ATE543372T1 - Flexible leiterplatte und herstellungsverfahren dafür - Google Patents

Flexible leiterplatte und herstellungsverfahren dafür

Info

Publication number
ATE543372T1
ATE543372T1 AT09171657T AT09171657T ATE543372T1 AT E543372 T1 ATE543372 T1 AT E543372T1 AT 09171657 T AT09171657 T AT 09171657T AT 09171657 T AT09171657 T AT 09171657T AT E543372 T1 ATE543372 T1 AT E543372T1
Authority
AT
Austria
Prior art keywords
signal wire
circuit board
production method
flexible circuit
disposed
Prior art date
Application number
AT09171657T
Other languages
English (en)
Inventor
Chung-Lun Wu
Fu-An Chu
Ja-Ee Li
Original Assignee
Htc Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Htc Corp filed Critical Htc Corp
Application granted granted Critical
Publication of ATE543372T1 publication Critical patent/ATE543372T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H05K1/0221—Coaxially shielded signal lines comprising a continuous shielding layer partially or wholly surrounding the signal lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09809—Coaxial layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Insulated Conductors (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
AT09171657T 2009-06-10 2009-09-29 Flexible leiterplatte und herstellungsverfahren dafür ATE543372T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW098119340A TWI387407B (zh) 2009-06-10 2009-06-10 軟式印刷電路板其及組成方法

Publications (1)

Publication Number Publication Date
ATE543372T1 true ATE543372T1 (de) 2012-02-15

Family

ID=41571370

Family Applications (1)

Application Number Title Priority Date Filing Date
AT09171657T ATE543372T1 (de) 2009-06-10 2009-09-29 Flexible leiterplatte und herstellungsverfahren dafür

Country Status (4)

Country Link
US (1) US8344257B2 (de)
EP (1) EP2268110B1 (de)
AT (1) ATE543372T1 (de)
TW (1) TWI387407B (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9131602B2 (en) * 2012-02-24 2015-09-08 Mediatek Inc. Printed circuit board for mobile platforms
US9144150B2 (en) * 2012-04-20 2015-09-22 Xilinx, Inc. Conductor structure with integrated via element
JP6146998B2 (ja) * 2012-12-21 2017-06-14 キヤノン株式会社 電子機器
WO2014186966A1 (zh) * 2013-05-23 2014-11-27 华为技术有限公司 一种线路板与在pcb基板上形成线路的方法
TWI562689B (en) * 2015-10-06 2016-12-11 Hong-Jie Dai A flexible printed circuit board, a connector assembly and an electronic device
EP3297093B1 (de) * 2016-09-16 2019-01-02 Rosenberger Hochfrequenztechnik GmbH & Co. KG Steckverbinder zum verbinden einer optischen faser und eines elektrischen leiters
DE102019202721B4 (de) 2019-02-28 2021-03-25 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. 3d-flexfolien-package
DE102019202716B4 (de) 2019-02-28 2020-12-24 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Flex-folien-package mit coplanarer topologie für hochfrequenzsignale und verfahren zum herstellen eines derartigen flex-folien-packages
DE102019202715A1 (de) 2019-02-28 2020-09-03 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Folienbasiertes package mit distanzausgleich
DE102019202718B4 (de) 2019-02-28 2020-12-24 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Dünnes Dual-Folienpackage und Verfahren zum Herstellen desselben

