AU2001237661A1 - Lead zirconate titanate dielectric thin film composites on metallic foils - Google Patents
Lead zirconate titanate dielectric thin film composites on metallic foilsInfo
- Publication number
- AU2001237661A1 AU2001237661A1 AU2001237661A AU3766101A AU2001237661A1 AU 2001237661 A1 AU2001237661 A1 AU 2001237661A1 AU 2001237661 A AU2001237661 A AU 2001237661A AU 3766101 A AU3766101 A AU 3766101A AU 2001237661 A1 AU2001237661 A1 AU 2001237661A1
- Authority
- AU
- Australia
- Prior art keywords
- thin film
- lead zirconate
- zirconate titanate
- dielectric thin
- metallic foils
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
- H01G4/1236—Ceramic dielectrics characterised by the ceramic dielectric material based on zirconium oxides or zirconates
- H01G4/1245—Ceramic dielectrics characterised by the ceramic dielectric material based on zirconium oxides or zirconates containing also titanates
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
- C04B37/021—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles in a direct manner, e.g. direct copper bonding [DCB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
- H01B3/12—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances ceramics
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Power Engineering (AREA)
- Inorganic Chemistry (AREA)
- Structural Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Organic Chemistry (AREA)
- Inorganic Insulating Materials (AREA)
- Laminated Bodies (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Semiconductor Memories (AREA)
- Ceramic Capacitors (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09518532 | 2000-03-04 | ||
| US09/518,532 US6623865B1 (en) | 2000-03-04 | 2000-03-04 | Lead zirconate titanate dielectric thin film composites on metallic foils |
| PCT/IB2001/000290 WO2001067465A2 (en) | 2000-03-04 | 2001-03-01 | Lead zirconate titanate dielectric thin film composites on metallic foils |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2001237661A1 true AU2001237661A1 (en) | 2001-09-17 |
Family
ID=24064339
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2001237661A Abandoned AU2001237661A1 (en) | 2000-03-04 | 2001-03-01 | Lead zirconate titanate dielectric thin film composites on metallic foils |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US6623865B1 (en) |
| EP (1) | EP1282901B1 (en) |
| JP (1) | JP2003526880A (en) |
| KR (1) | KR20030076927A (en) |
| CN (1) | CN1419700A (en) |
| AU (1) | AU2001237661A1 (en) |
| DE (1) | DE60124529T2 (en) |
| TW (1) | TW574422B (en) |
| WO (1) | WO2001067465A2 (en) |
Families Citing this family (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1139394A3 (en) * | 2000-03-30 | 2006-02-15 | International Business Machines Corporation | Method and device for electric field assisted anneal |
| US6541137B1 (en) * | 2000-07-31 | 2003-04-01 | Motorola, Inc. | Multi-layer conductor-dielectric oxide structure |
| US6819540B2 (en) | 2001-11-26 | 2004-11-16 | Shipley Company, L.L.C. | Dielectric structure |
| US6661642B2 (en) | 2001-11-26 | 2003-12-09 | Shipley Company, L.L.C. | Dielectric structure |
| TWI251536B (en) * | 2003-03-20 | 2006-03-21 | Hitachi Chemical Co Ltd | Material for multilayer printed circuit board with built-in capacitor, substrate for multilayer printed circuit board, multilayer printed circuit board and methods for producing those |
| US7029971B2 (en) * | 2003-07-17 | 2006-04-18 | E. I. Du Pont De Nemours And Company | Thin film dielectrics for capacitors and methods of making thereof |
| US6872468B1 (en) | 2003-10-09 | 2005-03-29 | Motorola, Inc. | Peelable circuit board foil |
| US7229662B2 (en) | 2003-12-16 | 2007-06-12 | National University Of Singapore | Heterolayered ferroelectric thin films and methods of forming same |
| US7193838B2 (en) * | 2003-12-23 | 2007-03-20 | Motorola, Inc. | Printed circuit dielectric foil and embedded capacitors |
| JP4506951B2 (en) * | 2004-04-23 | 2010-07-21 | セイコーエプソン株式会社 | MFS type field effect transistor, ferroelectric memory, and semiconductor device |
| US20060000542A1 (en) * | 2004-06-30 | 2006-01-05 | Yongki Min | Metal oxide ceramic thin film on base metal electrode |
| JP3764160B2 (en) * | 2004-09-10 | 2006-04-05 | 三井金属鉱業株式会社 | A printed wiring board comprising a capacitor layer forming material and a built-in capacitor circuit obtained using the capacitor layer forming material. |
| US7011726B1 (en) * | 2004-09-27 | 2006-03-14 | Intel Corporation | Method of fabricating thin dielectric film and thin film capacitor including the dielectric film |
