ATE546833T1 - Halbleiterkapselung mit füllmetall aus gold- /silber-/kupferlegierung - Google Patents

Halbleiterkapselung mit füllmetall aus gold- /silber-/kupferlegierung

Info

Publication number
ATE546833T1
ATE546833T1 AT04752628T AT04752628T ATE546833T1 AT E546833 T1 ATE546833 T1 AT E546833T1 AT 04752628 T AT04752628 T AT 04752628T AT 04752628 T AT04752628 T AT 04752628T AT E546833 T1 ATE546833 T1 AT E546833T1
Authority
AT
Austria
Prior art keywords
silver
filler metal
gold
semiconductor
encapsular
Prior art date
Application number
AT04752628T
Other languages
English (en)
Inventor
Joshua Lobsinger
Michael Shane
Ronaldo Brosas
Original Assignee
Kyocera America Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera America Inc filed Critical Kyocera America Inc
Application granted granted Critical
Publication of ATE546833T1 publication Critical patent/ATE546833T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Powder Metallurgy (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
AT04752628T 2003-05-21 2004-05-19 Halbleiterkapselung mit füllmetall aus gold- /silber-/kupferlegierung ATE546833T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/442,549 US6900525B2 (en) 2003-05-21 2003-05-21 Semiconductor package having filler metal of gold/silver/copper alloy
PCT/US2004/015639 WO2004107436A1 (en) 2003-05-21 2004-05-19 Semiconductor package having filler metal of gold/silver/copper alloy

Publications (1)

Publication Number Publication Date
ATE546833T1 true ATE546833T1 (de) 2012-03-15

Family

ID=33450226

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04752628T ATE546833T1 (de) 2003-05-21 2004-05-19 Halbleiterkapselung mit füllmetall aus gold- /silber-/kupferlegierung

Country Status (9)

Country Link
US (1) US6900525B2 (de)
EP (1) EP1625618B1 (de)
JP (1) JP5097403B2 (de)
KR (1) KR101109803B1 (de)
CN (1) CN1802740B (de)
AT (1) ATE546833T1 (de)
CA (1) CA2526484C (de)
IL (1) IL172051A (de)
WO (1) WO2004107436A1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6900525B2 (en) * 2003-05-21 2005-05-31 Kyocera America, Inc. Semiconductor package having filler metal of gold/silver/copper alloy
US20050253282A1 (en) * 2004-04-27 2005-11-17 Daoqiang Lu Temperature resistant hermetic sealing formed at low temperatures for MEMS packages
WO2011157171A2 (zh) * 2011-06-03 2011-12-22 华为技术有限公司 一种封装用绝缘环、绝缘环组合件和封装体
US9331000B2 (en) 2014-04-02 2016-05-03 Kyocera America, Inc. Heat management in electronics packaging
CN109037161A (zh) * 2018-06-15 2018-12-18 华为技术有限公司 一种法兰和半导体功率器件
JP7364168B2 (ja) * 2019-02-12 2023-10-18 住友電工デバイス・イノベーション株式会社 半導体モジュール及び半導体デバイス収容体
CN114582826A (zh) * 2020-11-30 2022-06-03 上海华为技术有限公司 一种封装结构、封装方法

