ATE556435T1 - Verstärktes substrat mit metamaterialien - Google Patents

Verstärktes substrat mit metamaterialien

Info

Publication number
ATE556435T1
ATE556435T1 AT06842564T AT06842564T ATE556435T1 AT E556435 T1 ATE556435 T1 AT E556435T1 AT 06842564 T AT06842564 T AT 06842564T AT 06842564 T AT06842564 T AT 06842564T AT E556435 T1 ATE556435 T1 AT E556435T1
Authority
AT
Austria
Prior art keywords
values
rlc
sections
meta
metamaterials
Prior art date
Application number
AT06842564T
Other languages
English (en)
Inventor
Chris Wyland
Original Assignee
Taiwan Semiconductor Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiwan Semiconductor Mfg filed Critical Taiwan Semiconductor Mfg
Application granted granted Critical
Publication of ATE556435T1 publication Critical patent/ATE556435T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
    • H01Q15/0006—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices
    • H01Q15/0086—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices said selective devices having materials with a synthesized negative refractive index, e.g. metamaterials or left-handed materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0236—Electromagnetic band-gap structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Filters And Equalizers (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
AT06842564T 2005-12-15 2006-12-15 Verstärktes substrat mit metamaterialien ATE556435T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US75109505P 2005-12-15 2005-12-15
PCT/IB2006/054899 WO2007069224A2 (en) 2005-12-15 2006-12-15 Enhanced substrate using metamaterials

Publications (1)

Publication Number Publication Date
ATE556435T1 true ATE556435T1 (de) 2012-05-15

Family

ID=38050195

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06842564T ATE556435T1 (de) 2005-12-15 2006-12-15 Verstärktes substrat mit metamaterialien

Country Status (6)

Country Link
US (1) US8237516B2 (de)
EP (2) EP1964174B1 (de)
JP (1) JP2009519603A (de)
CN (1) CN101331606A (de)
AT (1) ATE556435T1 (de)
WO (1) WO2007069224A2 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8383959B2 (en) * 2005-04-18 2013-02-26 Stephen Burns Kessler Metamaterial spheric alignment mechanism
US8451072B2 (en) 2007-02-07 2013-05-28 Taiwan Semiconductor Manufacturing Co., Ltd. Method for transmission lines using meta-materials
US9006098B2 (en) 2008-08-22 2015-04-14 Taiwan Semiconductor Manufacturing Company, Ltd. Impedance controlled electrical interconnection employing meta-materials
DE102010018645A1 (de) 2010-04-28 2011-11-03 Rheinmetall Waffe Munition Gmbh Metamaterial
CN102683869B (zh) * 2011-03-15 2014-12-24 深圳光启高等理工研究院 用作绝缘体的超材料
WO2013029372A1 (zh) * 2011-08-31 2013-03-07 深圳光启高等理工研究院 微带线
CN103159168B (zh) * 2011-12-14 2015-09-16 深圳光启高等理工研究院 一种确定具有最大带宽特性的超材料单元结构的方法
WO2013181173A1 (en) * 2012-05-30 2013-12-05 General Electric Company Sensor apparatus for measurement of material properties
CN102856663B (zh) * 2012-08-24 2014-07-23 电子科技大学 一种超材料宽带红外吸波结构材料
KR102093159B1 (ko) * 2014-05-23 2020-03-25 삼성전기주식회사 인쇄회로기판 및 이를 이용한 카메라 모듈용 인쇄회로기판
KR101901695B1 (ko) * 2014-07-02 2018-09-27 삼성전기 주식회사 인쇄회로기판 및 이를 이용한 카메라 모듈용 인쇄회로기판
US9595765B1 (en) * 2014-07-05 2017-03-14 Continental Microwave & Tool Co., Inc. Slotted waveguide antenna with metamaterial structures
RU2591282C1 (ru) * 2015-04-30 2016-07-20 Федеральное государственное бюджетное образовательное учреждение высшего образования "Сибирский государственный университет геосистем и технологий" (СГУГиТ) Устройство квазиоптической линии передачи терагерцовых волн
US10158339B2 (en) 2015-12-11 2018-12-18 Intel Corporation Capacitive compensation structures using partially meshed ground planes
RU2744027C1 (ru) * 2020-03-23 2021-03-02 Федеральное государственное бюджетное образовательное учреждение высшего образования "Сибирский государственный университет геосистем и технологий" Квазиоптический волновод
CN111814419B (zh) * 2020-07-27 2024-01-16 中国电子科技集团公司第九研究所 通讯用集总参数环行器中集总电容选择设计方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003030298A1 (en) 2001-08-23 2003-04-10 Broadcom Corporation Apparatus for generating a magnetic interface and applications of the same
US7583167B2 (en) * 2004-03-09 2009-09-01 The Regents Of The University Of Colorado High frequency magnetic thin film filter

Also Published As

Publication number Publication date
JP2009519603A (ja) 2009-05-14
WO2007069224A3 (en) 2007-11-15
EP2273550A2 (de) 2011-01-12
EP1964174A2 (de) 2008-09-03
EP1964174B1 (de) 2012-05-02
CN101331606A (zh) 2008-12-24
WO2007069224A2 (en) 2007-06-21
US20080266028A1 (en) 2008-10-30
US8237516B2 (en) 2012-08-07
EP2273550A3 (de) 2011-08-10

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