ATE548893T1 - Gehäuse aus stranggepressten multipositions- metallprofilen zur herstellung einer dichten elektronischen leistungsvorrichtung - Google Patents

Gehäuse aus stranggepressten multipositions- metallprofilen zur herstellung einer dichten elektronischen leistungsvorrichtung

Info

Publication number
ATE548893T1
ATE548893T1 AT08172822T AT08172822T ATE548893T1 AT E548893 T1 ATE548893 T1 AT E548893T1 AT 08172822 T AT08172822 T AT 08172822T AT 08172822 T AT08172822 T AT 08172822T AT E548893 T1 ATE548893 T1 AT E548893T1
Authority
AT
Austria
Prior art keywords
producing
housing
power device
electronic power
housing made
Prior art date
Application number
AT08172822T
Other languages
English (en)
Inventor
Eric Biagini
Yves Caussin
Original Assignee
Intelligent Electronic Systems Ies
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intelligent Electronic Systems Ies filed Critical Intelligent Electronic Systems Ies
Application granted granted Critical
Publication of ATE548893T1 publication Critical patent/ATE548893T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components
    • H05K7/20918—Forced ventilation, e.g. on heat dissipaters coupled to components the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Casings For Electric Apparatus (AREA)
  • Structure Of Receivers (AREA)
AT08172822T 2008-01-16 2008-12-23 Gehäuse aus stranggepressten multipositions- metallprofilen zur herstellung einer dichten elektronischen leistungsvorrichtung ATE548893T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0850255A FR2926399B1 (fr) 2008-01-16 2008-01-16 Boitier en profiles extrudes metalliques multi-positions pour la fabrication d'un dispositif electronique de puissance etanche

Publications (1)

Publication Number Publication Date
ATE548893T1 true ATE548893T1 (de) 2012-03-15

Family

ID=39684563

Family Applications (1)

Application Number Title Priority Date Filing Date
AT08172822T ATE548893T1 (de) 2008-01-16 2008-12-23 Gehäuse aus stranggepressten multipositions- metallprofilen zur herstellung einer dichten elektronischen leistungsvorrichtung

Country Status (7)

Country Link
US (1) US8035964B2 (de)
EP (1) EP2081422B1 (de)
AT (1) ATE548893T1 (de)
CA (1) CA2649248C (de)
DK (1) DK2081422T3 (de)
ES (1) ES2383621T3 (de)
FR (1) FR2926399B1 (de)

