ATE547927T1 - Lötvorrichtung mit einem tiegel, der über eine oberfläche aus neutralem material gegenüber dem aufbringungsmetall für das löten verfügt - Google Patents

Lötvorrichtung mit einem tiegel, der über eine oberfläche aus neutralem material gegenüber dem aufbringungsmetall für das löten verfügt

Info

Publication number
ATE547927T1
ATE547927T1 AT09161333T AT09161333T ATE547927T1 AT E547927 T1 ATE547927 T1 AT E547927T1 AT 09161333 T AT09161333 T AT 09161333T AT 09161333 T AT09161333 T AT 09161333T AT E547927 T1 ATE547927 T1 AT E547927T1
Authority
AT
Austria
Prior art keywords
soldering
craft
surface made
material towards
crucible
Prior art date
Application number
AT09161333T
Other languages
English (en)
Inventor
Daniel Faudemer
Aicha Abouassam
Patrick Leinenbach
Original Assignee
Bosch Gmbh Robert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert filed Critical Bosch Gmbh Robert
Application granted granted Critical
Publication of ATE547927T1 publication Critical patent/ATE547927T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3468—Application of molten solder, e.g. dip soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0692—Solder baths with intermediary means for bringing solder on workpiece, e.g. rollers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0763—Treating individual holes or single row of holes, e.g. by nozzle
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Coating With Molten Metal (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • Ceramic Products (AREA)
AT09161333T 2008-06-02 2009-05-28 Lötvorrichtung mit einem tiegel, der über eine oberfläche aus neutralem material gegenüber dem aufbringungsmetall für das löten verfügt ATE547927T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0803074A FR2932060B1 (fr) 2008-06-02 2008-06-02 Creuset pour un dispositif de brasage comportant une surface realisee en un materiau neutre par rapport a un metal d'apport pour le brasage.

Publications (1)

Publication Number Publication Date
ATE547927T1 true ATE547927T1 (de) 2012-03-15

Family

ID=40158840

Family Applications (1)

Application Number Title Priority Date Filing Date
AT09161333T ATE547927T1 (de) 2008-06-02 2009-05-28 Lötvorrichtung mit einem tiegel, der über eine oberfläche aus neutralem material gegenüber dem aufbringungsmetall für das löten verfügt

Country Status (4)

Country Link
EP (1) EP2131636B1 (de)
AT (1) ATE547927T1 (de)
ES (1) ES2381151T3 (de)
FR (1) FR2932060B1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104741490B (zh) * 2013-12-27 2017-06-20 博世汽车部件(苏州)有限公司 一种焊接工具
CN104741725B (zh) * 2013-12-27 2017-03-22 博世汽车部件(苏州)有限公司 一种焊接工具
CN207139057U (zh) * 2017-08-28 2018-03-27 博世汽车部件(苏州)有限公司 钎焊坩埚
CN108341689A (zh) * 2018-01-12 2018-07-31 晶科能源有限公司 一种多晶坩埚自动喷涂方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3398873A (en) * 1966-09-07 1968-08-27 Hollis Engineering Sumps and nozzles for soldering machines
DE4133224A1 (de) * 1991-10-07 1993-04-08 Wls Karl Heinz Grasmann Weichl Vorrichtung zum loeten von flachbaugruppen
DE4425260C2 (de) * 1994-07-16 1998-08-20 Andreas Hohnerlein Vorrichtung zum Löten
US5711473A (en) * 1995-12-22 1998-01-27 Sund; William Inert atmosphere soldering apparatus
US7392926B2 (en) * 2004-09-15 2008-07-01 Hakko Corporation Electrically-controlled soldering pot apparatus

Also Published As

Publication number Publication date
EP2131636B1 (de) 2012-02-29
EP2131636A1 (de) 2009-12-09
FR2932060B1 (fr) 2014-12-12
ES2381151T3 (es) 2012-05-23
FR2932060A1 (fr) 2009-12-04

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