ATE552610T1 - Verfahren und vorrichtung zur prüfung eines chips vor dem bonden - Google Patents
Verfahren und vorrichtung zur prüfung eines chips vor dem bondenInfo
- Publication number
- ATE552610T1 ATE552610T1 AT09167663T AT09167663T ATE552610T1 AT E552610 T1 ATE552610 T1 AT E552610T1 AT 09167663 T AT09167663 T AT 09167663T AT 09167663 T AT09167663 T AT 09167663T AT E552610 T1 ATE552610 T1 AT E552610T1
- Authority
- AT
- Austria
- Prior art keywords
- chip
- testing
- bonding
- handling
- connection
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W95/00—Packaging processes not covered by the other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W99/00—Subject matter not provided for in other groups of this subclass
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Die Bonding (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP09167663A EP2284863B1 (de) | 2009-08-11 | 2009-08-11 | Verfahren und Vorrichtung zur Prüfung eines Chips vor dem Bonden |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE552610T1 true ATE552610T1 (de) | 2012-04-15 |
Family
ID=41138126
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT09167663T ATE552610T1 (de) | 2009-08-11 | 2009-08-11 | Verfahren und vorrichtung zur prüfung eines chips vor dem bonden |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP2284863B1 (de) |
| KR (2) | KR101953146B1 (de) |
| CN (2) | CN102549712B (de) |
| AT (1) | ATE552610T1 (de) |
| SG (1) | SG178101A1 (de) |
| WO (1) | WO2011018375A1 (de) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| PH12013502495A1 (en) * | 2011-06-03 | 2014-02-10 | Orion Systems Integration Pte Ltd | Method and systems for semiconductor chip pick & transfer and bonding |
| CH705370A1 (de) * | 2011-07-31 | 2013-01-31 | Kulicke & Soffa Die Bonding Gmbh | Verfahren und Vorrichtung zur Inspektion eines Halbleiterchips vor der Montage. |
| US9093549B2 (en) | 2013-07-02 | 2015-07-28 | Kulicke And Soffa Industries, Inc. | Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the same |
| KR102122038B1 (ko) * | 2018-05-28 | 2020-06-11 | 세메스 주식회사 | 본딩 툴과 이를 포함하는 다이 본딩 장치 및 이를 이용하는 다이 본딩 방법 |
| CN109712912B (zh) * | 2018-12-06 | 2023-07-18 | 通富微电子股份有限公司 | 一种芯片倒装设备及方法 |
| DE102023134713A1 (de) * | 2023-12-12 | 2025-06-12 | Carl Zeiss Smt Gmbh | Verfahren zum Platzieren und Befestigen mindestens einer MMA-Baugruppe |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5080549A (en) | 1987-05-11 | 1992-01-14 | Epsilon Technology, Inc. | Wafer handling system with Bernoulli pick-up |
| JPH0755711A (ja) * | 1993-08-12 | 1995-03-03 | Sumitomo Electric Ind Ltd | 半導体デバイスの検査装置 |
| JPH07285087A (ja) * | 1994-04-15 | 1995-10-31 | Rohm Co Ltd | 半導体チップのピックアップ検査装置 |
| JP2000260789A (ja) * | 1999-03-10 | 2000-09-22 | Nec Kansai Ltd | ダイボンダ |
| EP1189496B1 (de) * | 2000-09-13 | 2009-10-28 | Esec AG | Vorrichtung für die Montage von Halbleiterchips |
| WO2005013354A1 (ja) * | 2003-07-30 | 2005-02-10 | Nec Machinery Corporation | ワーク移載手段、画像認識装置および位置決め方法 |
| CH697213A5 (de) | 2004-05-19 | 2008-06-25 | Alphasem Ag | Verfahren und Vorrichtung zum Ablösen eines auf eine flexible Folie geklebten Bauteils. |
| JP2006108281A (ja) * | 2004-10-04 | 2006-04-20 | Matsushita Electric Ind Co Ltd | 電子部品ピックアップ方法および電子部品搭載方法ならびに電子部品搭載装置 |
| KR101248719B1 (ko) | 2006-04-12 | 2013-03-28 | 쿨릭케 운트 소파 다이 본딩 게엠베하 | 전자 부품의 배치 방법 및 장치 |
-
2009
- 2009-08-11 EP EP09167663A patent/EP2284863B1/de active Active
- 2009-08-11 AT AT09167663T patent/ATE552610T1/de active
-
2010
- 2010-08-02 WO PCT/EP2010/061189 patent/WO2011018375A1/en not_active Ceased
- 2010-08-02 SG SG2012005195A patent/SG178101A1/en unknown
- 2010-08-02 CN CN201080035984.7A patent/CN102549712B/zh active Active
- 2010-08-02 CN CN201510381758.9A patent/CN105047588B/zh active Active
- 2010-08-02 KR KR1020187008812A patent/KR101953146B1/ko active Active
- 2010-08-02 KR KR1020127005786A patent/KR20120059524A/ko not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| EP2284863A1 (de) | 2011-02-16 |
| EP2284863B1 (de) | 2012-04-04 |
| CN102549712B (zh) | 2015-07-29 |
| KR20180037063A (ko) | 2018-04-10 |
| CN105047588B (zh) | 2019-06-21 |
| KR101953146B1 (ko) | 2019-02-28 |
| KR20120059524A (ko) | 2012-06-08 |
| CN102549712A (zh) | 2012-07-04 |
| WO2011018375A1 (en) | 2011-02-17 |
| CN105047588A (zh) | 2015-11-11 |
| SG178101A1 (en) | 2012-03-29 |
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