ATE544879T1 - Organischer trockenstrahldruckkopf und druckvorrichtung und -verfahren, die diesen verwenden - Google Patents

Organischer trockenstrahldruckkopf und druckvorrichtung und -verfahren, die diesen verwenden

Info

Publication number
ATE544879T1
ATE544879T1 AT09158065T AT09158065T ATE544879T1 AT E544879 T1 ATE544879 T1 AT E544879T1 AT 09158065 T AT09158065 T AT 09158065T AT 09158065 T AT09158065 T AT 09158065T AT E544879 T1 ATE544879 T1 AT E544879T1
Authority
AT
Austria
Prior art keywords
same
organic dry
dry jet
methods
print head
Prior art date
Application number
AT09158065T
Other languages
English (en)
Inventor
Seunghyup Yoo
Changhun Yun
Hyunsu Cho
Original Assignee
Korea Advanced Inst Sci & Tech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Korea Advanced Inst Sci & Tech filed Critical Korea Advanced Inst Sci & Tech
Application granted granted Critical
Publication of ATE544879T1 publication Critical patent/ATE544879T1/de

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/22Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of impact or pressure on a printing material or impression-transfer material
    • B41J2/23Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of impact or pressure on a printing material or impression-transfer material using print wires
    • B41J2/235Print head assemblies
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J3/00Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04Coating on selected surface areas, e.g. using masks
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12Organic material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/228Gas flow assisted PVD deposition
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/243Crucibles for source material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01Embodiments of or processes related to ink-jet heads
    • B41J2202/09Ink jet technology used for manufacturing optical filters
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • H10K71/12Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
AT09158065T 2008-10-22 2009-04-16 Organischer trockenstrahldruckkopf und druckvorrichtung und -verfahren, die diesen verwenden ATE544879T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020080103751A KR101055606B1 (ko) 2008-10-22 2008-10-22 유기 드라이 젯 프린팅 헤드 및 이를 이용한 프린팅 장치 및 방법

Publications (1)

Publication Number Publication Date
ATE544879T1 true ATE544879T1 (de) 2012-02-15

Family

ID=40829499

Family Applications (1)

Application Number Title Priority Date Filing Date
AT09158065T ATE544879T1 (de) 2008-10-22 2009-04-16 Organischer trockenstrahldruckkopf und druckvorrichtung und -verfahren, die diesen verwenden

Country Status (5)

Country Link
US (1) US20100097416A1 (de)
EP (1) EP2180079B1 (de)
JP (1) JP5000680B2 (de)
KR (1) KR101055606B1 (de)
AT (1) ATE544879T1 (de)

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US8808799B2 (en) * 2009-05-01 2014-08-19 Kateeva, Inc. Method and apparatus for organic vapor printing
US8801856B2 (en) * 2009-09-08 2014-08-12 Universal Display Corporation Method and system for high-throughput deposition of patterned organic thin films
KR101101916B1 (ko) * 2010-04-30 2012-01-02 한국과학기술원 유기 증기젯 인쇄 장치
KR101357167B1 (ko) * 2010-12-23 2014-02-11 한국과학기술원 고성능 유기박막트랜지스터를 제조하는 방법
KR102479011B1 (ko) * 2012-11-30 2022-12-16 카티바, 인크. 산업용 프린팅 시스템의 유지 방법
KR102233750B1 (ko) * 2014-02-12 2021-04-01 한국전자통신연구원 금속 산화물 박막의 형성 방법 및 금속 산화물 박막 프린팅 장치
US11267012B2 (en) 2014-06-25 2022-03-08 Universal Display Corporation Spatial control of vapor condensation using convection
EP2960059B1 (de) 2014-06-25 2018-10-24 Universal Display Corporation Systeme und verfahren zur modulation des durchflusses während der dampfstrahlabscheidung von organischen materialien
US11220737B2 (en) 2014-06-25 2022-01-11 Universal Display Corporation Systems and methods of modulating flow during vapor jet deposition of organic materials
CN104711514B (zh) * 2015-04-07 2017-05-31 合肥京东方光电科技有限公司 一种成膜装置及方法
US10566534B2 (en) * 2015-10-12 2020-02-18 Universal Display Corporation Apparatus and method to deliver organic material via organic vapor-jet printing (OVJP)
WO2018153482A1 (en) * 2017-02-24 2018-08-30 Applied Materials, Inc. Deposition source
US20190386256A1 (en) * 2018-06-18 2019-12-19 Universal Display Corporation Sequential material sources for thermally challenged OLED materials
US11552247B2 (en) * 2019-03-20 2023-01-10 The Regents Of The University Of Michigan Organic vapor jet nozzle with shutter
CN110943012B (zh) * 2019-11-22 2021-05-07 深圳市华星光电半导体显示技术有限公司 制备oled薄膜的打印装置及其打印方法
CN111443880A (zh) * 2020-03-30 2020-07-24 浙江朗帝科技有限公司 一种基于外部信号触发内存区域实现喷码机喷印的方法
KR102779269B1 (ko) 2021-09-17 2025-03-12 세메스 주식회사 액 공급 유닛, 이를 가지는 기판 처리 장치 및 기판 처리 방법

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US4389973A (en) * 1980-03-18 1983-06-28 Oy Lohja Ab Apparatus for performing growth of compound thin films
US5800867A (en) * 1992-08-13 1998-09-01 Nordson Corporation Deflection control of liquid or powder stream during dispensing
US5554220A (en) * 1995-05-19 1996-09-10 The Trustees Of Princeton University Method and apparatus using organic vapor phase deposition for the growth of organic thin films with large optical non-linearities
US6344416B1 (en) * 2000-03-10 2002-02-05 International Business Machines Corporation Deliberate semiconductor film variation to compensate for radial processing differences, determine optimal device characteristics, or produce small productions
US7404862B2 (en) * 2001-09-04 2008-07-29 The Trustees Of Princeton University Device and method for organic vapor jet deposition
CN1287002C (zh) * 2001-09-04 2006-11-29 普林斯顿大学理事会 喷射沉积有机物蒸汽的方法和装置
US7744957B2 (en) * 2003-10-23 2010-06-29 The Trustees Of Princeton University Method and apparatus for depositing material
US7431968B1 (en) * 2001-09-04 2008-10-07 The Trustees Of Princeton University Process and apparatus for organic vapor jet deposition
US7067170B2 (en) * 2002-09-23 2006-06-27 Eastman Kodak Company Depositing layers in OLED devices using viscous flow
US7793869B2 (en) * 2003-08-18 2010-09-14 Nordson Corporation Particulate material applicator and pump
KR100659762B1 (ko) 2005-01-17 2006-12-19 삼성에스디아이 주식회사 증발원, 증착장치 및 이를 이용한 증착방법
JP5203584B2 (ja) 2006-08-09 2013-06-05 東京エレクトロン株式会社 成膜装置、成膜システムおよび成膜方法
US7879401B2 (en) * 2006-12-22 2011-02-01 The Regents Of The University Of Michigan Organic vapor jet deposition using an exhaust

Also Published As

Publication number Publication date
JP2010103087A (ja) 2010-05-06
JP5000680B2 (ja) 2012-08-15
EP2180079A1 (de) 2010-04-28
EP2180079B1 (de) 2012-02-08
KR20100044565A (ko) 2010-04-30
KR101055606B1 (ko) 2011-08-10
US20100097416A1 (en) 2010-04-22

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