ATE549794T1 - Tief-submikrometer-mos-vorverstärker mit dickoxid-eingabestufe-transistor - Google Patents

Tief-submikrometer-mos-vorverstärker mit dickoxid-eingabestufe-transistor

Info

Publication number
ATE549794T1
ATE549794T1 AT07150087T AT07150087T ATE549794T1 AT E549794 T1 ATE549794 T1 AT E549794T1 AT 07150087 T AT07150087 T AT 07150087T AT 07150087 T AT07150087 T AT 07150087T AT E549794 T1 ATE549794 T1 AT E549794T1
Authority
AT
Austria
Prior art keywords
preamplifier
input stage
submicrometer
mos
low
Prior art date
Application number
AT07150087T
Other languages
English (en)
Inventor
Per F Hovesten
Lars Jorn Stenberg
Original Assignee
Epcos Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos Pte Ltd filed Critical Epcos Pte Ltd
Application granted granted Critical
Publication of ATE549794T1 publication Critical patent/ATE549794T1/de

Links

Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00Electrostatic transducers
    • H04R19/01Electrostatic transducers characterised by the use of electrets
    • H04R19/016Electrostatic transducers characterised by the use of electrets for microphones
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F1/00Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
    • H03F1/52Circuit arrangements for protecting such amplifiers
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F1/00Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
    • H03F1/52Circuit arrangements for protecting such amplifiers
    • H03F1/523Circuit arrangements for protecting such amplifiers for amplifiers using field-effect devices
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F1/00Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
    • H03F1/56Modifications of input or output impedances, not otherwise provided for
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F3/00Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/181Low-frequency amplifiers, e.g. audio preamplifiers
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F3/00Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/181Low-frequency amplifiers, e.g. audio preamplifiers
    • H03F3/183Low-frequency amplifiers, e.g. audio preamplifiers with semiconductor devices only
    • H03F3/185Low-frequency amplifiers, e.g. audio preamplifiers with semiconductor devices only with field-effect devices
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F3/00Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/181Low-frequency amplifiers, e.g. audio preamplifiers
    • H03F3/183Low-frequency amplifiers, e.g. audio preamplifiers with semiconductor devices only
    • H03F3/187Low-frequency amplifiers, e.g. audio preamplifiers with semiconductor devices only in integrated circuits
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00Electrostatic transducers
    • H04R19/005Electrostatic transducers using semiconductor materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01Manufacture or treatment
    • H10D84/0123Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
    • H10D84/0126Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
    • H10D84/0144Manufacturing their gate insulating layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01Manufacture or treatment
    • H10D84/02Manufacture or treatment characterised by using material-based technologies
    • H10D84/03Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
    • H10D84/038Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/80Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
    • H10D84/82Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components
    • H10D84/83Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components of only insulated-gate FETs [IGFET]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/80Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
    • H10D84/82Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components
    • H10D84/83Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components of only insulated-gate FETs [IGFET]
    • H10D84/8314Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components of only insulated-gate FETs [IGFET] the IGFETs characterised by having gate insulating layers with different properties
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F2200/00Indexing scheme relating to amplifiers
    • H03F2200/03Indexing scheme relating to amplifiers the amplifier being designed for audio applications
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F2200/00Indexing scheme relating to amplifiers
    • H03F2200/18Indexing scheme relating to amplifiers the bias of the gate of a FET being controlled by a control signal
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F2200/00Indexing scheme relating to amplifiers
    • H03F2200/222A circuit being added at the input of an amplifier to adapt the input impedance of the amplifier
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003Mems transducers or their use

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Multimedia (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Amplifiers (AREA)
  • Bipolar Transistors (AREA)
  • Circuit For Audible Band Transducer (AREA)
AT07150087T 2006-12-18 2007-12-18 Tief-submikrometer-mos-vorverstärker mit dickoxid-eingabestufe-transistor ATE549794T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US87545206P 2006-12-18 2006-12-18

Publications (1)

Publication Number Publication Date
ATE549794T1 true ATE549794T1 (de) 2012-03-15

Family

ID=38529830

Family Applications (1)

Application Number Title Priority Date Filing Date
AT07150087T ATE549794T1 (de) 2006-12-18 2007-12-18 Tief-submikrometer-mos-vorverstärker mit dickoxid-eingabestufe-transistor

Country Status (5)

Country Link
US (1) US8094846B2 (de)
EP (1) EP1936689B1 (de)
KR (1) KR101485067B1 (de)
CN (1) CN101287304B (de)
AT (1) ATE549794T1 (de)

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US8542850B2 (en) 2007-09-12 2013-09-24 Epcos Pte Ltd Miniature microphone assembly with hydrophobic surface coating
DE102007058951B4 (de) * 2007-12-07 2020-03-26 Snaptrack, Inc. MEMS Package
ITTO20090495A1 (it) 2009-06-30 2011-01-01 St Microelectronics Srl Circuito preamplificatore per un trasduttore acustico capacitivo di tipo microelettromeccanico
DE102010006132B4 (de) 2010-01-29 2013-05-08 Epcos Ag Miniaturisiertes elektrisches Bauelement mit einem Stapel aus einem MEMS und einem ASIC
US9181086B1 (en) 2012-10-01 2015-11-10 The Research Foundation For The State University Of New York Hinged MEMS diaphragm and method of manufacture therof
US9331655B2 (en) * 2013-07-10 2016-05-03 Broadcom Corporation Pop-click noise grounding switch design with deep sub-micron CMOS technology
US9608437B2 (en) * 2013-09-12 2017-03-28 Qualcomm Incorporated Electro-static discharge protection for integrated circuits
US10158943B2 (en) 2016-02-01 2018-12-18 Knowles Electronics, Llc Apparatus and method to bias MEMS motors
US12091313B2 (en) 2019-08-26 2024-09-17 The Research Foundation For The State University Of New York Electrodynamically levitated actuator
CN112290899B (zh) * 2020-10-26 2024-02-06 杭州爱华仪器有限公司 一种测量电路前置放大器

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Publication number Priority date Publication date Assignee Title
JPH03196677A (ja) 1989-12-26 1991-08-28 Nec Corp 半導体装置
US6426673B2 (en) 1997-07-30 2002-07-30 Programmable Silicon Solutions High performance integrated radio frequency circuit devices
JP2001102875A (ja) 1999-10-01 2001-04-13 Hosiden Corp 半導体増幅回路及び半導体エレクトレットコンデンサマイクロホン
US6181193B1 (en) * 1999-10-08 2001-01-30 International Business Machines Corporation Using thick-oxide CMOS devices to interface high voltage integrated circuits
US6353344B1 (en) 2000-05-22 2002-03-05 Microtronic Us, Inc. High impedance bias circuit
US6642543B1 (en) * 2000-09-26 2003-11-04 The Board Of Trustees Of The Leland Stanford Junior University Thin and thick gate oxide transistors on a functional block of a CMOS circuit residing within the core of an IC chip
WO2002073792A2 (en) 2001-03-09 2002-09-19 Techtronic A/S An electret condensor microphone preamplifier that is insensitive to leakage currents at the input
SE522714C2 (sv) 2001-07-13 2004-03-02 Ericsson Telefon Ab L M Framställning av lågbrusig MOS-anordning
JP2003179071A (ja) * 2001-10-25 2003-06-27 Sharp Corp Mddおよび選択cvdシリサイドを用いて深いサブミクロンcmosソース/ドレインを製造する方法
JP2003230195A (ja) * 2002-02-06 2003-08-15 Hosiden Corp エレクトレットコンデンサマイクロホン
CN1280881C (zh) * 2002-03-25 2006-10-18 华邦电子股份有限公司 深亚微米mos装置及其制造方法
US7149317B2 (en) * 2002-04-18 2006-12-12 Sonionmicrotronic Nederland B.V. CMOS high impedance circuit
US6888408B2 (en) * 2002-08-27 2005-05-03 Sonion Tech A/S Preamplifier for two terminal electret condenser microphones
US7142682B2 (en) 2002-12-20 2006-11-28 Sonion Mems A/S Silicon-based transducer for use in hearing instruments and listening devices
US7466835B2 (en) * 2003-03-18 2008-12-16 Sonion A/S Miniature microphone with balanced termination
US7787642B2 (en) 2003-07-17 2010-08-31 Massachusetts Institute Of Technology Low-power high-PSRR current-mode microphone pre-amplifier system and method
US6977543B2 (en) * 2003-08-26 2005-12-20 Intel Corporation Biasing technique using thin and thick oxide transistors
KR20060126526A (ko) 2003-12-01 2006-12-07 아우디오아시스 에이/에스 전압 펌프를 구비한 마이크로폰
DE602005010129D1 (de) * 2004-01-12 2008-11-20 Sonion As Verstärkerschaltung für kapazitive Umformer
EP1599067B1 (de) 2004-05-21 2013-05-01 Epcos Pte Ltd Detektion und Kontrolle des Membrankollaps in einem Kondensatormikrofon
US7271651B2 (en) * 2005-06-17 2007-09-18 Agere Systems Inc. High performance differential amplifiers with thick oxide devices for high impedance nodes
EP1742506B1 (de) * 2005-07-06 2013-05-22 Epcos Pte Ltd Mikrofonanordnung mit P-typ Vorverstärkerseingangsstufe

Also Published As

Publication number Publication date
US20080152171A1 (en) 2008-06-26
CN101287304B (zh) 2013-02-06
US8094846B2 (en) 2012-01-10
EP1936689A1 (de) 2008-06-25
CN101287304A (zh) 2008-10-15
KR20080056683A (ko) 2008-06-23
EP1936689B1 (de) 2012-03-14
KR101485067B1 (ko) 2015-01-21

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