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4418239A (en) * 1981-08-24 1983-11-29 Oak Industries Inc. Flexible connector with interconnection between conductive traces
US4776087A (en) * 1987-04-27 1988-10-11 International Business Machines Corporation VLSI coaxial wiring structure
US4798918A (en) * 1987-09-21 1989-01-17 Intel Corporation High density flexible circuit
FI113937B (fi) * 1989-02-21 2004-06-30 Tatsuta Electric Wire & Gable Painettu piirilevy ja menetelmä sen valmistamiseksi
JPH04313300A (ja) * 1991-04-10 1992-11-05 Sumitomo Electric Ind Ltd フレキシブルプリント配線板
US5293001A (en) * 1992-04-14 1994-03-08 Belden Wire & Cable Company Flexible shielded cable
JP3070358B2 (ja) * 1993-09-29 2000-07-31 富士ゼロックス株式会社 フレキシブル印刷配線板のシールド装置
JP3166442B2 (ja) 1993-10-01 2001-05-14 株式会社日立製作所 多層配線基板およびその製造方法
US5418504A (en) * 1993-12-09 1995-05-23 Nottenburg; Richard N. Transmission line
JPH07283579A (ja) 1994-04-14 1995-10-27 Nitto Denko Corp シールド型フレキシブル配線板
US5981043A (en) * 1996-04-25 1999-11-09 Tatsuta Electric Wire And Cable Co., Ltd Electroconductive coating composition, a printed circuit board fabricated by using it and a flexible printed circuit assembly with electromagnetic shield
US6353189B1 (en) * 1997-04-16 2002-03-05 Kabushiki Kaisha Toshiba Wiring board, wiring board fabrication method, and semiconductor package
US6333468B1 (en) * 1998-06-11 2001-12-25 International Business Machines Corporation Flexible multi-layered printed circuit cable
US6281451B1 (en) * 1998-09-24 2001-08-28 International Business Machines Corporation Electrical cable device
JP2002033556A (ja) * 2000-07-18 2002-01-31 Nippon Mektron Ltd 可撓性回路基板
JP3565768B2 (ja) * 2000-07-27 2004-09-15 ソニーケミカル株式会社 配線基板
JP2002118339A (ja) * 2000-10-05 2002-04-19 Sony Chem Corp 配線基板及び配線基板製造方法
JP2002237221A (ja) * 2001-02-07 2002-08-23 Kazunori Aoki フレキシブルフラット配線板及びコネクタ
US20020157865A1 (en) * 2001-04-26 2002-10-31 Atsuhito Noda Flexible flat circuitry with improved shielding
US7336139B2 (en) * 2002-03-18 2008-02-26 Applied Micro Circuits Corporation Flexible interconnect cable with grounded coplanar waveguide
US7276986B2 (en) * 2003-02-05 2007-10-02 Hewlett-Packard Development Company, L.P. Method and apparatus for improving signal integrity in a high speed flex cable
US7259968B2 (en) * 2003-05-14 2007-08-21 Hewlett-Packard Development Company, L.P. Tailoring impedances of conductive traces in a circuit board
KR20050001697A (ko) * 2003-06-26 2005-01-07 삼성전자주식회사 전자파 차폐를 위한 연성 회로 기판
JP2005268448A (ja) 2004-03-17 2005-09-29 Yoshinokawa Electric Wire & Cable Co Ltd フレキシブルプリント配線基板及びその製造方法
JP4526115B2 (ja) * 2004-05-24 2010-08-18 ソニーケミカル＆インフォメーションデバイス株式会社 フレキシブルフラットケーブル
JP4319167B2 (ja) 2005-05-13 2009-08-26 タツタ システム・エレクトロニクス株式会社 シールドフィルム、シールドプリント配線板、シールドフレキシブルプリント配線板、シールドフィルムの製造方法及びシールドプリント配線板の製造方法
JP2007193999A (ja) * 2006-01-17 2007-08-02 Sony Chemical & Information Device Corp 伝送ケーブル
US7645941B2 (en) * 2006-05-02 2010-01-12 Multi-Fineline Electronix, Inc. Shielded flexible circuits and methods for manufacturing same
US7672142B2 (en) * 2007-01-05 2010-03-02 Apple Inc. Grounded flexible circuits
JP2008300803A (ja) * 2007-06-04 2008-12-11 Toshiba Corp フレキシブル配線基板および電子機器
JP4506818B2 (ja) * 2007-11-15 2010-07-21 住友電気工業株式会社 シールドフラットケーブルの製造方法
US8587953B2 (en) * 2008-01-07 2013-11-19 Apple Inc. Flexible data cable
JP2009238901A (ja) * 2008-03-26 2009-10-15 Toshiba Corp フレキシブルプリント配線板および電子機器
JP4468464B2 (ja) * 2008-03-28 2010-05-26 株式会社東芝 フレキシブルプリント配線板および電子機器
JP2009290020A (ja) * 2008-05-29 2009-12-10 Toshiba Corp フレキシブルプリント配線板、同配線板のシールド加工方法および電子機器

Also Published As

Publication number Publication date
TW201044927A (en) 2010-12-16
US20100314164A1 (en) 2010-12-16
TWI387407B (zh) 2013-02-21
EP2268110B1 (de) 2012-01-25
EP2268110A1 (de) 2010-12-29
US8344257B2 (en) 2013-01-01

Similar Documents

Publication Publication Date Title
GB201213445D0 (en) Security wrap
EP4372804A3 (de) Leistungsmodul-halbleiterbauelement und wechselrichterausrüstung und herstellungsverfahren für das leistungsmodul-halbleiterbauelement und metallform
ATE554640T1 (de) Schaltungsmodul und stromleitungs- kommunikationsvorrichtung
WO2011159722A3 (en) Method of manufacturing conductive structures
ATE508617T1 (de) Leiterplatte und herstellungsverfahren dafür
WO2008063320A3 (en) Tamper respondent sensor and enclosure
WO2011063105A3 (en) Circuit board with air hole
GB2510500A8 (en) High frequency signal line and electronic device provided with same
TW200701264A (en) Inductor
WO2011099831A3 (ko) 그래핀을 이용한 유연성 투명 발열체 및 이의 제조 방법
TWI370473B (en) Switch structure mounted on the sidewall of circuit boards for electronic devices and manufacturing methods of the circuit boards thereof
WO2011094303A3 (en) hBN INSULATOR LAYERS AND ASSOCIATED METHODS
PL2517265T3 (pl) Moduł fotowoltaiczny z płytką drukowaną i sposób jego wytwarzania oraz zastosowanie
HK1212941A1 (zh) 用於通过触摸屏进行识别的模块化的液面花纹
DK2592915T3 (da) Fremstillingsfremgangsmåde til lamineret printplade
WO2012093827A3 (en) Touch panel and method for manufacturing the same
SG141415A1 (en) Flexible printed circuit board
WO2010038179A3 (en) An oled device and an electronic circuit
WO2008084723A1 (ja) 高周波部品及び通信装置
TW201130097A (en) Interconnect layouts for electronic assemblies
WO2012091487A3 (ko) 전극 및 이를 포함하는 전자소자
NL1036863A (en) Circuit board of communication product and manufacturing method thereof.
TW200833211A (en) Circuit board structure with capacitor embedded therein and method for fabricating the same
WO2011112409A3 (en) Wiring substrate with customization layers
GB2482039B (en) Electronic device