ATE78881T1 - Leitungsmetallisierung von substraten mittels entwicklungsmittel. - Google Patents

Leitungsmetallisierung von substraten mittels entwicklungsmittel.

Info

Publication number
ATE78881T1
ATE78881T1 AT88201342T AT88201342T ATE78881T1 AT E78881 T1 ATE78881 T1 AT E78881T1 AT 88201342 T AT88201342 T AT 88201342T AT 88201342 T AT88201342 T AT 88201342T AT E78881 T1 ATE78881 T1 AT E78881T1
Authority
AT
Austria
Prior art keywords
substrates
development agent
line metallization
metallization
line
Prior art date
Application number
AT88201342T
Other languages
English (en)
Inventor
William John E Parr
Ronald Eric Hutton
Paul Yuet Yee Moy
Dieter Frank
David A Strawser
Original Assignee
Akzo Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US07/204,068 external-priority patent/US4997674A/en
Application filed by Akzo Nv filed Critical Akzo Nv
Application granted granted Critical
Publication of ATE78881T1 publication Critical patent/ATE78881T1/de

Links

AT88201342T 1987-06-30 1988-06-29 Leitungsmetallisierung von substraten mittels entwicklungsmittel. ATE78881T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US6859387A 1987-06-30 1987-06-30
US07/204,068 US4997674A (en) 1987-06-30 1988-06-08 Conductive metallization of substrates via developing agents
EP88201342A EP0297677B1 (de) 1987-06-30 1988-06-29 Leitungsmetallisierung von Substraten mittels Entwicklungsmittel

Publications (1)

Publication Number Publication Date
ATE78881T1 true ATE78881T1 (de) 1992-08-15

Family

ID=27231410

Family Applications (1)

Application Number Title Priority Date Filing Date
AT88201342T ATE78881T1 (de) 1987-06-30 1988-06-29 Leitungsmetallisierung von substraten mittels entwicklungsmittel.

Country Status (1)

Country Link
AT (1) ATE78881T1 (de)

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