ATE547929T1 - Submezzaninstruktur für leiterplattenanordnungen - Google Patents

Submezzaninstruktur für leiterplattenanordnungen

Info

Publication number
ATE547929T1
ATE547929T1 AT07814163T AT07814163T ATE547929T1 AT E547929 T1 ATE547929 T1 AT E547929T1 AT 07814163 T AT07814163 T AT 07814163T AT 07814163 T AT07814163 T AT 07814163T AT E547929 T1 ATE547929 T1 AT E547929T1
Authority
AT
Austria
Prior art keywords
card
mezzan
instruction
sub
circuit board
Prior art date
Application number
AT07814163T
Other languages
English (en)
Inventor
Michael James Finnerty
Stefan Gerhard Levie
Iii Joseph Peter Norris
Original Assignee
Technobox Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Technobox Inc filed Critical Technobox Inc
Application granted granted Critical
Publication of ATE547929T1 publication Critical patent/ATE547929T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/073—High voltage adaptations
    • H05K2201/0746—Protection against transients, e.g. layout adapted for plugging of connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10598—Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Combinations Of Printed Boards (AREA)
  • Mobile Radio Communication Systems (AREA)
AT07814163T 2006-08-16 2007-08-16 Submezzaninstruktur für leiterplattenanordnungen ATE547929T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US82257106P 2006-08-16 2006-08-16
PCT/US2007/076084 WO2008022249A2 (en) 2006-08-16 2007-08-16 Sub-mezzanine structure for printed circuit card assemblies

Publications (1)

Publication Number Publication Date
ATE547929T1 true ATE547929T1 (de) 2012-03-15

Family

ID=39083131

Family Applications (1)

Application Number Title Priority Date Filing Date
AT07814163T ATE547929T1 (de) 2006-08-16 2007-08-16 Submezzaninstruktur für leiterplattenanordnungen

Country Status (4)

Country Link
US (1) US7539026B2 (de)
EP (1) EP2057873B1 (de)
AT (1) ATE547929T1 (de)
WO (1) WO2008022249A2 (de)

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US7764509B2 (en) * 2006-12-20 2010-07-27 Spirit Aerosystems, Inc. Method and apparatus for interfacing components
US7746654B2 (en) * 2007-06-07 2010-06-29 Hewlett-Packard Development Company, L.P. Adaptable plug-in mezzanine card for blade servers
US8300417B2 (en) * 2007-12-11 2012-10-30 Bae Systems Information And Electronic Systems Integration Inc. Apparatus for adapting mezzanine cards
DE102008033173A1 (de) * 2008-07-15 2010-02-04 Fujitsu Siemens Computers Gmbh Befestigungsanordnung für ein Sicherheitsmodul und Verwendung einer Schraube zur Befestigung eines Sicherheitsmoduls
JP4934710B2 (ja) * 2009-10-20 2012-05-16 能美防災株式会社 火災報知設備用中継器
US8169781B2 (en) * 2010-04-06 2012-05-01 Fsp Technology Inc. Power supply and heat dissipation module thereof
US20110311013A1 (en) * 2010-06-21 2011-12-22 Lockheed Martin Corporation System and apparatus for plant monitoring and control
US9817728B2 (en) 2013-02-01 2017-11-14 Symbolic Io Corporation Fast system state cloning
US9304703B1 (en) 2015-04-15 2016-04-05 Symbolic Io Corporation Method and apparatus for dense hyper IO digital retention
US10133636B2 (en) 2013-03-12 2018-11-20 Formulus Black Corporation Data storage and retrieval mediation system and methods for using same
CN103365377B (zh) * 2013-06-28 2017-05-10 曙光信息产业股份有限公司 一种机柜立柱、背板、槽位识别系统及方法
GB2528464A (en) 2014-07-22 2016-01-27 Ibm Data processing system with balcony boards
USD777123S1 (en) * 2014-07-24 2017-01-24 Allen-Vanguard Corporation Mezzanine board
US10061514B2 (en) 2015-04-15 2018-08-28 Formulus Black Corporation Method and apparatus for dense hyper IO digital retention
WO2017019025A1 (en) 2015-07-27 2017-02-02 Hewlett Packard Enterprise Development Lp Socket to support boards in a spaced relation
WO2017023254A1 (en) * 2015-07-31 2017-02-09 Hewlett Packard Enterprise Development Lp Heat exchangers
CN107534029B (zh) 2015-07-31 2021-11-26 慧与发展有限责任合伙企业 多芯片模块
US20170147044A1 (en) * 2015-11-23 2017-05-25 General Electric Company Mezzanine filler module apparatuses and methods for computing devices
US9603251B1 (en) 2016-03-09 2017-03-21 Symbolic Io Corporation Apparatus and method of midplane panel connections
US10051729B2 (en) 2016-09-21 2018-08-14 Seagate Technology Llc Configuration element for printed circuit board assemblies
US10197755B1 (en) * 2016-11-22 2019-02-05 Triad National Security, Llc Fiber optic transceiver FPGA mezzanine card (FMC)
US10528092B2 (en) 2017-04-05 2020-01-07 International Business Machines Corporation Midplane anti-codocking interlock system
WO2019126072A1 (en) 2017-12-18 2019-06-27 Formulus Black Corporation Random access memory (ram)-based computer systems, devices, and methods
US11029985B2 (en) 2018-01-19 2021-06-08 Ge Aviation Systems Llc Processor virtualization in unmanned vehicles
US10942509B2 (en) 2018-01-19 2021-03-09 Ge Aviation Systems Llc Heterogeneous processing in unmanned vehicles
US11032919B2 (en) * 2018-01-19 2021-06-08 Ge Aviation Systems Llc Control boxes and system-on-module circuit boards for unmanned vehicles
US10827629B2 (en) * 2018-01-19 2020-11-03 Ge Aviation Systems Llc Control boxes and system-on-module circuit boards for unmanned vehicles
SG11202007238XA (en) * 2018-02-09 2020-08-28 Nat Univ Singapore Apparatus and method for configuring small satellites
US10725853B2 (en) 2019-01-02 2020-07-28 Formulus Black Corporation Systems and methods for memory failure prevention, management, and mitigation
US11419239B2 (en) * 2020-06-24 2022-08-16 Micron Technology, Inc. Thermal management of circuit boards
US11978971B2 (en) * 2021-07-15 2024-05-07 Dell Products, L.P. Toolless information handling system Compression attached memory module installation apparatus, systems, and methods
US11937393B2 (en) * 2021-11-16 2024-03-19 Arinc Incorporated Circuit board assembly and system for communication to an access point of an avionics network
WO2026011255A1 (en) * 2024-07-10 2026-01-15 LDA Technologies Ltd. Field programmable gate array board and mezzanine board interface

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Also Published As

Publication number Publication date
WO2008022249A3 (en) 2008-10-16
WO2008022249A2 (en) 2008-02-21
US7539026B2 (en) 2009-05-26
EP2057873B1 (de) 2012-02-29
US20080043448A1 (en) 2008-02-21
EP2057873A2 (de) 2009-05-13
EP2057873A4 (de) 2010-05-05

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