ATE546830T1 - Mikro-elektronischer aufbau - Google Patents
Mikro-elektronischer aufbauInfo
- Publication number
- ATE546830T1 ATE546830T1 AT04005959T AT04005959T ATE546830T1 AT E546830 T1 ATE546830 T1 AT E546830T1 AT 04005959 T AT04005959 T AT 04005959T AT 04005959 T AT04005959 T AT 04005959T AT E546830 T1 ATE546830 T1 AT E546830T1
- Authority
- AT
- Austria
- Prior art keywords
- micro
- electronic construction
- stable
- substrate
- accordance
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D207/00—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom
- C07D207/02—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom with only hydrogen or carbon atoms directly attached to the ring nitrogen atom
- C07D207/44—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom with only hydrogen or carbon atoms directly attached to the ring nitrogen atom having three double bonds between ring members or between ring members and non-ring members
- C07D207/444—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom with only hydrogen or carbon atoms directly attached to the ring nitrogen atom having three double bonds between ring members or between ring members and non-ring members having two doubly-bound oxygen atoms directly attached in positions 2 and 5
- C07D207/448—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom with only hydrogen or carbon atoms directly attached to the ring nitrogen atom having three double bonds between ring members or between ring members and non-ring members having two doubly-bound oxygen atoms directly attached in positions 2 and 5 with only hydrogen atoms or radicals containing only hydrogen and carbon atoms directly attached to other ring carbon atoms, e.g. maleimide
- C07D207/452—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom with only hydrogen or carbon atoms directly attached to the ring nitrogen atom having three double bonds between ring members or between ring members and non-ring members having two doubly-bound oxygen atoms directly attached in positions 2 and 5 with only hydrogen atoms or radicals containing only hydrogen and carbon atoms directly attached to other ring carbon atoms, e.g. maleimide with hydrocarbon radicals, substituted by hetero atoms, directly attached to the ring nitrogen atom
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D401/00—Heterocyclic compounds containing two or more hetero rings, having nitrogen atoms as the only ring hetero atoms, at least one ring being a six-membered ring with only one nitrogen atom
- C07D401/02—Heterocyclic compounds containing two or more hetero rings, having nitrogen atoms as the only ring hetero atoms, at least one ring being a six-membered ring with only one nitrogen atom containing two hetero rings
- C07D401/04—Heterocyclic compounds containing two or more hetero rings, having nitrogen atoms as the only ring hetero atoms, at least one ring being a six-membered ring with only one nitrogen atom containing two hetero rings directly linked by a ring-member-to-ring-member bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/12—Unsaturated polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/12—Unsaturated polyimide precursors
- C08G73/121—Preparatory processes from unsaturated precursors and polyamines
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/300,721 US6034194A (en) | 1994-09-02 | 1994-09-02 | Bismaleimide-divinyl adhesive compositions and uses therefor |
| US08/460,495 US6034195A (en) | 1994-09-02 | 1995-06-02 | Thermosetting resin compositions containing maleimide and/or vinyl compounds |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE546830T1 true ATE546830T1 (de) | 2012-03-15 |
Family
ID=23160304
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT04005959T ATE546830T1 (de) | 1994-09-02 | 1995-08-30 | Mikro-elektronischer aufbau |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US6034194A (de) |
| KR (1) | KR100421595B1 (de) |
| CN (1) | CN101209987A (de) |
| AT (1) | ATE546830T1 (de) |
Families Citing this family (73)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1180044C (zh) | 2000-05-18 | 2004-12-15 | 国家淀粉及化学投资控股公司 | 含有乙烯基醚和氨基甲酸酯或脲官能团的小片连接粘合剂 |
| SG100706A1 (en) * | 2000-05-18 | 2003-12-26 | Nat Starch Chem Invest | Curable electron donor compounds |
| US6300456B1 (en) * | 2000-05-18 | 2001-10-09 | National Starch And Chemical Investment Holding Corporation | Compounds with electron donor and electron acceptor functionality |
| US6441213B1 (en) | 2000-05-18 | 2002-08-27 | National Starch And Chemical Investment Holding Corporation | Adhesion promoters containing silane, carbamate or urea, and donor or acceptor functionality |
| US6307001B1 (en) | 2000-05-18 | 2001-10-23 | National Starch And Chemical Investment Holding Corporation | Curable hybrid electron donor compounds containing vinyl ether |
| US6812064B2 (en) * | 2001-11-07 | 2004-11-02 | Micron Technology, Inc. | Ozone treatment of a ground semiconductor die to improve adhesive bonding to a substrate |
| US6743852B2 (en) | 2001-11-13 | 2004-06-01 | Henkel Corporation | Benzoxazines, thermosetting resins comprised thereof, and methods for use thereof |
| US6825315B2 (en) | 2001-12-21 | 2004-11-30 | Sandia Corporation | Method of making thermally removable adhesives |
| US6806309B2 (en) * | 2002-02-28 | 2004-10-19 | Henkel Corporation | Adhesive compositions containing organic spacers and methods for use thereof |
| CN100449776C (zh) * | 2002-06-17 | 2009-01-07 | 亨凯尔公司 | 间层电介质和预施涂的模片连接粘合剂材料 |
| US7199249B2 (en) * | 2002-07-03 | 2007-04-03 | Henkel Corporation | Free radically polymerizable coupling agents |
| US6818680B2 (en) * | 2002-09-23 | 2004-11-16 | Corning Incorporated | Curable adhesive compositions |
| US20050288457A1 (en) * | 2002-10-22 | 2005-12-29 | Puwei Liu | Co-curable compositions |
| US7176044B2 (en) * | 2002-11-25 | 2007-02-13 | Henkel Corporation | B-stageable die attach adhesives |
| US20040158008A1 (en) * | 2003-02-06 | 2004-08-12 | Xiping He | Room temperature printable adhesive paste |
| US8513375B2 (en) * | 2003-05-05 | 2013-08-20 | Designer Molecules, Inc. | Imide-linked maleimide and polymaleimide compounds |
| US20040225045A1 (en) * | 2003-05-05 | 2004-11-11 | Henkel Loctite Corporation | Highly conductive resin compositions |
| CN1784457B (zh) * | 2003-05-05 | 2010-07-14 | 设计者分子公司 | 二酰亚胺连接的马来酰亚胺和聚马来酰亚胺化合物 |
| US7157587B2 (en) * | 2003-05-05 | 2007-01-02 | Designer Molecules, Inc. | Imide-extended liquid bismaleimide resin |
| US7884174B2 (en) | 2003-05-05 | 2011-02-08 | Designer Molecules, Inc. | Imide-linked maleimide and polymaleimide compounds |
| US7271227B1 (en) | 2004-04-20 | 2007-09-18 | Henkel Corporation | Adhesive compositions free of metallic catalyst |
| US7037447B1 (en) | 2003-07-23 | 2006-05-02 | Henkel Corporation | Conductive ink compositions |
| CN102604591A (zh) * | 2004-03-19 | 2012-07-25 | 住友电木株式会社 | 树脂组合物及采用该树脂组合物制作的半导体装置 |
| SG157966A1 (en) * | 2004-04-30 | 2010-01-29 | Advanced Applied Adhesives | Imide-linked maleimide and polymaleimide compounds |
| US7875688B2 (en) * | 2004-06-04 | 2011-01-25 | Designer Molecules, Inc. | Free-radical curable polyesters and methods for use thereof |
| CN101014664B (zh) * | 2004-06-04 | 2012-10-10 | 设计者分子公司 | 可自由基固化的聚酯及其使用方法 |
| JP4810875B2 (ja) * | 2004-06-09 | 2011-11-09 | 三菱瓦斯化学株式会社 | 硬化性樹脂組成物 |
| US7795362B2 (en) * | 2004-07-16 | 2010-09-14 | Designer Molecules, Inc. | Olefin oligomers containing pendant maleimide groups |
| US8043534B2 (en) | 2005-10-21 | 2011-10-25 | Designer Molecules, Inc. | Maleimide compositions and methods for use thereof |
| US8378017B2 (en) * | 2005-12-29 | 2013-02-19 | Designer Molecules, Inc. | Thermosetting adhesive compositions |
| EP2004746B1 (de) * | 2006-03-29 | 2018-08-01 | Henkel AG & Co. KGaA | Strahlungshärtbarer kautschuk-klebstoff/dichtstoff |
| US8530573B2 (en) | 2006-05-10 | 2013-09-10 | Designer Molecules, Inc. | Modified calcium carbonate-filled adhesive compositions and methods for use thereof |
| US7691475B2 (en) * | 2006-07-21 | 2010-04-06 | 3M Innovative Properties Company | Anisotropic conductive adhesives |
| US8287686B2 (en) * | 2006-07-24 | 2012-10-16 | Designer Molecules, Inc. | Derivatives of poly(styrene-co-allyl alcohol) and methods for use thereof |
| US7825188B2 (en) * | 2006-12-19 | 2010-11-02 | Designer Molecules, Inc. | Thermoplastic elastomer with acyloxyphenyl hard block segment |
| WO2008077140A2 (en) * | 2006-12-19 | 2008-06-26 | Designer Molecules, Inc. | Hydrolytically resistant thermoset monomers |
| WO2008092168A2 (en) * | 2007-01-26 | 2008-07-31 | Designer Molecules, Inc. | Methods for the preparation of imides, maleimides and maleimide-terminated polyimide compounds |
| US8039663B2 (en) | 2007-04-09 | 2011-10-18 | Designer Molecules, Inc. | Monomers derived from pentacyclopentadecane dimethanol |
| US20100113643A1 (en) * | 2007-04-09 | 2010-05-06 | Designer Molecules, Inc. | Curatives for epoxy adhesive compositions |
| US8431655B2 (en) * | 2007-04-09 | 2013-04-30 | Designer Molecules, Inc. | Curatives for epoxy compositions |
| US7868113B2 (en) | 2007-04-11 | 2011-01-11 | Designer Molecules, Inc. | Low shrinkage polyester thermosetting resins |
| WO2008128209A1 (en) * | 2007-04-12 | 2008-10-23 | Designer Molecules, Inc. | Polyfunctional epoxy oligomers |
| US8063161B2 (en) * | 2007-04-16 | 2011-11-22 | Designer Molecules, Inc. | Low temperature curing acrylate and maleimide based formulations and methods for use thereof |
| US7928153B2 (en) | 2007-08-14 | 2011-04-19 | Designer Molecules, Inc. | Thermosetting polyether oligomers, compositions and methods for use thereof |
| KR20100075906A (ko) * | 2007-09-13 | 2010-07-05 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 저온 접합 전자부품용 접착 |
| US20100240790A1 (en) | 2007-10-02 | 2010-09-23 | Ryu Sang-Uk | Curing composition and cured product prepared by using the same |
| US8398898B2 (en) * | 2008-02-23 | 2013-03-19 | Designer Molecules, Inc. | Soluble metal salts for use as conductivity promoters |
| WO2009117345A2 (en) * | 2008-03-17 | 2009-09-24 | Henkel Corporation | Adhesive compositions for use in die attach applications |