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US4325051A (en) * 1980-08-29 1982-04-13 Sprague Electric Company PTCR Package
US4431983A (en) * 1980-08-29 1984-02-14 Sprague Electric Company PTCR Package
US4487638A (en) * 1982-11-24 1984-12-11 Burroughs Corporation Semiconductor die-attach technique and composition therefor
JPS61287155A (ja) * 1985-06-14 1986-12-17 Hitachi Ltd 半導体装置及び半導体装置の製造方法
US4897508A (en) * 1988-02-10 1990-01-30 Olin Corporation Metal electronic package
JP2727021B2 (ja) * 1989-08-04 1998-03-11 日本特殊陶業株式会社 エレクトロマイグレーション防止性ロウ付け用材料
US5043534A (en) * 1990-07-02 1991-08-27 Olin Corporation Metal electronic package having improved resistance to electromagnetic interference
US5043139A (en) * 1990-10-09 1991-08-27 Eastman Kodak Company Amalgam preform, method of forming the preform and method of bonding therewith
US5164885A (en) * 1991-11-21 1992-11-17 Motorola, Inc. Electronic package having a non-oxide ceramic bonded to metal and method for making
US5313365A (en) * 1992-06-30 1994-05-17 Motorola, Inc. Encapsulated electronic package
US5428501A (en) * 1993-08-13 1995-06-27 Marine Mechanical Corporation Packaging structure and method for solid electrolyte capacitors
US5360942A (en) * 1993-11-16 1994-11-01 Olin Corporation Multi-chip electronic package module utilizing an adhesive sheet
US5569958A (en) * 1994-05-26 1996-10-29 Cts Corporation Electrically conductive, hermetic vias and their use in high temperature chip packages
KR100215181B1 (ko) * 1995-10-06 1999-08-16 포만 제프리 엘 도전성 은/증합체 복합체의 부식 및 용해 방지구조물
US5757611A (en) * 1996-04-12 1998-05-26 Norhtrop Grumman Corporation Electronic package having buried passive components
US5761048A (en) * 1996-04-16 1998-06-02 Lsi Logic Corp. Conductive polymer ball attachment for grid array semiconductor packages
US5825084A (en) * 1996-08-22 1998-10-20 Express Packaging Systems, Inc. Single-core two-side substrate with u-strip and co-planar signal traces, and power and ground planes through split-wrap-around (SWA) or split-via-connections (SVC) for packaging IC devices
US6027791A (en) * 1996-09-30 2000-02-22 Kyocera Corporation Structure for mounting a wiring board
US5808870A (en) * 1996-10-02 1998-09-15 Stmicroelectronics, Inc. Plastic pin grid array package
CN1068064C (zh) * 1997-05-27 2001-07-04 旭龙精密工业股份有限公司 引线框架及其制造方法
JP2868007B1 (ja) * 1997-11-14 1999-03-10 日本電気株式会社 半導体装置及びその製造方法
US6211463B1 (en) * 1998-01-26 2001-04-03 Saint-Gobain Industrial Ceramics, Inc. Electronic circuit package with diamond film heat conductor
US20020005247A1 (en) * 1999-02-08 2002-01-17 Teresita Ordonez Graham Electrically conductive paste materials and applications
US6214152B1 (en) * 1999-03-22 2001-04-10 Rjr Polymers, Inc. Lead frame moisture barrier for molded plastic electronic packages
US6198634B1 (en) * 1999-03-31 2001-03-06 International Business Machines Corporation Electronic package with stacked connections
US6261868B1 (en) * 1999-04-02 2001-07-17 Motorola, Inc. Semiconductor component and method for manufacturing the semiconductor component
US6307755B1 (en) * 1999-05-27 2001-10-23 Richard K. Williams Surface mount semiconductor package, die-leadframe combination and leadframe therefor and method of mounting leadframes to surfaces of semiconductor die
US6462413B1 (en) * 1999-07-22 2002-10-08 Polese Company, Inc. LDMOS transistor heatsink package assembly and manufacturing method
JP2002118202A (ja) * 2000-10-05 2002-04-19 Sanyo Electric Co Ltd 放熱基板および半導体モジュール
JP2003068919A (ja) * 2001-08-27 2003-03-07 Nec Yamagata Ltd 半導体装置
JP3695706B2 (ja) 2001-12-27 2005-09-14 株式会社住友金属エレクトロデバイス 半導体パッケージ
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US6900525B2 (en) * 2003-05-21 2005-05-31 Kyocera America, Inc. Semiconductor package having filler metal of gold/silver/copper alloy

Also Published As

Publication number Publication date
KR101109803B1 (ko) 2012-02-27
CA2526484A1 (en) 2004-12-09
US20040232529A1 (en) 2004-11-25
WO2004107436A1 (en) 2004-12-09
CN1802740A (zh) 2006-07-12
JP5097403B2 (ja) 2012-12-12
EP1625618A1 (de) 2006-02-15
EP1625618B1 (de) 2012-02-22
CN1802740B (zh) 2011-03-30
US6900525B2 (en) 2005-05-31
HK1086948A1 (en) 2006-09-29
EP1625618A4 (de) 2010-03-31
KR20060020634A (ko) 2006-03-06
IL172051A (en) 2013-12-31
CA2526484C (en) 2013-04-30
JP2007528590A (ja) 2007-10-11

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