ATE543148T1 - Hohes durchsatzbild für das bildüberprüfungverfahren - Google Patents

Hohes durchsatzbild für das bildüberprüfungverfahren

Info

Publication number
ATE543148T1
ATE543148T1 AT05741734T AT05741734T ATE543148T1 AT E543148 T1 ATE543148 T1 AT E543148T1 AT 05741734 T AT05741734 T AT 05741734T AT 05741734 T AT05741734 T AT 05741734T AT E543148 T1 ATE543148 T1 AT E543148T1
Authority
AT
Austria
Prior art keywords
buses
specimen
image
high throughput
sup
Prior art date
Application number
AT05741734T
Other languages
English (en)
Inventor
Lawrence Miller
Original Assignee
Kla Tencor Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kla Tencor Tech Corp filed Critical Kla Tencor Tech Corp
Application granted granted Critical
Publication of ATE543148T1 publication Critical patent/ATE543148T1/de

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
    • G01N2021/95615—Inspecting patterns on the surface of objects using a comparative method with stored comparision signal
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95676—Masks, reticles, shadow masks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Image Processing (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
AT05741734T 2004-05-04 2005-05-02 Hohes durchsatzbild für das bildüberprüfungverfahren ATE543148T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US56833504P 2004-05-04 2004-05-04
US10/860,617 US7215808B2 (en) 2004-05-04 2004-06-02 High throughout image for processing inspection images
PCT/US2005/015206 WO2005109317A2 (en) 2004-05-04 2005-05-02 High throughput image for processing inspection images

Publications (1)

Publication Number Publication Date
ATE543148T1 true ATE543148T1 (de) 2012-02-15

Family

ID=35239487

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05741734T ATE543148T1 (de) 2004-05-04 2005-05-02 Hohes durchsatzbild für das bildüberprüfungverfahren

Country Status (5)

Country Link
US (1) US7215808B2 (de)
EP (1) EP1743278B1 (de)
JP (1) JP4909888B2 (de)
AT (1) ATE543148T1 (de)
WO (1) WO2005109317A2 (de)

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DE102007060355A1 (de) 2007-12-12 2009-06-25 Vistec Semiconductor Systems Gmbh Verfahren und Vorrichtung zur Verarbeitung der von mindestens einer Kamera aufgenommenen Bilddaten der Oberfläche eines Wafers
US8139840B1 (en) 2008-04-10 2012-03-20 Kla-Tencor Corporation Inspection system and method for high-speed serial data transfer
US8094924B2 (en) * 2008-12-15 2012-01-10 Hermes-Microvision, Inc. E-beam defect review system
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US9235885B2 (en) * 2013-01-31 2016-01-12 Applied Materials Israel Ltd System, a method and a computer program product for patch-based defect detection
JP6767107B2 (ja) * 2015-12-07 2020-10-14 株式会社トプコン 角度検出装置及び測量装置
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US11222799B2 (en) * 2017-10-18 2022-01-11 Kla Corporation Swath selection for semiconductor inspection
CN113436133B (zh) * 2020-03-23 2022-05-31 长鑫存储技术有限公司 晶圆量测方法、装置及计算机可读存储介质

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Also Published As

Publication number Publication date
EP1743278B1 (de) 2012-01-25
JP2007536629A (ja) 2007-12-13
JP4909888B2 (ja) 2012-04-04
WO2005109317A2 (en) 2005-11-17
EP1743278A2 (de) 2007-01-17
WO2005109317A3 (en) 2006-11-09
US7215808B2 (en) 2007-05-08
EP1743278A4 (de) 2011-06-22
US20050249395A1 (en) 2005-11-10

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