AU596116B2 - Process for the manufacture of substrates to interconnect electronic components and articles made by said process - Google Patents

Process for the manufacture of substrates to interconnect electronic components and articles made by said process Download PDF

Info

Publication number: AU596116B2
Authority: AU; Australia
Prior art keywords: filaments; recited; substrate; insulated; plating
Prior art date: 1985-09-13
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Ceased

Application number

AU62540/86A

Other languages

English (en)

Other versions

AU6254086A (en

Inventor

Charles L. Lassen

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Advanced Interconnection Technology Inc

Original Assignee

Kollmorgen Technologies Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1985-09-13

Filing date

1986-09-10

Publication date

1990-04-26

1986-09-10 Application filed by Kollmorgen Technologies Corp filed Critical Kollmorgen Technologies Corp

1987-03-19 Publication of AU6254086A publication Critical patent/AU6254086A/en

1990-04-26 Application granted granted Critical

1990-04-26 Publication of AU596116B2 publication Critical patent/AU596116B2/en

1992-05-28 Assigned to KOLLMORGEN CORPORATION reassignment KOLLMORGEN CORPORATION Alteration of Name(s) in Register under S187 Assignors: KOLLMORGEN TECHNOLOGIES CORPORATION

1992-05-28 Assigned to ADVANCED INTERCONNECTION TECHNOLOGY, INC. reassignment ADVANCED INTERCONNECTION TECHNOLOGY, INC. Alteration of Name(s) in Register under S187 Assignors: KOLLMORGEN CORPORATION