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CN201654638U (zh) * 2009-11-26 2010-11-24 鸿富锦精密工业（深圳）有限公司 电脑系统
CN201654639U (zh) * 2009-11-26 2010-11-24 鸿富锦精密工业（深圳）有限公司 电脑系统
DE112011101959B4 (de) * 2010-06-07 2016-11-24 Mitsubishi Electric Corporation Wärmesenke und Verfahren zu deren Herstellung
US20120014071A1 (en) * 2010-07-16 2012-01-19 Robert Louis Fils Amplifier with sealed entry points
TWI488562B (zh) * 2010-08-30 2015-06-11 Liquidcool Solutions Inc 擠製伺服器殼體
US8446722B2 (en) * 2010-09-10 2013-05-21 Src, Inc. Circuit board chassis and method including sidewall aperture and backplane insertion slots for side assembled backplane
WO2012078721A2 (en) 2010-12-07 2012-06-14 Allison Transmission, Inc. Energy storage system for hybrid electric vehicle
WO2012120610A1 (ja) * 2011-03-07 2012-09-13 三菱電機株式会社 車両用制御装置
US9161478B2 (en) * 2012-02-24 2015-10-13 Futurewei Technologies, Inc. Apparatus and method for an active antenna heat sink
US8687363B2 (en) * 2012-05-01 2014-04-01 General Electric Company Enclosure with duct mounted electronic components
US9700965B2 (en) * 2013-03-15 2017-07-11 Illinois Tool Works Inc. Base for welding type power supply
JPWO2014147961A1 (ja) * 2013-03-19 2017-02-16 富士電機株式会社 電子機器冷却装置およびこれを備える電力変換装置
WO2014184419A1 (en) 2013-05-15 2014-11-20 Valmet Automotive Oy System for packaging and thermal management of battery cells
US11026343B1 (en) * 2013-06-20 2021-06-01 Flextronics Ap, Llc Thermodynamic heat exchanger
US10127949B2 (en) 2014-09-25 2018-11-13 Evtron, Inc. Heat and flow management in a computing device
US9594409B1 (en) * 2015-03-18 2017-03-14 Western Digital Technologies, Inc. Storage drive heat sink mounting structure
US10520207B1 (en) 2015-06-23 2019-12-31 Flextronics Ap, Llc Refrigerated drying module for moisture sensitive device storage
CN105848455B (zh) * 2016-05-27 2018-02-09 温岭市志创网络科技有限公司 一种高效散热堆叠式智能控制器
US20180042144A1 (en) * 2016-08-03 2018-02-08 Kuei-Piao Lee Method of Cooling Electric-Vehicle Controller
CN107006136B (zh) * 2016-09-26 2021-11-23 深圳市大疆创新科技有限公司 散热机构及具有该散热机构的电子调速器、电子装置
JP6985588B2 (ja) * 2017-04-07 2021-12-22 富士通株式会社 電子装置及び電磁波吸収体
CN106877461A (zh) * 2017-04-20 2017-06-20 成都锐奕信息技术有限公司 一种能快速散热的充电器
US10607798B2 (en) * 2018-05-14 2020-03-31 Te Connectivity Corporation Power switch device with shape memory alloy actuator
US11252307B2 (en) * 2018-09-05 2022-02-15 Canon Kabushiki Kaisha Imaging device and imaging system
USD902874S1 (en) * 2019-01-21 2020-11-24 Roadmaster, Inc. Heatsink housing
CN113923939A (zh) * 2021-09-13 2022-01-11 杭州电子科技大学 一种具有黑化表面的电子设备金属外壳
CN114096136A (zh) * 2022-01-21 2022-02-25 深圳富联富桂精密工业有限公司 浸没式冷却系统

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US3961666A (en) * 1972-11-24 1976-06-08 Sony Corporation Heat dispersion device for use in an electronic apparatus
DE7911538U1 (de) * 1979-04-20 1979-08-02 Eberle Werke Kg, 8500 Nuernberg Gehäuse zur Aufnahme von bestückten Leiterplatten, insbesondere für Steuerungen von Industrieprozessen
US4656559A (en) * 1984-05-10 1987-04-07 Ultima Electronics Ltd. Holder and heat sink for electronic components
US4791531A (en) * 1987-03-09 1988-12-13 Tech-S, Inc. Extruded enclosure for electrical apparatus
US5742478A (en) * 1996-09-25 1998-04-21 Wu; Chih-Hsien Radiating structure of a power converter
US6144556A (en) * 1999-03-30 2000-11-07 Lanclos; Kenneth W. Heat dissipating housing for electronic components
US6411514B1 (en) * 2001-03-08 2002-06-25 Rally Manufacturing, Inc. Power inverter with heat dissipating assembly
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USD509806S1 (en) * 2004-07-16 2005-09-20 Hon Hai Precision Industry Co., Ltd. Heat dissipation device
US7136286B2 (en) * 2005-01-10 2006-11-14 Aaeon Technology Inc. Industrial computer with aluminum case having fins as radiating device
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Also Published As

Publication number Publication date
CA2649248A1 (en) 2009-07-16
EP2081422B1 (de) 2012-03-07
US20090180251A1 (en) 2009-07-16
CA2649248C (en) 2017-03-28
EP2081422A1 (de) 2009-07-22
US8035964B2 (en) 2011-10-11
DK2081422T3 (da) 2012-06-25
FR2926399B1 (fr) 2010-02-05
FR2926399A1 (fr) 2009-07-17
ES2383621T3 (es) 2012-06-22

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