ATE93116T1 - Werkstoffe zur verwendung bei der herstellung von elektronischen verbindungen. - Google Patents

Werkstoffe zur verwendung bei der herstellung von elektronischen verbindungen.

Info

Publication number
ATE93116T1
ATE93116T1 AT86308774T AT86308774T ATE93116T1 AT E93116 T1 ATE93116 T1 AT E93116T1 AT 86308774 T AT86308774 T AT 86308774T AT 86308774 T AT86308774 T AT 86308774T AT E93116 T1 ATE93116 T1 AT E93116T1
Authority
AT
Austria
Prior art keywords
water soluble
retaining member
water
materials
layers
Prior art date
Application number
AT86308774T
Other languages
English (en)
Inventor
Geoffrey B Wong
Arthur William Lopez Jr
Original Assignee
Raychem Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raychem Corp filed Critical Raychem Corp
Application granted granted Critical
Publication of ATE93116T1 publication Critical patent/ATE93116T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3478—Application of solder preforms; Transferring prefabricated solder patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10424—Frame holders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0415—Small preforms other than balls, e.g. discs, cylinders or pillars
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/913—Material designed to be responsive to temperature, light, moisture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31855—Of addition polymer from unsaturated monomers
    • Y10T428/3188—Next to cellulosic
    • Y10T428/31895—Paper or wood

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Conductive Materials (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Polyesters Or Polycarbonates (AREA)
AT86308774T 1985-11-12 1986-11-11 Werkstoffe zur verwendung bei der herstellung von elektronischen verbindungen. ATE93116T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/797,287 US4655382A (en) 1985-11-12 1985-11-12 Materials for use in forming electronic interconnect
EP19860308774 EP0228791B1 (de) 1985-11-12 1986-11-11 Werkstoffe zur Verwendung bei der Herstellung von elektronischen Verbindungen

Publications (1)

Publication Number Publication Date
ATE93116T1 true ATE93116T1 (de) 1993-08-15

Family

ID=25170407

Family Applications (1)

Application Number Title Priority Date Filing Date
AT86308774T ATE93116T1 (de) 1985-11-12 1986-11-11 Werkstoffe zur verwendung bei der herstellung von elektronischen verbindungen.

Country Status (6)

Country Link
US (1) US4655382A (de)
EP (1) EP0228791B1 (de)
JP (1) JP2539800B2 (de)
AT (1) ATE93116T1 (de)
CA (1) CA1269603A (de)
DE (1) DE3688879T2 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4753617A (en) * 1986-11-17 1988-06-28 Raychem Corporation Electrical device having flexible electrical contacts
JPH01121752A (ja) * 1987-11-06 1989-05-15 Terumo Corp 試験具
US5591037A (en) * 1994-05-31 1997-01-07 Lucent Technologies Inc. Method for interconnecting an electronic device using a removable solder carrying medium
GB201709925D0 (en) * 2017-06-21 2017-08-02 Royal College Of Art Composite structure

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE25200E (en) 1962-07-17 Method of making a composite sheet
US25200A (en) * 1859-08-23 Machine foe
NL272052A (de) * 1958-08-01 1900-01-01
GB1071706A (en) * 1964-10-14 1967-06-14 Mishima Paper Mfg Co Ltd A method of making paper which dissolves or rapidly disintegrates in water
NL6613526A (de) * 1966-09-26 1968-03-27
US3680037A (en) * 1970-11-05 1972-07-25 Tech Wire Prod Inc Electrical interconnector
US3736400A (en) * 1971-08-31 1973-05-29 Gilbreth Co Apparatus for damming pipe ends for welding
US3859125A (en) * 1972-10-10 1975-01-07 Gilbreth Co Soluble coated paper
JPS55164159A (en) * 1979-06-08 1980-12-20 Matsushita Electric Works Ltd Laminar laminate
DE3064269D1 (en) * 1979-08-09 1983-08-25 Tarmac Ind Holdings Ltd Method and apparatus for making a composite sheet material
FR2476428A1 (fr) * 1980-02-15 1981-08-21 Tech Electro Cie Indle Procede de fixation de composants electroniques sur un circuit imprime et produit obtenu par ce procede
JPS608026A (ja) * 1983-06-28 1985-01-16 Ichikoh Ind Ltd 合成樹脂成形品の射出成形法
US4705205A (en) * 1983-06-30 1987-11-10 Raychem Corporation Chip carrier mounting device
JPS6029199U (ja) * 1983-08-03 1985-02-27 株式会社　ジヤパンネツトワ−クサ−ビス 水溶性吸水紙
JPH0414197Y2 (de) * 1985-01-09 1992-03-31

