ATE88223T1 - Baeder und verfahren zum chemischen polieren von kupfer- oder kupferlegierung-oberflaechen. - Google Patents

Baeder und verfahren zum chemischen polieren von kupfer- oder kupferlegierung-oberflaechen.

Info

Publication number
ATE88223T1
ATE88223T1 AT90202734T AT90202734T ATE88223T1 AT E88223 T1 ATE88223 T1 AT E88223T1 AT 90202734 T AT90202734 T AT 90202734T AT 90202734 T AT90202734 T AT 90202734T AT E88223 T1 ATE88223 T1 AT E88223T1
Authority
AT
Austria
Prior art keywords
copper
baths
chemical polishing
processes
alloy surfaces
Prior art date
Application number
AT90202734T
Other languages
English (en)
Inventor
Daniel Tytgat
Stefaan Magnus
Original Assignee
Solvay
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Solvay filed Critical Solvay
Application granted granted Critical
Publication of ATE88223T1 publication Critical patent/ATE88223T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F3/00—Brightening metals by chemical means
    • C23F3/04—Heavy metals
    • C23F3/06—Heavy metals with acidic solutions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Paper (AREA)
  • Jib Cranes (AREA)
  • Separation Using Semi-Permeable Membranes (AREA)
AT90202734T 1989-10-24 1990-10-15 Baeder und verfahren zum chemischen polieren von kupfer- oder kupferlegierung-oberflaechen. ATE88223T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
BE8901150A BE1003761A3 (fr) 1989-10-24 1989-10-24 Bains et procede pour le polissage chimique de surfaces en cuivre ou en alliage de cuivre.
EP90202734A EP0425012B1 (de) 1989-10-24 1990-10-15 Bäder und Verfahren zum chemischen Polieren von Kupfer- oder Kupferlegierung-Oberflächen

Publications (1)

Publication Number Publication Date
ATE88223T1 true ATE88223T1 (de) 1993-04-15

Family

ID=3884370

Family Applications (1)

Application Number Title Priority Date Filing Date
AT90202734T ATE88223T1 (de) 1989-10-24 1990-10-15 Baeder und verfahren zum chemischen polieren von kupfer- oder kupferlegierung-oberflaechen.

Country Status (10)

Country Link
US (1) US5098517A (de)
EP (1) EP0425012B1 (de)
JP (1) JPH03193886A (de)
KR (1) KR910008167A (de)
AT (1) ATE88223T1 (de)
BE (1) BE1003761A3 (de)
CA (1) CA2028195A1 (de)
DE (1) DE69001349D1 (de)
FI (1) FI905229A7 (de)
NO (1) NO904579L (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5242542A (en) * 1992-08-17 1993-09-07 Alain Masse Solution and method for removing zinc from the surface of a galvanized metal
US5279707A (en) * 1992-10-23 1994-01-18 Time Savers Die discoloration remover solution and method
PL309779A1 (en) * 1993-01-11 1995-11-13 Macdermid Phosphate compositions and method of obtaining them, especially for use in production of printed circuit boards employing organic protective films
US5630950A (en) * 1993-07-09 1997-05-20 Enthone-Omi, Inc. Copper brightening process and bath
DE4402788A1 (de) * 1994-01-31 1995-08-10 Emil Krechen Industrievertretu Verfahren zum Abtragen von Metallen
US5916453A (en) 1996-09-20 1999-06-29 Fujitsu Limited Methods of planarizing structures on wafers and substrates by polishing
US6858097B2 (en) * 1999-12-30 2005-02-22 Henkel Kommanditgesellschaft Auf Aktien (Henkel Kgaa) Brightening/passivating metal surfaces without hazard from emissions of oxides of nitrogen
US6368969B1 (en) 2000-06-30 2002-04-09 International Business Machines Corporation Chemical-mechanical polishing methods
US20100062693A1 (en) * 2008-09-05 2010-03-11 Taiwan Semiconductor Manufacturing Co., Ltd. Two step method and apparatus for polishing metal and other films in semiconductor manufacturing
JP6043148B2 (ja) * 2012-10-25 2016-12-14 ユニチカ株式会社 銅エッチング液
CN103849876B (zh) * 2012-12-03 2016-04-06 浙江伟星实业发展股份有限公司 一种化学抛光方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE284558C (de) * 1900-01-01
BE652530A (de) * 1963-09-02
JPS512975A (ja) * 1974-06-28 1976-01-12 Hitachi Ltd Etsuchingueki
GB1449525A (en) * 1974-08-21 1976-09-15 Tokai Electro Chemical Co Method of stabilizing acid aqueous solutions of hydrogen peroxide
IT1083401B (it) * 1977-05-27 1985-05-21 Alfachimici Spa Soluzione acida per l'attacco selettivo del rame
SU1211338A1 (ru) * 1984-07-18 1986-02-15 Ордена Трудового Красного Знамени Институт Органической И Физической Химии Им.А.Е.Арбузова Раствор дл химического полировани меди и ее сплавов
FR2621052A1 (fr) * 1987-09-25 1989-03-31 Solvay Bains et procede pour le polissage chimique de surfaces en cuivre ou en alliage de cuivre

Also Published As

Publication number Publication date
US5098517A (en) 1992-03-24
NO904579D0 (no) 1990-10-23
CA2028195A1 (fr) 1991-04-25
KR910008167A (ko) 1991-05-30
EP0425012B1 (de) 1993-04-14
EP0425012A1 (de) 1991-05-02
DE69001349D1 (de) 1993-05-19
NO904579L (no) 1991-04-25
FI905229A0 (fi) 1990-10-24
JPH03193886A (ja) 1991-08-23
BE1003761A3 (fr) 1992-06-09
FI905229A7 (fi) 1991-04-25

Similar Documents

Publication Publication Date Title
DE3875558D1 (de) Loesung zur anwendung als spuelfuessigkeit in der zerstoerung von koerperfremden ablagerungen in menschlichen und tierischen geweben oder koerperhohlraeumen.
DE69001349D1 (de) Baeder und verfahren zum chemischen polieren von kupfer- oder kupferlegierung-oberflaechen.
SE7704350L (sv) Beleggningsforfarande
ATE42206T1 (de) Verfahren und zusammensetzung zur gleichzeitigen reinigung und desinfektion von kontaktlinsen.
DE59501119D1 (de) Verfahren zur Nachbehandlung von platten-, folien- oder bandförmigem Material, Träger aus derartigem Material und seine Verwendung für Offsetdruckplatten
ATE244204T1 (de) Verfahren und vorrichtung zur vor-ort- halogenbehandlung von wässrigen lösungen
DE69022345D1 (de) Verfahren zur Entwicklung von Chlordioxyd und Zusammensetzungen für die Desinfektion.
DE58902313D1 (de) Verfahren zur sterilisation von blut, plasma, blut- und plasmaderivaten, zellsuspensionen oder dgl.
DE60333938D1 (de) Lösung und verfahren zum beizen von rostfreiem stahl
ATE21269T1 (de) Stabilisierung von waessrigen loesungen,die wasserstoffperoxid, fluorwasserstoff und metallionen enthalten.
ES2141265T3 (es) Oxidacion fotoasistida de especies en solucion.
DE50209139D1 (de) Zweikomponenten-Mittel mit zeitlichem pH-Gradienten und Verfahren zur Behandlung von Haaren
ATE48661T1 (de) Elektrolyt zum elektrochemischen polieren von metalloberflaechen.
ES2088430T3 (es) Sistema para desinfectar lentes de contacto.
DE69100811D1 (de) Verfahren zur behandlung von einer wässerigen lösung, die insbesondere salpetersäure und flusssäure enthält.
DE59502709D1 (de) Vorrichtung zur elektrolytischen behandlung von plattenförmigen werkstücken, insbesondere von leiterplatten
KR960007827A (ko) 침출가능한 납을 감소시키기 위한 놋쇠 부품 처리 방법
HU912030D0 (en) Process and bath for the polishing of stainless steel surfaces
ATE47819T1 (de) Verfahren und vorrichtung zur durchfuehrung der oxidation im anthrachinonverfahren zur herstellung von wasserstoffperoxid.
KR880008943A (ko) 수용액으로 부터 중금속 및 다른 이온들을 제거하는 방법
DE3750465D1 (de) Verfahren zur chemischen Phosphat-Umwandlungsbehandlung für Eisengegenstände.
ES2042087T3 (es) Procedimiento para la desalinizacion de soluciones de electrolitos que contienen disolventes, por electrodialisis.
ATE44553T1 (de) Zusammensetzungen und verfahren zum chemischen polieren von stahloberflaechen.
DE3871143D1 (de) Verfahren zur chemischen nachbehandlung von stahlblechoberflaechen.
ES2068577T3 (es) Baños de niquel acidos, conteniendo 1-(2-sulfoetil)-piridiniumbetaina.

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties