ATE553928T1 - Elektrische verbindung von elektrisch isolierten druckkopfchiperdungsnetzen als flexible schaltung - Google Patents

Elektrische verbindung von elektrisch isolierten druckkopfchiperdungsnetzen als flexible schaltung

Info

Publication number
ATE553928T1
ATE553928T1 AT07865075T AT07865075T ATE553928T1 AT E553928 T1 ATE553928 T1 AT E553928T1 AT 07865075 T AT07865075 T AT 07865075T AT 07865075 T AT07865075 T AT 07865075T AT E553928 T1 ATE553928 T1 AT E553928T1
Authority
AT
Austria
Prior art keywords
flexible circuit
electrical connection
print head
electrically insulated
head chip
Prior art date
Application number
AT07865075T
Other languages
English (en)
Inventor
Kevin Bruce
Gregory Burton
Joseph Torgerson
Original Assignee
Hewlett Packard Development Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Development Co filed Critical Hewlett Packard Development Co
Application granted granted Critical
Publication of ATE553928T1 publication Critical patent/ATE553928T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14088—Structure of heating means
    • B41J2/14112—Resistive element
    • B41J2/14129—Layer structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14072—Electrical connections, e.g. details on electrodes, connecting the chip to the outside...
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/1433—Structure of nozzle plates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1601—Production of bubble jet print heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1629—Manufacturing processes etching wet etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2002/14491—Electrical connection

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Ink Jet (AREA)
AT07865075T 2007-12-02 2007-12-02 Elektrische verbindung von elektrisch isolierten druckkopfchiperdungsnetzen als flexible schaltung ATE553928T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2007/086210 WO2009073019A1 (en) 2007-12-02 2007-12-02 Electrically connecting electrically isolated printhead die ground networks as flexible circuit

Publications (1)

Publication Number Publication Date
ATE553928T1 true ATE553928T1 (de) 2012-05-15

Family

ID=40718005

Family Applications (1)

Application Number Title Priority Date Filing Date
AT07865075T ATE553928T1 (de) 2007-12-02 2007-12-02 Elektrische verbindung von elektrisch isolierten druckkopfchiperdungsnetzen als flexible schaltung

Country Status (10)

Country Link
US (2) US9555630B2 (de)
EP (1) EP2229279B1 (de)
JP (1) JP5539895B2 (de)
CN (1) CN101883683B (de)
AT (1) ATE553928T1 (de)
ES (1) ES2386481T3 (de)
PL (1) PL2229279T3 (de)
PT (1) PT2229279E (de)
TW (1) TWI467657B (de)
WO (1) WO2009073019A1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9257763B2 (en) 2013-07-02 2016-02-09 Gyrus Acmi, Inc. Hybrid interconnect
US9510739B2 (en) 2013-07-12 2016-12-06 Gyrus Acmi, Inc. Endoscope small imaging system
BR112018010226A2 (pt) 2016-02-24 2018-11-21 Hewlett-Packard Development Company, L.P. dispositivo de ejeção de fluido que inclui circuito integrado
JP6976743B2 (ja) * 2017-06-29 2021-12-08 キヤノン株式会社 液体吐出ヘッド用基板、液体吐出ヘッド、液体吐出装置、導電層の形成方法、及び液体吐出ヘッド用基板の製造方法