| US7290315B2 (en) * | 2004-10-21 | 2007-11-06 | Intel Corporation | Method for making a passive device structure |
| US20060099803A1 (en) * | 2004-10-26 | 2006-05-11 | Yongki Min | Thin film capacitor |
| US20060091495A1 (en) * | 2004-10-29 | 2006-05-04 | Palanduz Cengiz A | Ceramic thin film on base metal electrode |
| US20060220177A1 (en) * | 2005-03-31 | 2006-10-05 | Palanduz Cengiz A | Reduced porosity high-k thin film mixed grains for thin film capacitor applications |
| US7375412B1 (en) | 2005-03-31 | 2008-05-20 | Intel Corporation | iTFC with optimized C(T) |
| US7629269B2 (en) | 2005-03-31 | 2009-12-08 | Intel Corporation | High-k thin film grain size control |
| US7795663B2 (en) | 2005-06-21 | 2010-09-14 | E. I. Du Pont De Nemours And Company | Acceptor doped barium titanate based thin film capacitors on metal foils and methods of making thereof |
| US20060287188A1 (en) | 2005-06-21 | 2006-12-21 | Borland William J | Manganese doped barium titanate thin film compositions, capacitors, and methods of making thereof |
| US7453144B2 (en) * | 2005-06-29 | 2008-11-18 | Intel Corporation | Thin film capacitors and methods of making the same |
| JP5023762B2 (en) | 2006-03-30 | 2012-09-12 | Tdk株式会社 | Thin film capacitor and manufacturing method thereof |
| JP4983102B2 (en) * | 2006-06-06 | 2012-07-25 | Tdk株式会社 | Dielectric element |
| US7773364B2 (en) | 2006-07-26 | 2010-08-10 | Tdk Corporation | Method of manufacturing capacitor |
| US20080118731A1 (en) * | 2006-11-16 | 2008-05-22 | Micron Technology, Inc. | Method of forming a structure having a high dielectric constant, a structure having a high dielectric constant, a capacitor including the structure, a method of forming the capacitor |
| US8974856B2 (en) | 2009-06-02 | 2015-03-10 | Uchicago Argonne, Llc | Method for fabrication of ceramic dielectric films on copper foils |
| JP2011176028A (en) * | 2010-02-23 | 2011-09-08 | Utec:Kk | Pressurizing-type lamp annealing device, method for manufacturing thin film, and method for using pressurizing-type lamp annealing device |
| DE102012105036A1 (en) * | 2012-06-12 | 2013-12-12 | Pyreos Ltd. | Method of manufacturing a microsystem |
| CN102863220B (en) * | 2012-09-18 | 2014-02-19 | 天津大学 | Method for preparing PZT-based piezoelectric ceramic thick-film materials for silver electrodes by co-firing at low temperature |
| MX2018011197A (en) * | 2016-03-16 | 2019-05-16 | Xaar Technology Ltd | A piezoelectric thin film element. |
| US9842695B2 (en) * | 2016-05-11 | 2017-12-12 | Delphi Technologies, Inc. | PLZT capacitor and method to increase the dielectric constant |
| JP6965670B2 (en) * | 2017-09-29 | 2021-11-10 | Tdk株式会社 | Thin film capacitor |
| DE102020115315B4 (en) | 2020-06-09 | 2022-05-05 | Tdk Electronics Ag | Piezoelectric assembly and process for forming a piezoelectric assembly |
| DE102022132815B4 (en) * | 2022-12-09 | 2025-02-06 | Tdk Electronics Ag | Substrate for a ceramic thin film and thin film device |
| DE102024115435B8 (en) * | 2024-05-31 | 2025-07-03 | Tdk Electronics Ag | Multilayer structure and method for producing a multilayer structure |
Family Cites Families (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4283228A (en) | 1979-12-05 | 1981-08-11 | University Of Illinois Foundation | Low temperature densification of PZT ceramics |
| JP2532381B2 (en) | 1986-03-04 | 1996-09-11 | 松下電器産業株式会社 | Ferroelectric thin film element and manufacturing method thereof |
| US4946710A (en) | 1987-06-02 | 1990-08-07 | National Semiconductor Corporation | Method for preparing PLZT, PZT and PLT sol-gels and fabricating ferroelectric thin films |
| US5112433A (en) | 1988-12-09 | 1992-05-12 | Battelle Memorial Institute | Process for producing sub-micron ceramic powders of perovskite compounds with controlled stoichiometry and particle size |
| US5456945A (en) | 1988-12-27 | 1995-10-10 | Symetrix Corporation | Method and apparatus for material deposition |
| US5965219A (en) | 1988-12-27 | 1999-10-12 | Symetrix Corporation | Misted deposition method with applied UV radiation |
| US5138520A (en) | 1988-12-27 | 1992-08-11 | Symetrix Corporation | Methods and apparatus for material deposition |
| US5198269A (en) | 1989-04-24 | 1993-03-30 | Battelle Memorial Institute | Process for making sol-gel deposited ferroelectric thin films insensitive to their substrates |
| JP2891304B2 (en) | 1990-11-16 | 1999-05-17 | 三菱マテリアル株式会社 | Ultra-pure ferroelectric thin film |
