ATE91936T1 - Flussmittelloses auftragen einer metall enthaltenden schicht. - Google Patents

Flussmittelloses auftragen einer metall enthaltenden schicht.

Info

Publication number
ATE91936T1
ATE91936T1 AT89102084T AT89102084T ATE91936T1 AT E91936 T1 ATE91936 T1 AT E91936T1 AT 89102084 T AT89102084 T AT 89102084T AT 89102084 T AT89102084 T AT 89102084T AT E91936 T1 ATE91936 T1 AT E91936T1
Authority
AT
Austria
Prior art keywords
metal
flux
coating
applying
application
Prior art date
Application number
AT89102084T
Other languages
English (en)
Inventor
Mark Stephen Nowotarski
Original Assignee
Praxair Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Praxair Technology Inc filed Critical Praxair Technology Inc
Application granted granted Critical
Publication of ATE91936T1 publication Critical patent/ATE91936T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/02—Pretreatment of the material to be coated, e.g. for coating on selected surface areas
    • C23C2/022—Pretreatment of the material to be coated, e.g. for coating on selected surface areas by heating
    • C23C2/0222—Pretreatment of the material to be coated, e.g. for coating on selected surface areas by heating in a reactive atmosphere, e.g. oxidising or reducing atmosphere
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/38—Selection of media, e.g. special atmospheres for surrounding the working area
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
    • C23C2/06—Zinc or cadmium or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/26—After-treatment
    • C23C2/28—Thermal after-treatment, e.g. treatment in oil bath
    • C23C2/29—Cooling or quenching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3468—Application of molten solder, e.g. dip soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/086—Using an inert gas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating With Molten Metal (AREA)
  • Chemically Coating (AREA)
  • Laminated Bodies (AREA)
  • Molten Solder (AREA)
AT89102084T 1988-02-08 1989-02-07 Flussmittelloses auftragen einer metall enthaltenden schicht. ATE91936T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/154,081 US4821947A (en) 1988-02-08 1988-02-08 Fluxless application of a metal-comprising coating
EP89102084A EP0330867B1 (de) 1988-02-08 1989-02-07 Flussmittelloses Auftragen einer Metall enthaltenden Schicht

Publications (1)

Publication Number Publication Date
ATE91936T1 true ATE91936T1 (de) 1993-08-15

Family

ID=22549922

Family Applications (1)

Application Number Title Priority Date Filing Date
AT89102084T ATE91936T1 (de) 1988-02-08 1989-02-07 Flussmittelloses auftragen einer metall enthaltenden schicht.

Country Status (10)

Country Link
US (1) US4821947A (de)
EP (1) EP0330867B1 (de)
JP (1) JPH02147161A (de)
KR (1) KR930007144B1 (de)
AT (1) ATE91936T1 (de)
BR (1) BR8900513A (de)
CA (1) CA1337037C (de)
DE (1) DE68907745T2 (de)
ES (1) ES2042816T3 (de)
MX (1) MX165299B (de)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4937006A (en) * 1988-07-29 1990-06-26 International Business Machines Corporation Method and apparatus for fluxless solder bonding
US4979664A (en) * 1989-11-15 1990-12-25 At&T Bell Laboratories Method for manufacturing a soldered article
US5044542A (en) * 1989-11-22 1991-09-03 Electrovert Ltd. Shield gas wave soldering
BR9006515A (pt) * 1989-12-26 1991-10-01 Union Carbide Ind Gases Tech Revestimento e juncao de solda sem fundente
US5255840A (en) * 1989-12-26 1993-10-26 Praxair Technology, Inc. Fluxless solder coating and joining
US5121875A (en) * 1991-02-22 1992-06-16 Union Carbide Industrial Gases Technology Corporation Wave soldering in a protective atmosphere enclosure over a solder pot
US5176307A (en) * 1991-02-22 1993-01-05 Praxair Technology, Inc. Wave soldering in a protective atmosphere enclosure over a solder pot
GB9118115D0 (en) * 1991-08-22 1991-10-09 Multicore Solders Ltd Lead-based solder alloy and its use in soft soldering
WO1993008949A1 (fr) * 1991-10-28 1993-05-13 Jacqueline Brizais Installation de soudage a la vague
US5158224A (en) * 1992-02-24 1992-10-27 Robotic Process Systems, Inc. Soldering machine having a vertical transfer oven
GB2281309B (en) * 1993-08-27 1997-04-23 Boc Group Plc A method of galvanising
NL9301935A (nl) * 1993-11-08 1995-06-01 Soltec Bv Soldeermachine met aangepaste soldeertoren.
US5499754A (en) * 1993-11-19 1996-03-19 Mcnc Fluxless soldering sample pretreating system
US5409159A (en) * 1994-02-28 1995-04-25 L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Apparatus and methods for inerting solder during wave soldering operations
US5411200A (en) * 1994-02-28 1995-05-02 American Air Liquide, Inc. Process and apparatus for the wave soldering of circuit boards
US5632631A (en) * 1994-06-07 1997-05-27 Tessera, Inc. Microelectronic contacts with asperities and methods of making same
US5615824A (en) * 1994-06-07 1997-04-01 Tessera, Inc. Soldering with resilient contacts
US5615825A (en) * 1995-05-12 1997-04-01 Mcnc Fluorinated fluxless soldering
US6013381A (en) * 1996-12-06 2000-01-11 Mcnc Fluorinated fluxless soldering
WO2001028726A1 (en) * 1998-04-20 2001-04-26 Senju Metal Industry Co., Ltd. Solder coating material and production method therefor
DE19955659A1 (de) * 1999-11-19 2001-05-31 Messer Griesheim Gmbh Verfahren und Vorrichtung zum flussmittelfreien Löten mit reaktivgasangereicherten Metallschmelzen
KR100748613B1 (ko) * 2007-02-20 2007-08-10 김진택 다중변환 주파수를 이용한 전자유량 측정시스템.
EP1967312A1 (de) * 2007-03-06 2008-09-10 Siemens Aktiengesellschaft Verfahren zur Lötreparatur eines Bauteils unter Vakuum und einem eingestellten Sauerstoffpartialdruck