| WO2009117729A2 (en) | 2008-03-21 | 2009-09-24 | Designer Molecules, Inc. | Anti-bleed compounds, compositions and methods for use thereof |
| US8308892B2 (en) | 2008-04-09 | 2012-11-13 | Designer Molecules, Inc. | Di-cinnamyl compounds and methods for use thereof |
| US7851930B1 (en) | 2008-06-04 | 2010-12-14 | Henkel Corporation | Conductive adhesive compositions containing an alloy filler material for better dispense and thermal properties |
| KR20110045040A (ko) * | 2008-08-08 | 2011-05-03 | 헨켈 코포레이션 | 저온 경화 조성물 |
| US8217120B2 (en) * | 2008-08-13 | 2012-07-10 | Designer Molecules, Inc. | Functionalized styrene oligomers and polymers |
| US8158748B2 (en) | 2008-08-13 | 2012-04-17 | Designer Molecules, Inc. | Hetero-functional compounds and methods for use thereof |
| US8013104B2 (en) * | 2008-08-13 | 2011-09-06 | Designer Molecules, Inc. | Thermosetting hyperbranched compositions and methods for use thereof |
| US8008419B2 (en) * | 2008-08-13 | 2011-08-30 | Designer Molecules, Inc. | Siloxane monomers and methods for use thereof |
| US8637611B2 (en) | 2008-08-13 | 2014-01-28 | Designer Molecules, Inc. | Amide-extended crosslinking compounds and methods for use thereof |
| US8288591B2 (en) * | 2008-11-20 | 2012-10-16 | Designer Molecules, Inc. | Curing agents for epoxy resins |
| JP2012516914A (ja) * | 2009-02-02 | 2012-07-26 | ロード コーポレイション | マレイミド末端基を持つポリイミドを含む構造用接着剤 |
| US20090200013A1 (en) * | 2009-04-23 | 2009-08-13 | Bernadette Craster | Well tubular, coating system and method for oilfield applications |
| US8710682B2 (en) * | 2009-09-03 | 2014-04-29 | Designer Molecules Inc, Inc. | Materials and methods for stress reduction in semiconductor wafer passivation layers |
| US8415812B2 (en) * | 2009-09-03 | 2013-04-09 | Designer Molecules, Inc. | Materials and methods for stress reduction in semiconductor wafer passivation layers |
| US8698320B2 (en) * | 2009-12-07 | 2014-04-15 | Henkel IP & Holding GmbH | Curable resin compositions useful as underfill sealants for use with low-k dielectric-containing semiconductor devices |
| US8936111B2 (en) | 2010-03-06 | 2015-01-20 | Halliburton Energy Services, Inc. | Invert drilling fluids having enhanced rheology and methods of drilling boreholes |
| US8686162B2 (en) | 2010-08-25 | 2014-04-01 | Designer Molecules Inc, Inc. | Maleimide-functional monomers in amorphous form |
| US8816021B2 (en) | 2010-09-10 | 2014-08-26 | Designer Molecules, Inc. | Curable composition with rubber-like properties |
| JP6303407B2 (ja) * | 2012-12-03 | 2018-04-04 | Jnc株式会社 | 硬化性組成物およびその用途 |
| JP2018531317A (ja) * | 2015-08-08 | 2018-10-25 | デジグナー モレキュールズ インク． | 陰イオン性硬化可能な組成物 |
| US11416046B2 (en) | 2015-11-05 | 2022-08-16 | Henkel Ag & Co. Kgaa | Compositions having a matrix and encapsulated phase change materials dispersed therein, and electronic devices assembled therewith |
| CN105461927A (zh) * | 2015-11-27 | 2016-04-06 | 国联汽车动力电池研究院有限责任公司 | 一种可长期保存的双马来酰亚胺聚合物及其制备方法 |
| TWI804615B (zh) * | 2018-05-18 | 2023-06-11 | 日商信越化學工業股份有限公司 | 半導體密封用熱固性馬來醯亞胺樹脂組合物及半導體裝置 |
| JP7213050B2 (ja) * | 2018-09-28 | 2023-01-26 | 京セラ株式会社 | 電極形成用樹脂組成物並びにチップ型電子部品及びその製造方法 |
| DE102021110210A1 (de) | 2021-04-22 | 2022-10-27 | Delo Industrie Klebstoffe Gmbh & Co. Kgaa | Verfahren zum Herstellen eines optischen Moduls und optisches Modul |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4193829A (en) * | 1977-03-16 | 1980-03-18 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Process for the manufacture of low density bis-maleimide-carbon microballoon composites |