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3046640B2 (ja) 1991-04-20 2000-05-29 キヤノン株式会社 記録ヘッド用基体の製造方法および記録ヘッドの製造方法
US5159353A (en) * 1991-07-02 1992-10-27 Hewlett-Packard Company Thermal inkjet printhead structure and method for making the same
US5317183A (en) 1991-09-03 1994-05-31 International Business Machines Corporation Substrate noise coupling reduction for VLSI applications with mixed analog and digital circuitry
JP3305415B2 (ja) 1992-06-18 2002-07-22 キヤノン株式会社 半導体装置、インクジェットヘッド、および画像形成装置
WO1996005061A1 (en) * 1994-08-09 1996-02-22 Encad, Inc. Printer ink cartridge
JPH0994968A (ja) 1995-09-29 1997-04-08 Hewlett Packard Co <Hp> インクジェットプリントヘッド
JPH09123450A (ja) 1995-11-07 1997-05-13 Hitachi Denshi Ltd 記録液体噴出による記録装置
US6543884B1 (en) 1996-02-07 2003-04-08 Hewlett-Packard Company Fully integrated thermal inkjet printhead having etched back PSG layer
JP3405725B2 (ja) * 1996-09-12 2003-05-12 アオイ電子株式会社 サーマルヘッド
US6883894B2 (en) * 2001-03-19 2005-04-26 Hewlett-Packard Development Company, L.P. Printhead with looped gate transistor structures
US6582063B1 (en) * 2001-03-21 2003-06-24 Hewlett-Packard Development Company, L.P. Fluid ejection device
US6616268B2 (en) 2001-04-12 2003-09-09 Lexmark International, Inc. Power distribution architecture for inkjet heater chip
US6740536B2 (en) 2001-10-26 2004-05-25 Hewlett-Packard Develpment Corporation, L.P. Devices and methods for integrated circuit manufacturing
JP4125069B2 (ja) 2002-08-13 2008-07-23 キヤノン株式会社 インクジェット記録ヘッド用基板、インクジェット記録ヘッドおよび該インクジェット記録ヘッドを用いたインクジェット記録装置
JP2005035966A (ja) 2002-09-06 2005-02-10 Takeda Chem Ind Ltd フランまたはチオフェン誘導体およびその医薬用途
JP2004160829A (ja) 2002-11-13 2004-06-10 Sony Corp 液体吐出装置及びその製造方法
US7032994B2 (en) 2003-10-31 2006-04-25 Hewlett-Packard Development Company, L.P. Interconnect circuit
US7080896B2 (en) 2004-01-20 2006-07-25 Lexmark International, Inc. Micro-fluid ejection device having high resistance heater film
US7240997B2 (en) * 2004-02-25 2007-07-10 Hewlett-Packard Development Company, L.P. Fluid ejection device metal layer layouts
JP2005271446A (ja) 2004-03-25 2005-10-06 Canon Inc 液体吐出ヘッドおよびその製造方法
US20050224942A1 (en) * 2004-03-26 2005-10-13 Fan Ho Semiconductor device with a plurality of ground planes
JP2005305966A (ja) * 2004-04-26 2005-11-04 Canon Inc 液体吐出ヘッド
US7267430B2 (en) 2005-03-29 2007-09-11 Lexmark International, Inc. Heater chip for inkjet printhead with electrostatic discharge protection
JP2006334889A (ja) 2005-06-01 2006-12-14 Canon Inc インクジェットヘッド用基板の製造方法、インクジェットヘッド用基板およびインクジェットヘッド
JP2008149601A (ja) * 2006-12-19 2008-07-03 Canon Inc インクジェット記録方法
JP4932558B2 (ja) 2007-03-26 2012-05-16 株式会社ショーワ 電動パワーステアリング装置
JP5100243B2 (ja) * 2007-08-07 2012-12-19 キヤノン株式会社 液体吐出ヘッド

Also Published As

Publication number Publication date
TWI467657B (zh) 2015-01-01
PT2229279E (pt) 2012-07-25
JP5539895B2 (ja) 2014-07-02
PL2229279T3 (pl) 2012-09-28
ES2386481T3 (es) 2012-08-21
EP2229279A4 (de) 2010-12-22
TW200937529A (en) 2009-09-01
US10272679B2 (en) 2019-04-30
US9555630B2 (en) 2017-01-31
WO2009073019A1 (en) 2009-06-11
CN101883683B (zh) 2012-06-20
US20100283818A1 (en) 2010-11-11
US20170015099A1 (en) 2017-01-19
EP2229279B1 (de) 2012-04-18
CN101883683A (zh) 2010-11-10
EP2229279A1 (de) 2010-09-22
JP2011505272A (ja) 2011-02-24

Similar Documents

Publication Publication Date Title
TW200802653A (en) Semiconductor apparatus and method of producing the same
TW200741968A (en) Butted contact structure and method for forming the same
WO2009134095A3 (ko) 발광 소자 및 그 제조방법
WO2010036055A3 (ko) 3족 질화물 반도체 발광소자
BRPI0811574A2 (pt) Conector elétrico
TW200802790A (en) Electronic substrate, semiconductor device, and electronic device
MX337097B (es) Recubrimiento de piso mejorado.
WO2008007258A3 (en) Power amplifier assembly
JP2010003295A5 (de)
TW201207053A (en) Thick-film pastes containing lead-tellurium-lithium-oxides, and their use in the manufacture of semiconductor devices
TW200701264A (en) Inductor
ATE532126T1 (de) Berührungsoberfläche mit isolierschicht
TW200802743A (en) High frequency device module and method for manufacturing the same
WO2010065301A3 (en) Method of enabling selective area plating on a substrate
EP2355196A3 (de) Gehäuse für lichtemittierende Vorrichtung, Verfahren zu dessen Herstellung und Beleuchtungssystem
JP2013115648A5 (de)
ATE553928T1 (de) Elektrische verbindung von elektrisch isolierten druckkopfchiperdungsnetzen als flexible schaltung
TW200701436A (en) Semiconductor integrated circuit including a power supply, semiconductor system including a semiconductor integrated circuit, and method of forming a semiconductor integrated circuit
EP2448014A3 (de) Lichtemittierendes Halbleiterbauelement
WO2012092092A3 (en) A method and apparatus for mounting electronic components on an antenna structure
WO2008118824A3 (en) Signaling circuit and method for integrated circuit devices and systems
CN105636351B (zh) 柔性线路板及移动终端
TW200710884A (en) Heat sink for integrated circuit devices
DE502006003937D1 (de) Flächige beleuchtungseinrichtung
WO2009134629A3 (en) Anisotropic conductive film attachment for radiation detector