ATE81247T1 - Gekuehlte baugruppe. - Google Patents

Gekuehlte baugruppe.

Info

Publication number
ATE81247T1
ATE81247T1 AT87302362T AT87302362T ATE81247T1 AT E81247 T1 ATE81247 T1 AT E81247T1 AT 87302362 T AT87302362 T AT 87302362T AT 87302362 T AT87302362 T AT 87302362T AT E81247 T1 ATE81247 T1 AT E81247T1
Authority
AT
Austria
Prior art keywords
housing
components
heat sink
cooled assembly
connector means
Prior art date
Application number
AT87302362T
Other languages
English (en)
Inventor
Raymonde Gene Clifford Artus
Original Assignee
Raymonde Gene Clifford Artus
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raymonde Gene Clifford Artus filed Critical Raymonde Gene Clifford Artus
Application granted granted Critical
Publication of ATE81247T1 publication Critical patent/ATE81247T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20463—Filling compound, e.g. potted resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0091—Housing specially adapted for small components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Separation By Low-Temperature Treatments (AREA)
AT87302362T 1986-03-26 1987-03-19 Gekuehlte baugruppe. ATE81247T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB868607526A GB8607526D0 (en) 1986-03-26 1986-03-26 Cooled component assembly
EP87302362A EP0239322B1 (de) 1986-03-26 1987-03-19 Gekühlte Baugruppe

Publications (1)

Publication Number Publication Date
ATE81247T1 true ATE81247T1 (de) 1992-10-15

Family

ID=10595280

Family Applications (1)

Application Number Title Priority Date Filing Date
AT87302362T ATE81247T1 (de) 1986-03-26 1987-03-19 Gekuehlte baugruppe.

Country Status (6)

Country Link
US (1) US4764845A (de)
EP (1) EP0239322B1 (de)
JP (1) JPH0691175B2 (de)
AT (1) ATE81247T1 (de)
DE (1) DE3781917T2 (de)
GB (1) GB8607526D0 (de)

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JPH0719991B2 (ja) * 1990-02-28 1995-03-06 三菱電機株式会社 制御装置ケース
US5060115A (en) * 1990-09-28 1991-10-22 The United States Of America As Represented By The Secretary Of The Navy Heat sink device for electronics modules packaged in cylindrical casings
US5313094A (en) * 1992-01-28 1994-05-17 International Business Machines Corportion Thermal dissipation of integrated circuits using diamond paths
US5184281A (en) * 1992-03-03 1993-02-02 Digital Equipment Corporation Heat dissipation apparatus
DE69630278T2 (de) 1996-01-30 2004-08-26 Parker-Hannifin Corp., Cleveland Kühlung durch Wärmeableitung für einen wärmeerzeugenden elektronischen Teil
WO1997041599A1 (en) * 1996-04-29 1997-11-06 Parker-Hannifin Corporation Conformal thermal interface material for electronic components
US5781412A (en) * 1996-11-22 1998-07-14 Parker-Hannifin Corporation Conductive cooling of a heat-generating electronic component using a cured-in-place, thermally-conductive interlayer having a filler of controlled particle size
DE19654115A1 (de) * 1996-12-23 1998-06-25 Asea Brown Boveri Vorrichtung zum Kühlen einer beidseitig umströmten Wand
US6432497B2 (en) 1997-07-28 2002-08-13 Parker-Hannifin Corporation Double-side thermally conductive adhesive tape for plastic-packaged electronic components
EP1014873A4 (de) 1997-09-22 2003-07-09 Ethicon Inc Kyrochirurgisches system und verfahren
US6644395B1 (en) 1999-11-17 2003-11-11 Parker-Hannifin Corporation Thermal interface material having a zone-coated release linear
US6547784B1 (en) 2000-06-23 2003-04-15 Ethicon, Inc. System and method for placement of a surgical instrument in a body cavity
JP2004518294A (ja) 2001-01-22 2004-06-17 パーカー−ハニフイン・コーポレーシヨン クリーンなレリースの、相変化のターミナルインターフエース
US6965071B2 (en) * 2001-05-10 2005-11-15 Parker-Hannifin Corporation Thermal-sprayed metallic conformal coatings used as heat spreaders
US6758831B2 (en) 2001-09-24 2004-07-06 Ethicon, Inc. Device and method for aligning with the tubal ostium
WO2003067658A2 (en) * 2002-02-06 2003-08-14 Parker Hannifin Corporation Thermal management materials having a phase change dispersion
US6946190B2 (en) * 2002-02-06 2005-09-20 Parker-Hannifin Corporation Thermal management materials
US6960203B2 (en) * 2002-06-26 2005-11-01 Ethicon, Inc. Thermal ablation with deployable cage
US6956739B2 (en) 2002-10-29 2005-10-18 Parker-Hannifin Corporation High temperature stable thermal interface material
US8119191B2 (en) * 2003-01-16 2012-02-21 Parker-Hannifin Corporation Dispensable cured resin
US7095615B2 (en) * 2003-11-13 2006-08-22 Honeywell International, Inc. Environmentally tuned circuit card assembly and method for manufacturing the same
US6992888B1 (en) * 2004-03-08 2006-01-31 Lockheed Martin Corporation Parallel cooling of heat source mounted on a heat sink by means of liquid coolant
US7147041B2 (en) * 2004-05-03 2006-12-12 Parker-Hannifin Corporation Lightweight heat sink
JP2008541490A (ja) * 2005-05-19 2008-11-20 パーカー．ハニフィン．コーポレイション 熱積層モジュール
GB2432460B8 (en) * 2005-11-17 2010-08-18 Iceotope Ltd Computer apparatus
US7954236B2 (en) 2007-02-08 2011-06-07 Lundell Manufacturing Corporation Method of assembling a sealed thermal interface
US8448693B2 (en) * 2007-02-08 2013-05-28 Lundell Manufacturing Corporation Sealed thermal interface component
US7492594B2 (en) * 2007-05-03 2009-02-17 Hamilton Sundstrand Corporation Electronic circuit modules cooling
DE102007027469A1 (de) * 2007-06-14 2008-12-18 Carl Zeiss Microimaging Gmbh Wärmeleitpaste
US20110044003A1 (en) * 2007-07-17 2011-02-24 Huang-Han Chen Heatsink structure
DE102007049035B4 (de) * 2007-10-11 2011-01-13 GE Fanuc Intelligent Platforms Embedded Systems, Inc. (n.d.Ges.d. Staates Delaware) Chipkühlvorrichtung mit Keilelement
US20120133072A1 (en) 2009-08-12 2012-05-31 Parker-Hannifin Corporation Fully-cured thermally or electrically conductive form-in-place gap filler
US9173702B2 (en) 2009-11-10 2015-11-03 Cardea Medsystems (Tianjin) Co., Ltd. Hollow body cavity ablation apparatus
US10660697B2 (en) 2009-11-10 2020-05-26 Cardea Medsystems (Tianjin) Co., Ltd. Hollow body cavity ablation apparatus
WO2012104017A1 (de) * 2011-02-04 2012-08-09 Sew-Eurodrive Gmbh & Co. Kg Elektrisches gerät

