ATE97923T1 - Chemisch verankertes interpenetrierendes netzwerk. - Google Patents

Chemisch verankertes interpenetrierendes netzwerk.

Info

Publication number
ATE97923T1
ATE97923T1 AT90202365T AT90202365T ATE97923T1 AT E97923 T1 ATE97923 T1 AT E97923T1 AT 90202365 T AT90202365 T AT 90202365T AT 90202365 T AT90202365 T AT 90202365T AT E97923 T1 ATE97923 T1 AT E97923T1
Authority
AT
Austria
Prior art keywords
allyl polymers
network
interpenetting
prepared
double bond
Prior art date
Application number
AT90202365T
Other languages
English (en)
Inventor
Jan Andre Jozef Schutyser
Antonius Johannes Wilhel Buser
Pieter Hendrik Zuuring
Hendrik Jan Slots
Original Assignee
Akzo Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Akzo Nv filed Critical Akzo Nv
Application granted granted Critical
Publication of ATE97923T1 publication Critical patent/ATE97923T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S525/00—Synthetic resins or natural rubbers -- part of the class 520 series
    • Y10S525/903—Interpenetrating network

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Epoxy Resins (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Reinforced Plastic Materials (AREA)
  • Polysaccharides And Polysaccharide Derivatives (AREA)
  • Materials For Medical Uses (AREA)
  • Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
AT90202365T 1989-09-15 1990-09-06 Chemisch verankertes interpenetrierendes netzwerk. ATE97923T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL8902310 1989-09-15
EP90202365A EP0417837B1 (de) 1989-09-15 1990-09-06 Chemisch verankertes interpenetrierendes Netzwerk

Publications (1)

Publication Number Publication Date
ATE97923T1 true ATE97923T1 (de) 1993-12-15

Family

ID=19855316

Family Applications (1)

Application Number Title Priority Date Filing Date
AT90202365T ATE97923T1 (de) 1989-09-15 1990-09-06 Chemisch verankertes interpenetrierendes netzwerk.

Country Status (7)

Country Link
US (1) US5110867A (de)
EP (1) EP0417837B1 (de)
JP (1) JPH03111414A (de)
AT (1) ATE97923T1 (de)
CA (1) CA2025391A1 (de)
DE (1) DE69004902T2 (de)
ES (1) ES2047244T3 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5225498A (en) * 1991-08-28 1993-07-06 The United States Of America As Represented By The Secretary Of The Navy Interpenetrating polymer network acoustic damping material
US5728468A (en) * 1991-11-27 1998-03-17 Akzo Nobel N.V. Phosphorous containing resin
WO1993011465A1 (en) * 1991-12-06 1993-06-10 Akzo Nobel N.V. Photopolymerizable composition containing interlinked allylic and epoxy polymer networks
CA2086770A1 (en) * 1992-01-10 1993-07-11 Jyi-Faa Hwang Epoxy interpenetrating polymer networks having internetwork bonds
US5728633A (en) * 1992-01-23 1998-03-17 Jacobs; Richard L. Interpenetrating network compositions and structures
JPH06294907A (ja) * 1993-02-09 1994-10-21 A G Technol Kk 保護膜用組成物及びそれを用いたカラーフィルター付き基板ならびに液晶表示素子
CA2146816A1 (en) 1994-04-22 1995-10-23 Joachim E. Klee Process and composition for preparing a dental polymer product
ATE172210T1 (de) * 1994-09-08 1998-10-15 Akzo Nobel Nv Allylgruppen enthaltende zusammensetzungen aus epoxyharz und dem copolymer eines ethylenisch ungesättigten anhydrids und einer vinylverbindung
US5709948A (en) * 1995-09-20 1998-01-20 Minnesota Mining And Manufacturing Company Semi-interpenetrating polymer networks of epoxy and polyolefin resins, methods therefor, and uses thereof
AU708172B2 (en) * 1996-02-26 1999-07-29 Rohm And Haas Company Dual-cure latex compositions
JP3593347B2 (ja) 1996-10-29 2004-11-24 アイソラ ラミネート システムズ エポキシ樹脂組成物と架橋助剤とを含むスチレン及び無水マレイン酸のコポリマー
JP3918269B2 (ja) * 1997-12-25 2007-05-23 凸版印刷株式会社 耐熱性低誘電率樹脂組成物とその製造方法、及びその耐熱性低誘電率樹脂組成物を用いた電子機器部品
US6191952B1 (en) * 1998-04-28 2001-02-20 International Business Machines Corporation Compliant surface layer for flip-chip electronic packages and method for forming same
US6277925B1 (en) * 1999-03-18 2001-08-21 Hercules Incorporated Allyl compounds, compositions containing allyl compounds and processes for forming and curing polymer compositions
EP1621323A1 (de) * 2004-07-27 2006-02-01 Hexcel Composites GmbH Kontinuierliches Pultrusionsverfahren zur Herstellung von Tragprofilen mit hoher Leistungsfähigkeit
TWI449722B (zh) 2011-04-12 2014-08-21 Taiwan Union Technology Corp 樹脂組合物及其應用
US11975478B2 (en) 2020-04-24 2024-05-07 Illumina Cambridge Limited Flow cells

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2707177A (en) * 1952-11-29 1955-04-26 Gen Electric Ethoxyline-triallyl cyanurate resinous compositions
US3291857A (en) * 1960-02-17 1966-12-13 William W Howerton Curable polymers
JPS5857423A (ja) * 1981-09-30 1983-04-05 Toshiba Corp 低収縮性エポキシ樹脂組成物
FR2529215B1 (fr) * 1982-06-28 1987-05-07 Electricite De France Procede de preparation de reseaux polymeres de structure interpenetree homogene
US4957981A (en) * 1989-02-10 1990-09-18 Akzo N.V. Interpenetrating polymer network of an aliphatic polyol(allyl carbonate) and epoxy resin

Also Published As

Publication number Publication date
CA2025391A1 (en) 1991-03-16
JPH03111414A (ja) 1991-05-13
EP0417837A1 (de) 1991-03-20
ES2047244T3 (es) 1994-02-16
DE69004902D1 (de) 1994-01-13
EP0417837B1 (de) 1993-12-01
DE69004902T2 (de) 1994-05-19
US5110867A (en) 1992-05-05

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Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification
REN Ceased due to non-payment of the annual fee