2006-09-10 Anticipated expiration legal-status Critical

Status Ceased legal-status Critical Current

Links

239000000758 substrate Substances 0.000 title claims description 132
238000000034 method Methods 0.000 title claims description 78
230000008569 process Effects 0.000 title claims description 60
238000004519 manufacturing process Methods 0.000 title description 6
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 46
239000011248 coating agent Substances 0.000 claims description 40
238000000576 coating method Methods 0.000 claims description 40
229910052751 metal Inorganic materials 0.000 claims description 40
239000002184 metal Substances 0.000 claims description 40
239000010949 copper Substances 0.000 claims description 36
229910052802 copper Inorganic materials 0.000 claims description 34
239000004020 conductor Substances 0.000 claims description 30
XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 28
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 26
238000007747 plating Methods 0.000 claims description 25
239000000463 material Substances 0.000 claims description 19
239000003822 epoxy resin Substances 0.000 claims description 17
229920000647 polyepoxide Polymers 0.000 claims description 17
229910001092 metal group alloy Inorganic materials 0.000 claims description 16
229910052742 iron Inorganic materials 0.000 claims description 13
229910052759 nickel Inorganic materials 0.000 claims description 13
230000000149 penetrating effect Effects 0.000 claims description 7
229910045601 alloy Inorganic materials 0.000 claims description 6
239000000956 alloy Substances 0.000 claims description 6
238000009713 electroplating Methods 0.000 claims description 4
238000005516 engineering process Methods 0.000 claims description 2
239000011162 core material Substances 0.000 description 36
239000000853 adhesive Substances 0.000 description 18
230000001070 adhesive effect Effects 0.000 description 18
239000010410 layer Substances 0.000 description 16
229920002120 photoresistant polymer Polymers 0.000 description 12
229920005989 resin Polymers 0.000 description 12
239000011347 resin Substances 0.000 description 12
239000011889 copper foil Substances 0.000 description 9
CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 8
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
229910002092 carbon dioxide Inorganic materials 0.000 description 5
239000002131 composite material Substances 0.000 description 5
KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
238000004377 microelectronic Methods 0.000 description 4
239000004593 Epoxy Substances 0.000 description 3
229920000271 Kevlar® Polymers 0.000 description 3
ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
238000005253 cladding Methods 0.000 description 3
238000004891 communication Methods 0.000 description 3
239000011152 fibreglass Substances 0.000 description 3
239000011521 glass Substances 0.000 description 3
239000004761 kevlar Substances 0.000 description 3
239000000203 mixture Substances 0.000 description 3
TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 description 2
229910000881 Cu alloy Inorganic materials 0.000 description 2
VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
239000004642 Polyimide Substances 0.000 description 2
229910021626 Tin(II) chloride Inorganic materials 0.000 description 2
239000001569 carbon dioxide Substances 0.000 description 2
238000004140 cleaning Methods 0.000 description 2
230000000694 effects Effects 0.000 description 2
238000005538 encapsulation Methods 0.000 description 2
230000014509 gene expression Effects 0.000 description 2
DKAGJZJALZXOOV-UHFFFAOYSA-N hydrate;hydrochloride Chemical compound O.Cl DKAGJZJALZXOOV-UHFFFAOYSA-N 0.000 description 2
238000007654 immersion Methods 0.000 description 2
230000006872 improvement Effects 0.000 description 2
238000009413 insulation Methods 0.000 description 2
238000003475 lamination Methods 0.000 description 2
238000001465 metallisation Methods 0.000 description 2
239000002365 multiple layer Substances 0.000 description 2
230000003287 optical effect Effects 0.000 description 2
229910052763 palladium Inorganic materials 0.000 description 2
238000000059 patterning Methods 0.000 description 2
229920001721 polyimide Polymers 0.000 description 2
239000010453 quartz Substances 0.000 description 2
230000009467 reduction Effects 0.000 description 2
VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
239000001119 stannous chloride Substances 0.000 description 2
235000011150 stannous chloride Nutrition 0.000 description 2
239000000126 substance Substances 0.000 description 2
239000012974 tin catalyst Substances 0.000 description 2
229910000640 Fe alloy Inorganic materials 0.000 description 1
229910001374 Invar Inorganic materials 0.000 description 1
229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
229910001182 Mo alloy Inorganic materials 0.000 description 1
229910000990 Ni alloy Inorganic materials 0.000 description 1
230000002378 acidificating effect Effects 0.000 description 1
239000000654 additive Substances 0.000 description 1
238000013459 approach Methods 0.000 description 1
230000015572 biosynthetic process Effects 0.000 description 1
239000000969 carrier Substances 0.000 description 1
230000008859 change Effects 0.000 description 1
239000003795 chemical substances by application Substances 0.000 description 1
239000011247 coating layer Substances 0.000 description 1
230000001427 coherent effect Effects 0.000 description 1
150000001879 copper Chemical class 0.000 description 1
ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
238000005520 cutting process Methods 0.000 description 1
238000011161 development Methods 0.000 description 1
238000009826 distribution Methods 0.000 description 1
238000005553 drilling Methods 0.000 description 1
239000000428 dust Substances 0.000 description 1
238000004100 electronic packaging Methods 0.000 description 1
238000005530 etching Methods 0.000 description 1
LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
230000017525 heat dissipation Effects 0.000 description 1
238000010348 incorporation Methods 0.000 description 1
RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
238000010030 laminating Methods 0.000 description 1
239000007788 liquid Substances 0.000 description 1
238000012986 modification Methods 0.000 description 1
230000004048 modification Effects 0.000 description 1
238000006386 neutralization reaction Methods 0.000 description 1
239000002245 particle Substances 0.000 description 1
229920000728 polyester Polymers 0.000 description 1
238000006116 polymerization reaction Methods 0.000 description 1
239000012286 potassium permanganate Substances 0.000 description 1
238000007639 printing Methods 0.000 description 1
238000012545 processing Methods 0.000 description 1
238000007788 roughening Methods 0.000 description 1
239000002904 solvent Substances 0.000 description 1
229920001187 thermosetting polymer Polymers 0.000 description 1

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10287—Metal wires as connectors or conductors
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores

Landscapes

Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Manufacturing & Machinery (AREA)
Manufacturing Of Printed Wiring (AREA)
Production Of Multi-Layered Print Wiring Board (AREA)

AU62540/86A 1985-09-13 1986-09-10 Process for the manufacture of substrates to interconnect electronic components and articles made by said process Ceased AU596116B2 (en)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
US77577085A	1985-09-13	1985-09-13
US775770		1985-09-13

Publications (2)

Publication Number	Publication Date
AU6254086A AU6254086A (en)	1987-03-19
AU596116B2 true AU596116B2 (en)	1990-04-26

Family

ID=25105444

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
AU62540/86A Ceased AU596116B2 (en)	1985-09-13	1986-09-10	Process for the manufacture of substrates to interconnect electronic components and articles made by said process

Country Status (6)

Country	Link
EP (1)	EP0214628B1 (fr)
JP (1)	JPS6292495A (fr)
AU (1)	AU596116B2 (fr)
CA (1)	CA1277429C (fr)
DE (1)	DE3669638D1 (fr)
GB (1)	GB2180697B (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
AU644079B2 (en) *	1989-06-30	1993-12-02	Advanced Interconnection Technology, Inc.	Improved wire scribed circuit boards and methods of their manufacture

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
AU610249B2 (en) *	1987-09-29	1991-05-16	Microelectronics And Computer Technology Corporation	Customizable circuitry
US5165166A (en) *	1987-09-29	1992-11-24	Microelectronics And Computer Technology Corporation	Method of making a customizable circuitry
US4888665A (en) *	1988-02-19	1989-12-19	Microelectronics And Computer Technology Corporation	Customizable circuitry
US5081561A (en) *	1988-02-19	1992-01-14	Microelectronics And Computer Technology Corporation	Customizable circuitry
US5008619A (en) *	1988-11-18	1991-04-16	Amp-Akzo Corporation	Multilevel circuit board precision positioning
EP0468767B1 (fr) *	1990-07-25	1996-10-09	Hitachi Chemical Co., Ltd.	Plaque à circuits imprimés à interconnexion de conducteurs coaxiaux
GB2260211B (en) *	1991-07-06	1996-03-06	Elizabeth Marie Mcmillan	Transaction recorder
DE102012216926A1 (de) *	2012-09-20	2014-03-20	Jumatech Gmbh	Verfahren zur Herstellung eines Leiterplattenelements sowie Leiterplattenelement
US9288917B2 (en) *	2013-11-07	2016-03-15	Unimicron Technology Corp.	Manufacturing method for multi-layer circuit board

Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
AU5985680A (en) *	1979-05-24	1980-12-03	Fujitsu Limited	Hollow multilayer printed wiring board, and method of fabricating same
EP0167344A2 (fr) *	1984-06-29	1986-01-08	Tektronix, Inc.	Circuit multicouche interconnecté utilisant un diélectrique photosensible
EP0620084A1 (fr) *	1993-04-10	1994-10-19	David Fischer	Dispositif de serrage pour la fixation de pièces de travail

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
SE394600B (sv) *	1967-03-17	1977-07-04	Thams J P B	Forfarande for framstellning av en beleggning med onskad ytstruktur pa ett foremal
US3674602A (en) *	1969-10-09	1972-07-04	Photocircuits Corp	Apparatus for making wire scribed circuit boards
JPS5550399B1 (fr) *	1970-03-05	1980-12-17
JPS5229451B2 (fr) *	1972-12-12	1977-08-02
JPS5728399A (en) *	1980-07-28	1982-02-16	Nippon Electric Co	Multilayer circuit board
JPS6012795A (ja) *	1983-07-01	1985-01-23	日本電気株式会社	配線板およびその製造方法
JPS6016491A (ja) *	1983-07-08	1985-01-28	株式会社日立製作所	電子回路用布線基板
JPS6037796A (ja) *	1983-08-10	1985-02-27	日本電気株式会社	配線板

1986
- 1986-08-08 JP JP61187650A patent/JPS6292495A/ja active Pending
- 1986-09-01 GB GB8621063A patent/GB2180697B/en not_active Expired - Fee Related
- 1986-09-05 EP EP19860112310 patent/EP0214628B1/fr not_active Expired
- 1986-09-05 DE DE8686112310T patent/DE3669638D1/de not_active Expired - Lifetime
- 1986-09-08 CA CA000517685A patent/CA1277429C/fr not_active Expired - Lifetime
- 1986-09-10 AU AU62540/86A patent/AU596116B2/en not_active Ceased

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
AU5985680A (en) *	1979-05-24	1980-12-03	Fujitsu Limited	Hollow multilayer printed wiring board, and method of fabricating same
EP0167344A2 (fr) *	1984-06-29	1986-01-08	Tektronix, Inc.	Circuit multicouche interconnecté utilisant un diélectrique photosensible
EP0620084A1 (fr) *	1993-04-10	1994-10-19	David Fischer	Dispositif de serrage pour la fixation de pièces de travail

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
AU644079B2 (en) *	1989-06-30	1993-12-02	Advanced Interconnection Technology, Inc.	Improved wire scribed circuit boards and methods of their manufacture

Also Published As

Publication number	Publication date
JPS6292495A (ja)	1987-04-27
GB8621063D0 (en)	1986-10-08
EP0214628B1 (fr)	1990-03-14
GB2180697A (en)	1987-04-01
EP0214628A3 (en)	1987-05-13
DE3669638D1 (de)	1990-04-19
AU6254086A (en)	1987-03-19
GB2180697B (en)	1990-04-18
EP0214628A2 (fr)	1987-03-18
CA1277429C (fr)	1990-12-04

Publication	Publication Date	Title
US4602318A (en)	1986-07-22	Substrates to interconnect electronic components
US5517758A (en)	1996-05-21	Plating method and method for producing a multi-layered printed wiring board using the same
KR101156256B1 (ko)	2012-06-13	회로 캐리어 제조 방법 및 이 방법의 사용
EP1371754B1 (fr)	2008-12-17	Procede servant a plaquer un materiau de moulage polymere, element constituant un circuit et procede servant a fabriquer cet element
US4541882A (en)	1985-09-17	Process for the manufacture of substrates to interconnect electronic components and articles made by said process
US5817405A (en)	1998-10-06	Circuitized substrate with same surface conductors of different resolutions
US4500389A (en)	1985-02-19	Process for the manufacture of substrates to interconnect electronic components
KR100688864B1 (ko)	2007-03-02	인쇄회로기판, 플립칩 볼 그리드 어레이 기판 및 그 제조방법
AU596116B2 (en)	1990-04-26	Process for the manufacture of substrates to interconnect electronic components and articles made by said process
US4544442A (en)	1985-10-01	Process for the manufacture of substrates to interconnect electronic components
JP2024177400A (ja)	2024-12-19	回路板層より厚いトレースを有する多層回路板
EP0256778A2 (fr)	1988-02-24	Structure de circuit imprimé multicouche
EP0337986B1 (fr)	1993-04-07	Procede de fabrication de cartes de circuits multicouches
WO1999026458A1 (fr)	1999-05-27	Carte de cablage imprime multicouche et son procede de fabrication
US4751105A (en)	1988-06-14	Method for producing circuit boards
JP4508140B2 (ja)	2010-07-21	部品内蔵モジュール
EP0590635B1 (fr)	1996-07-17	Procédé pour la fabrication d'une plaque à circuit imprimé multicouche
JP2000036661A (ja)	2000-02-02	ビルドアップ多層配線板の製造方法
JPH06196856A (ja)	1994-07-15	めっき方法及びその方法を用いた多層プリント配線板の製造方法並びに多層プリント配線板
JPH07122850A (ja)	1995-05-12	低誘電率プリント基板の製造方法
JP2001203464A (ja)	2001-07-27	ビルドアップ多層プリント配線板及びその製造方法
JP3071733B2 (ja)	2000-07-31	多層印刷配線板の製造方法
JPS643356B2 (fr)	1989-01-20
JPH05335744A (ja)	1993-12-17	多層プリント配線板の製造方法
JPH03165595A (ja)	1991-07-17	多層配線板およびその製造法

AU596116B2 - Process for the manufacture of substrates to interconnect electronic components and articles made by said process - Google Patents

Info

Links

Classifications

Landscapes

Applications Claiming Priority (2)

Publications (2)

Family

ID=25105444

Family Applications (1)

Country Status (6)

Cited By (1)

Families Citing this family (9)

Citations (3)

Family Cites Families (8)

Patent Citations (3)

Cited By (1)

Also Published As

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