| US4581461A (en) * | 1983-04-07 | 1986-04-08 | National Starch And Chemical Corporation | Maleated siloxane derivatives |
| US4621122A (en) * | 1984-06-05 | 1986-11-04 | Minnesota Mining And Manufacturing Company | High-temperature resistant electrically insulating coating powder |
| US4578328A (en) * | 1984-07-09 | 1986-03-25 | General Electric Company | Photopatternable polyimide compositions and method for making |
| DE3578571D1 (de) * | 1985-01-19 | 1990-08-09 | Sumitomo Chemical Co | Kautschukmischung. |
| USH424H (en) * | 1985-02-21 | 1988-02-02 | The United States Of America As Represented By The Secretary Of The Navy | Method of synthesizing the bismaleimide of dimer diamine via cyclodehydration |
| NL8501660A (nl) * | 1985-06-08 | 1987-01-02 | Dsm Resins Bv | Bismaleimide samenstellingen. |
| US5364700A (en) * | 1985-12-27 | 1994-11-15 | Amoco Corporation | Prepregable resin composition and composite |
| US4740830A (en) * | 1986-06-04 | 1988-04-26 | W. R. Grace & Co. | Low temperature single step curing polyimide adhesive |
| CA1274048A (en) * | 1986-07-15 | 1990-09-11 | Linda A. Domeier | Bismaleimide formulations containing olefinic ether modifiers |
| US4743642A (en) * | 1986-09-08 | 1988-05-10 | The Dow Chemical Company | Color balanced rubber-reinforced plastic |
| US4904360A (en) * | 1986-09-12 | 1990-02-27 | Minnesota Mining And Manufacturing Company | Water-compatible coating composition |
| US4806608A (en) * | 1987-03-16 | 1989-02-21 | Loctite Corporation | Curable siloxane maleimide composition |
| DE4032004A1 (de) * | 1990-10-09 | 1992-04-16 | Basf Ag | Ultraduenne thermoplastische bismaleinimidschichten sowie ein verfahren zu ihrer herstellung |
| NL9002758A (nl) * | 1990-12-14 | 1992-07-01 | Stamicarbon | Eindloze voorwerpen uit thermohardbare monomeren. |
| US5153248A (en) * | 1991-10-10 | 1992-10-06 | The Goodyear Tire & Rubber Company | Sulfur vulcanized rubber compounds containing silica and aromatic bismaleimide |
| AU3975793A (en) * | 1992-04-03 | 1993-11-08 | Thermoset Plastics, Inc. | Conductor-filled thermosetting resin |
| AU3611293A (en) * | 1992-06-16 | 1994-01-04 | Ensign-Bickford Coatings Company | Thermally resistant glass article |
| US5262488A (en) * | 1992-08-26 | 1993-11-16 | The Goodyear Tire & Rubber Company | Rubber vulcanization composition with bis-(2,5-polythio-1,3,4 thiadiazole) |
| US5380768A (en) * | 1993-05-20 | 1995-01-10 | Martin Marietta Corporation | Foam, Foam-resin composite and method of making a foam-resin composite |
| JP2531464B2 (ja) * | 1993-12-10 | 1996-09-04 | 日本電気株式会社 | 半導体パッケ―ジ |
-
1994
- 1994-09-02 US US08/300,721 patent/US6034194A/en not_active Expired - Lifetime
-
1995
- 1995-06-02 US US08/460,495 patent/US6034195A/en not_active Expired - Lifetime
- 1995-08-30 KR KR1019970701371A patent/KR100421595B1/ko not_active Expired - Fee Related
- 1995-08-30 CN CNA2007101617691A patent/CN101209987A/zh active Pending
- 1995-08-30 AT AT04005959T patent/ATE546830T1/de active
Also Published As
| Publication number | Publication date |
|---|---|
| US6034194A (en) | 2000-03-07 |
| CN101209987A (zh) | 2008-07-02 |
| US6034195A (en) | 2000-03-07 |
| KR100421595B1 (ko) | 2004-05-31 |
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