ATE73552T1 - Linienbreitenverlustmessung. - Google Patents

Linienbreitenverlustmessung.

Info

Publication number
ATE73552T1
ATE73552T1 AT89304850T AT89304850T ATE73552T1 AT E73552 T1 ATE73552 T1 AT E73552T1 AT 89304850 T AT89304850 T AT 89304850T AT 89304850 T AT89304850 T AT 89304850T AT E73552 T1 ATE73552 T1 AT E73552T1
Authority
AT
Austria
Prior art keywords
bars
pattern
unity
bar
linewidth
Prior art date
Application number
AT89304850T
Other languages
English (en)
Inventor
Michael Dennis Gill
David William John Blackburn
Malcolm Paul Saunders
Original Assignee
British Telecomm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by British Telecomm filed Critical British Telecomm
Application granted granted Critical
Publication of ATE73552T1 publication Critical patent/ATE73552T1/de

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70625—Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
    • G03F1/44—Testing or measuring features, e.g. grid patterns, focus monitors, sawtooth scales or notched scales
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
  • Dental Tools And Instruments Or Auxiliary Dental Instruments (AREA)
  • Soft Magnetic Materials (AREA)
  • Other Investigation Or Analysis Of Materials By Electrical Means (AREA)
  • Prostheses (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Measurement And Recording Of Electrical Phenomena And Electrical Characteristics Of The Living Body (AREA)
AT89304850T 1988-05-17 1989-05-12 Linienbreitenverlustmessung. ATE73552T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB888811678A GB8811678D0 (en) 1988-05-17 1988-05-17 Linewidth loss measurement
EP89304850A EP0342881B1 (de) 1988-05-17 1989-05-12 Linienbreitenverlustmessung

Publications (1)

Publication Number Publication Date
ATE73552T1 true ATE73552T1 (de) 1992-03-15

Family

ID=10637056

Family Applications (1)

Application Number Title Priority Date Filing Date
AT89304850T ATE73552T1 (de) 1988-05-17 1989-05-12 Linienbreitenverlustmessung.

Country Status (7)

Country Link
US (1) US4963924A (de)
EP (1) EP0342881B1 (de)
JP (1) JPH0265151A (de)
AT (1) ATE73552T1 (de)
CA (1) CA1298414C (de)
DE (1) DE68900956D1 (de)
GB (1) GB8811678D0 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5049925A (en) * 1990-04-20 1991-09-17 Micron Technology, Inc. Method and apparatus for focusing a wafer stepper
US5044750A (en) * 1990-08-13 1991-09-03 National Semiconductor Corporation Method for checking lithography critical dimensions
EP0477957A1 (de) * 1990-09-28 1992-04-01 Nec Corporation Verfahren zum Herstellen von integrierten Halbleiterschaltkreisen mit mehreren lithographischen Prozessschritten und Teststrukturen
US5329334A (en) * 1993-03-02 1994-07-12 Lsi Logic Corporation Integrated circuit test reticle and alignment mark optimization method
US5627624A (en) * 1994-10-31 1997-05-06 Lsi Logic Corporation Integrated circuit test reticle and alignment mark optimization method
US7016054B2 (en) * 2003-03-31 2006-03-21 Lsi Logic Corporation Lithography line width monitor reflecting chip-wide average feature size
US7966583B2 (en) * 2008-07-08 2011-06-21 Synopsys, Inc. Method and apparatus for determining the effect of process variations
JP5483286B2 (ja) * 2010-08-12 2014-05-07 株式会社日立ハイテクノロジーズ 検査装置用の標準ウエハ

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5453864A (en) * 1977-10-05 1979-04-27 Sanyo Electric Co Ltd Monitoring method of line widths
JPS577933A (en) * 1980-06-19 1982-01-16 Nec Corp Manufacture of semiconductor device
JPS582845A (ja) * 1981-06-30 1983-01-08 Toshiba Corp フォトマスク及びパタ−ン評価方法
US4538105A (en) * 1981-12-07 1985-08-27 The Perkin-Elmer Corporation Overlay test wafer
DE3305977A1 (de) * 1983-02-21 1984-08-23 Siemens AG, 1000 Berlin und 8000 München Verfahren zur schnellen indirekten bestimmung von fotolacklinienbreiten bei der optischen projektionsbe lichtung
US4475811A (en) * 1983-04-28 1984-10-09 The Perkin-Elmer Corporation Overlay test measurement systems
KR890004566B1 (ko) * 1987-03-21 1989-11-15 삼성전자 주식회사 반도체 제조공정중의 패턴의 씨디변화를 모니타링하기 위한 테스트 패턴
US4860062A (en) * 1988-05-20 1989-08-22 Shipley Company Inc. Device and method for measuring reflective notch control in photoresists

Also Published As

Publication number Publication date
US4963924A (en) 1990-10-16
EP0342881B1 (de) 1992-03-11
GB8811678D0 (en) 1988-06-22
DE68900956D1 (de) 1992-04-16
EP0342881A1 (de) 1989-11-23
CA1298414C (en) 1992-03-31
JPH0265151A (ja) 1990-03-05

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Legal Events

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