ATE549904T1 - Verfahren zum formen von metallischen mustern - Google Patents

Verfahren zum formen von metallischen mustern

Info

Publication number
ATE549904T1
ATE549904T1 AT09176833T AT09176833T ATE549904T1 AT E549904 T1 ATE549904 T1 AT E549904T1 AT 09176833 T AT09176833 T AT 09176833T AT 09176833 T AT09176833 T AT 09176833T AT E549904 T1 ATE549904 T1 AT E549904T1
Authority
AT
Austria
Prior art keywords
plating
metallic patterns
ink
nonelectric
substrate
Prior art date
Application number
AT09176833T
Other languages
English (en)
Inventor
Satoshi Mori
Shinichi Suzuki
Original Assignee
Konica Minolta Ij Technologies
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Konica Minolta Ij Technologies filed Critical Konica Minolta Ij Technologies
Application granted granted Critical
Publication of ATE549904T1 publication Critical patent/ATE549904T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0709—Catalytic ink or adhesive for electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1208—Pretreatment of the circuit board, e.g. modifying wetting properties; Patterning by using affinity patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
AT09176833T 2009-03-03 2009-11-24 Verfahren zum formen von metallischen mustern ATE549904T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009049072 2009-03-03

Publications (1)

Publication Number Publication Date
ATE549904T1 true ATE549904T1 (de) 2012-03-15

Family

ID=42046307

Family Applications (1)

Application Number Title Priority Date Filing Date
AT09176833T ATE549904T1 (de) 2009-03-03 2009-11-24 Verfahren zum formen von metallischen mustern

Country Status (4)

Country Link
US (1) US8440263B2 (de)
EP (1) EP2227075B1 (de)
JP (1) JP2010232639A (de)
AT (1) ATE549904T1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015523680A (ja) * 2012-05-18 2015-08-13 ユニピクセル ディスプレイズ，インコーポレーテッド 金属のナノ粒子とナノワイヤを含むインクを用いた導電パターンの形成
KR101735223B1 (ko) * 2012-07-30 2017-05-12 이스트맨 코닥 캄파니 고해상도 전도성 패턴의 플렉소그래픽 인쇄용 잉크 제형
EP2988946B1 (de) 2013-04-24 2017-08-16 OCE-Technologies B.V. Druckverfahren
TWI620834B (zh) * 2017-03-09 2018-04-11 達方電子股份有限公司 可撓式發光裝置及其製造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6024380A (ja) * 1983-07-20 1985-02-07 Hitachi Ltd パラジウム活性化液
JPH01195281A (ja) * 1988-01-28 1989-08-07 Hitachi Chem Co Ltd 無電解めつき用触媒
JPH0257676A (ja) * 1988-08-23 1990-02-27 Nippon Kentetsu Co Ltd 高分子材料の表面改質方法
JPH07131135A (ja) 1993-11-05 1995-05-19 Ibiden Co Ltd プリント配線基板のイニシェータパターンの形成に水性インクを用いた製造方法
JP3220350B2 (ja) * 1995-05-15 2001-10-22 イビデン株式会社 プリント配線板の製造方法
JP3858809B2 (ja) * 1996-09-19 2006-12-20 セイコーエプソン株式会社 発光素子の製造方法
JP3900248B2 (ja) 2001-03-30 2007-04-04 ハリマ化成株式会社 多層配線板およびその形成方法
US20050006339A1 (en) * 2003-07-11 2005-01-13 Peter Mardilovich Electroless deposition methods and systems
JP2005146372A (ja) * 2003-11-18 2005-06-09 Meltex Inc 無電解めっき用の触媒付与液
US7255782B2 (en) * 2004-04-30 2007-08-14 Kenneth Crouse Selective catalytic activation of non-conductive substrates
US20050241951A1 (en) * 2004-04-30 2005-11-03 Kenneth Crouse Selective catalytic activation of non-conductive substrates
JP2007042683A (ja) 2005-07-29 2007-02-15 Fujifilm Holdings Corp 導電性パターン形成方法
JP2008041766A (ja) * 2006-08-02 2008-02-21 Bridgestone Corp Ｆｐｃ、ｒｆｉｄ用タグ及びその製造方法
KR100882023B1 (ko) * 2007-05-25 2009-02-05 한국생산기술연구원 표면에너지 제어를 이용한 패터닝 방법
WO2009150936A1 (ja) * 2008-06-11 2009-12-17 コニカミノルタＩｊ株式会社 金属パターン形成方法及び金属パターン

Also Published As

Publication number Publication date
JP2010232639A (ja) 2010-10-14
US20100227078A1 (en) 2010-09-09
EP2227075A1 (de) 2010-09-08
US8440263B2 (en) 2013-05-14
EP2227075B1 (de) 2012-03-14

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