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3705457A (en) * 1970-11-02 1972-12-12 Electrovert Mfg Co Ltd Wave soldering using inert gas to protect pretinned and soldered surfaces of relatively flat workpieces
DE2346993C2 (de) * 1973-09-18 1975-03-13 Siemens Ag, 1000 Berlin Und 8000 Muenchen Lotbad zum fluBmittelfreien Verzinnen mittels Ultraschall
SU563240A1 (ru) * 1974-08-09 1977-06-30 Предприятие П/Я Г-4645 Устройство дл ультразвуковой пайки и лужени изделий волной припо
US3993236A (en) * 1975-09-08 1976-11-23 Blackstone Corporation Methods and apparatus for soldering
JPS5395854A (en) * 1977-02-02 1978-08-22 Asahi Glass Co Ltd Method and apparatus for soldering with no flux
JPS579011U (de) * 1980-05-31 1982-01-18
US4530457A (en) * 1982-01-12 1985-07-23 Electrovert Ltd. Wave-soldering of printed circuit boards
US4568012A (en) * 1982-01-14 1986-02-04 Toshiba Seiki Co., Ltd. Soldering apparatus
JPS5927771A (ja) * 1982-08-09 1984-02-14 Hitachi Ltd 半田付け装置
US4504007A (en) * 1982-09-14 1985-03-12 International Business Machines Corporation Solder and braze fluxes and processes for using the same
DE3309648A1 (de) * 1983-03-15 1984-09-20 Siemens AG, 1000 Berlin und 8000 München Verfahren zum loeten plattenfoermiger schaltungstraeger innerhalb einer schutzgasloeteinrichtung
US4538757A (en) * 1983-08-01 1985-09-03 Motorola, Inc. Wave soldering in a reducing atmosphere
JPS6182965A (ja) * 1984-09-28 1986-04-26 Ginya Ishii 噴流はんだ装置のはんだ酸化防止方法
US4610391A (en) * 1984-12-18 1986-09-09 Union Carbide Corporation Process for wave soldering
US4684056A (en) * 1985-05-03 1987-08-04 Electrovert Limited Vibratory wave soldering
JPS61286058A (ja) * 1985-06-11 1986-12-16 Meisho Kk 噴流式半田槽
US4646958A (en) * 1985-10-31 1987-03-03 International Business Machines Corp. Fluxless soldering process using a silane atmosphere
DD246718A1 (de) * 1986-03-18 1987-06-17 Univ Schiller Jena Verfahren zum rueckstandsarmen weichloeten von metallen
JPS62275568A (ja) * 1986-05-22 1987-11-30 Tamura Seisakusho Co Ltd 噴流式はんだ付け装置

Also Published As

Publication number Publication date
DE68907745D1 (de) 1993-09-02
MX165299B (es) 1992-11-04
DE68907745T2 (de) 1993-11-11
US4821947A (en) 1989-04-18
JPH02147161A (ja) 1990-06-06
BR8900513A (pt) 1989-10-03
ES2042816T3 (es) 1993-12-16
KR930007144B1 (ko) 1993-07-30
KR890013207A (ko) 1989-09-22
EP0330867A1 (de) 1989-09-06
CA1337037C (en) 1995-09-19
EP0330867B1 (de) 1993-07-28

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Legal Events

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