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Publication number Priority date Publication date Assignee Title
US1751939A (en) * 1928-07-12 1930-03-25 Telefunken Gmbh Insulation of electrical apparatus
GB578869A (en) * 1944-06-29 1946-07-15 Westinghouse Electric Int Co Improvements in or relating to dielectric compositions and sealed electrical apparatus impregnated therewith
US2550452A (en) * 1945-03-07 1951-04-24 Gen Electric Compound dielectric materials
GB1218852A (en) * 1968-04-02 1971-01-13 English Electric Co Ltd High voltage thyristor equipment
US3616533A (en) * 1969-10-28 1971-11-02 North American Rockwell Method of protecting articles in high temperature environment
IL39936A (en) * 1971-07-30 1975-04-25 De Beers Ind Diamond A diamond particle particularly for use in heat sinks
US3699394A (en) * 1971-11-01 1972-10-17 Powercube Corp Modular circuit package with enhanced heat dissipation
DE2305484C3 (de) * 1973-02-05 1978-08-24 Siemens Ag, 1000 Berlin Und 8000 Muenchen Erregereinrichtung für eine gleichstromerregte Drehstrom-Lichtmaschine
US3869563A (en) * 1973-09-27 1975-03-04 Motorola Inc Encapsulation housing for electronic circuit boards or the like and method of encapsulating
US4104344A (en) * 1975-09-12 1978-08-01 Brigham Young University High thermal conductivity substrate
US4299715A (en) * 1978-04-14 1981-11-10 Whitfield Fred J Methods and materials for conducting heat from electronic components and the like
US4449580A (en) * 1981-06-30 1984-05-22 International Business Machines Corporation Vertical wall elevated pressure heat dissipation system
DE3144131A1 (de) * 1981-11-06 1983-05-19 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Gehaeuse fuer ein geraet der steuer-, mess-, regel- oder datenverarbeitungstechnik
DE3247985C2 (de) * 1982-12-24 1992-04-16 W.C. Heraeus Gmbh, 6450 Hanau Keramischer Träger
FR2538989B1 (fr) * 1982-12-30 1985-10-04 Thomson Csf Structure d'assemblage de circuits electroniques complexes, et procede d'amelioration de la fiabilite d'un tel assemblage
JPS59213151A (ja) * 1983-05-18 1984-12-03 Hitachi Ltd 半導体素子の冷却装置

Also Published As

Publication number Publication date
DE3781917D1 (de) 1992-11-05
EP0239322B1 (de) 1992-09-30
EP0239322A3 (en) 1989-05-03
DE3781917T2 (de) 1993-06-09
EP0239322A2 (de) 1987-09-30
GB8607526D0 (en) 1986-04-30
JPH0691175B2 (ja) 1994-11-14
US4764845A (en) 1988-08-16
JPS62252956A (ja) 1987-11-04

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties