Filing Date
AT10155492T ATE540087T1 (de) 2009-03-04 2010-03-04 Zusammensetzung für wärmehärtbares silikonharz

Country Status (6)

Country Link
US (1) US8198380B2 (de)
EP (1) EP2226361B1 (de)
JP (1) JP2010202801A (de)
KR (1) KR20100100662A (de)
CN (1) CN101824221B (de)
AT (1) ATE540087T1 (de)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011042760A (ja) * 2009-08-24 2011-03-03 Nitto Denko Corp 熱硬化性シリコーン樹脂用組成物
US8035236B2 (en) * 2009-10-16 2011-10-11 The Regents Of The University Of California Semiconductor device comprising high performance encapsulation resins
FR2957604A1 (fr) * 2010-03-22 2011-09-23 Bluestar Silicones France Composition silicone reticulable pour la realisation de revetements anti-adherents pour supports souples et additif promoteur d'accrochage contenu dans cette composition
JP5523376B2 (ja) * 2011-03-03 2014-06-18 新日鉄住金化学株式会社 エポキシシリコーン樹脂及びそれを用いた硬化性樹脂組成物
CN103619958B (zh) * 2011-03-28 2016-06-29 汉高股份有限及两合公司 用于led封装的可固化的硅树脂
JP5827864B2 (ja) * 2011-06-14 2015-12-02 日東電工株式会社 封止用シートおよび光半導体素子装置
US9153755B2 (en) 2011-10-18 2015-10-06 Nitto Denko Corporation Silicone resin sheet, cured sheet, and light emitting diode device and producing method thereof
US9349927B2 (en) 2011-10-18 2016-05-24 Nitto Denko Corporation Encapsulating sheet and optical semiconductor element device
JP5545601B2 (ja) 2011-11-07 2014-07-09 信越化学工業株式会社 蛍光体高充填波長変換シート、それを用いた発光半導体装置の製造方法、及び該発光半導体装置
US8907362B2 (en) 2012-01-24 2014-12-09 Cooledge Lighting Inc. Light-emitting dies incorporating wavelength-conversion materials and related methods
US8896010B2 (en) 2012-01-24 2014-11-25 Cooledge Lighting Inc. Wafer-level flip chip device packages and related methods
US20130187540A1 (en) 2012-01-24 2013-07-25 Michael A. Tischler Discrete phosphor chips for light-emitting devices and related methods
DE102012104363A1 (de) 2012-05-21 2013-11-21 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zu dessen Herstellung
EP2882796B1 (de) * 2012-06-06 2017-03-01 Henkel IP & Holding GmbH Vinylcarbosiloxanharze
TWI570160B (zh) * 2012-09-04 2017-02-11 新日鐵住金化學股份有限公司 Epoxy silicone resin and a hardened resin composition using the same
US20150267052A1 (en) 2012-09-28 2015-09-24 Osram Sylvania Inc. Polycyclic polysiloxane composition and led containing same
US9343443B2 (en) 2014-02-05 2016-05-17 Cooledge Lighting, Inc. Light-emitting dies incorporating wavelength-conversion materials and related methods
KR102171024B1 (ko) 2014-06-16 2020-10-29 삼성전자주식회사 반도체 발광소자 패키지의 제조 방법
JP6479862B2 (ja) * 2014-06-24 2019-03-06 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェンＨｅｎｋｅｌ ＡＧ ＆ Ｃｏ． ＫＧａＡ 一成分型のｕｖおよび熱硬化高温剥離可能な接着剤
PL3023467T3 (pl) * 2014-11-20 2017-10-31 Byk Chemie Gmbh Masa do formowania, termoplast lub środek powłokowy zawierający polisiloksany jako dodatki antyadhezyjne i odpychające zanieczyszczenia
DE102016115907A1 (de) * 2016-08-26 2018-03-01 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements
WO2019088066A1 (ja) * 2017-10-31 2019-05-09 ダウ・東レ株式会社 オルガノポリシロキサン組成物、並びにこれから作製される半硬化物および硬化物
WO2019088067A1 (ja) * 2017-10-31 2019-05-09 ダウ・東レ株式会社 オルガノポリシロキサン硬化物を製造する方法、オルガノポリシロキサン硬化物、積層体、および光学部品
KR102868635B1 (ko) * 2021-02-18 2025-10-13 동우 화인켐 주식회사 광경화성 잉크 조성물, 봉지층 및 화상표시장치

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6451467A (en) * 1987-08-21 1989-02-27 Toray Silicone Co Curable resin composition
JP2511348B2 (ja) * 1991-10-17 1996-06-26 東レ・ダウコーニング・シリコーン株式会社 オルガノポリシロキサンおよびその製造方法
US5397813A (en) * 1993-11-12 1995-03-14 General Electric Company Premium release UV curable epoxysilicone compositions
JP3523098B2 (ja) 1998-12-28 2004-04-26 信越化学工業株式会社 付加硬化型シリコーン組成物
AU2001286860A1 (en) * 2000-08-28 2002-03-13 Aprilis, Inc. Holographic storage medium comprising polyfunctional epoxy monomers capable of undergoing cationic polymerization
AU2003231175A1 (en) 2002-05-01 2003-11-17 Dow Corning Corporation Compositions having improved bath life
JP2004186168A (ja) 2002-11-29 2004-07-02 Shin Etsu Chem Co Ltd 発光ダイオード素子用シリコーン樹脂組成物
JP4648099B2 (ja) * 2005-06-07 2011-03-09 信越化学工業株式会社 ダイボンディング用シリコーン樹脂組成物
JP5138924B2 (ja) 2006-12-14 2013-02-06 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 光半導体封止用シリコーンゴム組成物および光半導体装置
WO2009021249A2 (en) * 2007-10-29 2009-02-12 Dow Corning Corporation Polar polydimethylsiloxane molds, methods of making the molds, and methods of using the molds for pattern transfer
JP4680274B2 (ja) * 2008-03-10 2011-05-11 信越化学工業株式会社 高硬度シリコーンゴムを与える組成物およびそれを封止材として用いた半導体装置
JP2009256400A (ja) * 2008-04-11 2009-11-05 Shin Etsu Chem Co Ltd 半導体素子用シリコーン接着剤
JP5188928B2 (ja) * 2008-10-24 2013-04-24 株式会社Ａｄｅｋａ ケイ素含有硬化性組成物
JP5566036B2 (ja) * 2009-02-02 2014-08-06 日東電工株式会社 熱硬化性シリコーン樹脂用組成物
JP5566088B2 (ja) * 2008-12-12 2014-08-06 日東電工株式会社 熱硬化性シリコーン樹脂用組成物
JP4913858B2 (ja) * 2009-04-14 2012-04-11 日東電工株式会社 熱硬化性シリコーン樹脂用組成物

Also Published As

Publication number Publication date
CN101824221A (zh) 2010-09-08
EP2226361A1 (de) 2010-09-08
US20100225010A1 (en) 2010-09-09
EP2226361B1 (de) 2012-01-04
KR20100100662A (ko) 2010-09-15
JP2010202801A (ja) 2010-09-16
US8198380B2 (en) 2012-06-12
CN101824221B (zh) 2013-04-03

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