ATE543850T1 - WEIßE, HITZEHÄRTBARE SILIKON-/EPOXID- HYBRIDHARZZUSAMMENSETZUNG ZUR OPTOELEKTRONISCHEN VERWENDUNG, HERSTELLUNGSVERFAHREN, VORGEFORMTES GEHÄUSE UND LED-VORRICHTUNG - Google Patents

WEIßE, HITZEHÄRTBARE SILIKON-/EPOXID- HYBRIDHARZZUSAMMENSETZUNG ZUR OPTOELEKTRONISCHEN VERWENDUNG, HERSTELLUNGSVERFAHREN, VORGEFORMTES GEHÄUSE UND LED-VORRICHTUNG

Info

Publication number
ATE543850T1
ATE543850T1 AT10008895T AT10008895T ATE543850T1 AT E543850 T1 ATE543850 T1 AT E543850T1 AT 10008895 T AT10008895 T AT 10008895T AT 10008895 T AT10008895 T AT 10008895T AT E543850 T1 ATE543850 T1 AT E543850T1
Authority
AT
Austria
Prior art keywords
resin composition
curtable
silicone
hybrid resin
manufacturing
Prior art date
Application number
AT10008895T
Other languages
English (en)
Inventor
Junichi Sawada
Yusuke Taguchi
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Application granted granted Critical
Publication of ATE543850T1 publication Critical patent/ATE543850T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477—Six-membered rings
    • C08K5/3492—Triazines
    • C08K5/34926—Triazines also containing heterocyclic groups other than triazine groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3236—Heterocylic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/52—Phosphorus bound to oxygen only
    • C08K5/524—Esters of phosphorous acids, e.g. of H3PO3
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/06—Triglycidylisocyanurates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Led Device Packages (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Silicon Polymers (AREA)
AT10008895T 2009-09-01 2010-08-26 WEIßE, HITZEHÄRTBARE SILIKON-/EPOXID- HYBRIDHARZZUSAMMENSETZUNG ZUR OPTOELEKTRONISCHEN VERWENDUNG, HERSTELLUNGSVERFAHREN, VORGEFORMTES GEHÄUSE UND LED-VORRICHTUNG ATE543850T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009201559 2009-09-01

Publications (1)

Publication Number Publication Date
ATE543850T1 true ATE543850T1 (de) 2012-02-15

Family

ID=42990158

Family Applications (1)

Application Number Title Priority Date Filing Date
AT10008895T ATE543850T1 (de) 2009-09-01 2010-08-26 WEIßE, HITZEHÄRTBARE SILIKON-/EPOXID- HYBRIDHARZZUSAMMENSETZUNG ZUR OPTOELEKTRONISCHEN VERWENDUNG, HERSTELLUNGSVERFAHREN, VORGEFORMTES GEHÄUSE UND LED-VORRICHTUNG

Country Status (7)

Country Link
US (1) US8044128B2 (de)
EP (1) EP2289998B1 (de)
JP (1) JP5488326B2 (de)
KR (1) KR101725996B1 (de)
CN (1) CN102002237B (de)
AT (1) ATE543850T1 (de)
TW (1) TWI470022B (de)

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JP2011074355A (ja) * 2009-09-07 2011-04-14 Nitto Denko Corp 光半導体装置用樹脂組成物およびそれを用いて得られる光半導体装置用リードフレーム、ならびに光半導体装置
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JP5647071B2 (ja) 2011-05-24 2014-12-24 日東電工株式会社 光半導体装置用エポキシ樹脂組成物およびそれを用いた光半導体装置
FR2976946B1 (fr) * 2011-06-24 2014-01-24 Arkema France Composition comprenant un polyamide semi-aromatique et ses utilisations, notamment pour un reflecteur a diode electroluminescente
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JP5756054B2 (ja) * 2012-04-16 2015-07-29 信越化学工業株式会社 Ｌｅｄのリフレクター用熱硬化性樹脂組成物並びにこれを用いたｌｅｄ用リフレクター及び光半導体装置
KR101905834B1 (ko) * 2012-05-31 2018-10-08 엘지이노텍 주식회사 에폭시 수지 조성물 및 발광장치
JP2014135473A (ja) * 2012-12-11 2014-07-24 Renesas Electronics Corp 光結合素子
JP6010455B2 (ja) * 2012-12-27 2016-10-19 信越化学工業株式会社 集光型太陽電池モジュール
KR102007194B1 (ko) 2013-02-14 2019-08-05 엘지이노텍 주식회사 에폭시 수지 조성물 및 이를 이용한 발광 장치
JP5996085B2 (ja) 2013-02-27 2016-09-21 株式会社朝日ラバー 白色反射膜用インク、白色反射膜用粉体塗料及び白色反射膜の製造方法
KR101714953B1 (ko) * 2013-05-28 2017-03-09 닛토덴코 가부시키가이샤 광반도체 장치용 에폭시 수지 조성물 및 그것을 이용하여 얻어지는 광반도체 장치용 리드 프레임, 밀봉형 광반도체 소자 및 광반도체 장치
JP6048367B2 (ja) * 2013-10-21 2016-12-21 信越化学工業株式会社 Ｌｅｄリフレクター用白色熱硬化性エポキシ・シリコーンハイブリッド樹脂組成物、及び該樹脂組成物の成形硬化物から成るプレモールドパッケージ
CN104830024B (zh) 2014-01-15 2018-02-06 财团法人工业技术研究院 有机无机混成树脂、包含其的模塑组合物、以及光电装置
MX2016015219A (es) * 2014-05-19 2017-03-23 Valspar Sourcing Inc Polieteres que contienen grupos ciclicos no bisfenolicos.
CN105778506B (zh) * 2014-12-25 2019-04-30 广东生益科技股份有限公司 一种有机硅树脂组合物及使用它的预浸料、层压板、覆铜板以及铝基板
US9617373B2 (en) * 2015-02-13 2017-04-11 LCY Chemical Corp. Curable resin composition, article, and method for fabricating the same
JP6517043B2 (ja) * 2015-02-25 2019-05-22 ルネサスエレクトロニクス株式会社 光結合装置、光結合装置の製造方法および電力変換システム
JP6439616B2 (ja) * 2015-07-14 2018-12-19 信越化学工業株式会社 光半導体素子封止用熱硬化性エポキシ樹脂組成物及びそれを用いた光半導体装置
JP6918452B2 (ja) * 2015-09-30 2021-08-11 大日本印刷株式会社 発光素子用基板及びモジュール
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Also Published As

Publication number Publication date
JP2011074359A (ja) 2011-04-14
CN102002237A (zh) 2011-04-06
CN102002237B (zh) 2013-01-02
JP5488326B2 (ja) 2014-05-14
US20110054072A1 (en) 2011-03-03
EP2289998B1 (de) 2012-02-01
TWI470022B (zh) 2015-01-21
KR20110025112A (ko) 2011-03-09
EP2289998A1 (de) 2011-03-02
TW201124464A (en) 2011-07-16
US8044128B2 (en) 2011-10-25
KR101725996B1 (ko) 2017-04-11

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