| US5265315A (en) | 1990-11-20 | 1993-11-30 | Spectra, Inc. | Method of making a thin-film transducer ink jet head |
| US5173354A (en) | 1990-12-13 | 1992-12-22 | Cornell Research Foundation, Inc. | Non-beading, thin-film, metal-coated ceramic substrate |
| JPH04259380A (en) | 1991-02-13 | 1992-09-14 | Mitsubishi Materials Corp | Method for controlling crystalline orientation property of pzt ferroelectric body thin film |
| US5962085A (en) | 1991-02-25 | 1999-10-05 | Symetrix Corporation | Misted precursor deposition apparatus and method with improved mist and mist flow |
| US5188902A (en) | 1991-05-30 | 1993-02-23 | Northern Illinois University | Production of PT/PZT/PLZI thin films, powders, and laser `direct write` patterns |
| US5271955A (en) | 1992-04-06 | 1993-12-21 | Motorola, Inc. | Method for making a semiconductor device having an anhydrous ferroelectric thin film |
| WO1993021637A1 (en) | 1992-04-13 | 1993-10-28 | Ceram, Inc. | Multilayer electrodes for ferroelectric devices |
| EP0647525B1 (en) | 1992-07-03 | 1998-09-30 | Citizen Watch Co. Ltd. | Ink jet head |
| US5308807A (en) | 1992-07-15 | 1994-05-03 | Nalco Chemical Company | Production of lead zirconate titanates using zirconia sol as a reactant |
| JP3033067B2 (en) | 1992-10-05 | 2000-04-17 | 富士ゼロックス株式会社 | Method for manufacturing multilayer ferroelectric conductive film |
| DE4314911C1 (en) | 1993-05-05 | 1995-01-26 | Siemens Ag | Process for producing a PZT ceramic |
| US6013334A (en) | 1993-05-27 | 2000-01-11 | Rohm Co. Ltd. | Method for forming a thin film of a complex compound |
| US5384294A (en) | 1993-11-30 | 1995-01-24 | The United States Of America As Represented By The Secretary Of The Air Force | Sol-gel derived lead oxide containing ceramics |
| US5462647A (en) | 1994-09-09 | 1995-10-31 | Midwest Research Institute | Preparation of lead-zirconium-titanium film and powder by electrodeposition |
| US5541807A (en) | 1995-03-17 | 1996-07-30 | Evans, Jr.; Joseph T. | Ferroelectric based capacitor for use in memory systems and method for fabricating the same |
| DE19521187C2 (en) | 1995-06-10 | 1997-08-07 | Fraunhofer Ges Forschung | Use of a ferroelectric ceramic material for information storage in electrostatic printing processes |
| JP2999703B2 (en) | 1995-12-20 | 2000-01-17 | 沖電気工業株式会社 | Ferroelectric thin film, method of forming the same, coating liquid for forming the thin film |
| JP2001503197A (en) | 1996-08-12 | 2001-03-06 | エナージーニアス,インコーポレイテッド | Semiconductor supercapacitor system, method for producing the same, and products produced by the method |
| US5935485A (en) | 1996-10-31 | 1999-08-10 | Kabushiki Kaisha Toyota Chuo Kenkyusho | Piezoelectric material and piezoelectric element |
| JPH10270766A (en) * | 1997-03-25 | 1998-10-09 | Osaka Gas Co Ltd | Ferroelectric thin film element, piezoelectric element and method of manufacturing the same |
| US6207522B1 (en) | 1998-11-23 | 2001-03-27 | Microcoating Technologies | Formation of thin film capacitors |
| US6433993B1 (en) | 1998-11-23 | 2002-08-13 | Microcoating Technologies, Inc. | Formation of thin film capacitors |
| US6270835B1 (en) | 1999-10-07 | 2001-08-07 | Microcoating Technologies, Inc. | Formation of this film capacitors |
| US6541137B1 (en) | 2000-07-31 | 2003-04-01 | Motorola, Inc. | Multi-layer conductor-dielectric oxide structure |
-
2000
- 2000-03-04 US US09/518,532 patent/US6623865B1/en not_active Expired - Fee Related
-
2001
- 2001-03-01 CN CN01807214A patent/CN1419700A/en active Pending
- 2001-03-01 DE DE60124529T patent/DE60124529T2/en not_active Expired - Fee Related
- 2001-03-01 AU AU2001237661A patent/AU2001237661A1/en not_active Abandoned
- 2001-03-01 WO PCT/IB2001/000290 patent/WO2001067465A2/en not_active Ceased
- 2001-03-01 EP EP01910078A patent/EP1282901B1/en not_active Expired - Lifetime
- 2001-03-01 JP JP2001566145A patent/JP2003526880A/en not_active Withdrawn
- 2001-03-01 KR KR1020027011614A patent/KR20030076927A/en not_active Ceased
- 2001-05-02 TW TW90110539A patent/TW574422B/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| WO2001067465A3 (en) | 2002-02-28 |
| WO2001067465A2 (en) | 2001-09-13 |
| EP1282901A2 (en) | 2003-02-12 |
| EP1282901B1 (en) | 2006-11-15 |
| DE60124529T2 (en) | 2007-10-11 |
| JP2003526880A (en) | 2003-09-09 |
| KR20030076927A (en) | 2003-09-29 |
| CN1419700A (en) | 2003-05-21 |
| DE60124529D1 (en) | 2006-12-28 |
| US6623865B1 (en) | 2003-09-23 |
| TW574422B (en) | 2004-02-01 |
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