Also Published As

Publication number Publication date
EP0228791A2 (de) 1987-07-15
DE3688879T2 (de) 1994-01-20
CA1269603A (en) 1990-05-29
EP0228791A3 (en) 1988-11-17
DE3688879D1 (de) 1993-09-16
JPS62113367A (ja) 1987-05-25
JP2539800B2 (ja) 1996-10-02
EP0228791B1 (de) 1993-08-11
US4655382A (en) 1987-04-07

Similar Documents

Publication Publication Date Title
DE69003319D1 (de) IC-Karte mit zusätzlichen Kontakten und Verfahren zur Kontrolle der IC-Karte.
NO871091D0 (no) Komposittanordning for katodisk beskyttelse av substrater i kontakt med denne, og anvendelse av anordningen.
DE3881726D1 (de) Diamino-verbindungen und filme zur orientierung von fluessigkristallen.
ATE14567T1 (de) Verwendung einer kleberschicht bei der herstellung von laminaten und laminate, die eine solche schicht enthalten.
DE69031216D1 (de) Mehrschichtiger film und laminat zur verwendung bei der herstellung von gedru- ckten schaltungsplatten
DE3884287D1 (de) Polymere Flüssigkristallzusammensetzung.
DE69008283D1 (de) Gerät zum Nachweis und zur Unterscheidung von funktionellen Fehlern in einer elektrischen Versorgungsschaltung.
DK143289C (da) Fremgangsmaade til metallisering af formstoffer og isaer til fremstilling af trykte kredsloebsplader
EP0292244A3 (en) Polymeric liquid crystal composition and liquid crystal device
ATE13681T1 (de) Schmelzkleber auf basis von polyesteramiden und deren verwendung zum verkleben von organischen und anorganischen substraten.
DE69529185D1 (de) Prozess zur Herstellung von metallbondiertem Keramikmaterial oder Komponente und dessen Verwendung als Substrat für eine elektronische Schaltung
ES546862A0 (es) Metodo de preparar peliculas transparentes de resina para estratificados de vidrio y similares.
DK610484D0 (da) Marine malinger og terpolymere til anvendelse i saadanne malinger
DE69319978D1 (de) Speicherkarte mit IC und Verfahren zur Herstellung derselben
DE3688726D1 (de) Schicht zur steuerung der fluessigkristallorientierung und ihre anwendung in einer fluessigkristallvorrichtung.
DE69015375D1 (de) Kleberzusammensetzung zur Verwendung beim Montieren von elektronischen Bauteilen und Verfahren zum Montieren von elektronischen Bauteilen auf eine Leiterplatte unter Verwendung des Klebers.
DE3575783D1 (de) Probestueck zur untersuchung von oberflaechendurchdringungsmitteln mit auflage wechselnder dicke.
ATE93116T1 (de) Werkstoffe zur verwendung bei der herstellung von elektronischen verbindungen.
KR860000734U (ko) 전자 부품 공급 및 이송장치
DK47881A (da) Midler og fremgangsmaade til beskyttelse af ikkelevende organiske substrater mod mikroorganismeangreb
DK490186D0 (da) Fremgangsmaade til fremstilling af prepregs og metalkacheret grundmateriale for trykte kredslaebskort og indretning til udaevelse af fremgangsmaaden
DE3878308D1 (de) Uebertragungseinrichtung und sternschaltung zur verwendung in einer solchen uebertragungseinrichtung und einrichtung mit einer solchen schaltung.
DE3583179D1 (de) Verfahren zur messung der orientierung von bestandteilen in folien.
DE69414444D1 (de) Warmehärtbare Harzzusammensetzungen und ihre Verwendung zur Herstellung von Kunstharzgegenständen und Dünnschicht Leiterplatten
IT8819535A0 (it) Dispositivo per fissare un elemento per scrivere o ricoprire in uno strumento per scrivere o per ricoprire per sostanza liquida.

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties