AU711287B2 - Adhesive compositions and methods of use - Google Patents

Adhesive compositions and methods of use Download PDF

Info

Publication number
AU711287B2
AU711287B2 AU77340/96A AU7734096A AU711287B2 AU 711287 B2 AU711287 B2 AU 711287B2 AU 77340/96 A AU77340/96 A AU 77340/96A AU 7734096 A AU7734096 A AU 7734096A AU 711287 B2 AU711287 B2 AU 711287B2
Authority
AU
Australia
Prior art keywords
adhesive
adhesive film
acrylate
heat
polyepoxide resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
AU77340/96A
Other languages
English (en)
Other versions
AU7734096A (en
Inventor
Gregory L. Bluem
Christopher A Haak
Michael A Kropp
Fred B McCormick Jr.
Stanley F. Tead
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Co
Original Assignee
Minnesota Mining and Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining and Manufacturing Co filed Critical Minnesota Mining and Manufacturing Co
Publication of AU7734096A publication Critical patent/AU7734096A/en
Application granted granted Critical
Publication of AU711287B2 publication Critical patent/AU711287B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
AU77340/96A 1996-05-16 1996-11-12 Adhesive compositions and methods of use Ceased AU711287B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US64878796A 1996-05-16 1996-05-16
US08/648787 1996-05-16
PCT/US1996/018311 WO1997043352A1 (en) 1996-05-16 1996-11-12 Adhesive compositions and methods of use

Publications (2)

Publication Number Publication Date
AU7734096A AU7734096A (en) 1997-12-05
AU711287B2 true AU711287B2 (en) 1999-10-07

Family

ID=24602241

Family Applications (1)

Application Number Title Priority Date Filing Date
AU77340/96A Ceased AU711287B2 (en) 1996-05-16 1996-11-12 Adhesive compositions and methods of use

Country Status (6)

Country Link
EP (1) EP0898603B1 (2)
JP (1) JP4154513B2 (2)
AU (1) AU711287B2 (2)
CA (1) CA2254883A1 (2)
DE (1) DE69635929D1 (2)
WO (1) WO1997043352A1 (2)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19852720A1 (de) * 1998-11-16 2000-05-18 Fischer Artur Werke Gmbh Zweikomponentenmasse für chemische Befestigungen
JP4516632B2 (ja) * 1999-04-20 2010-08-04 日東電工株式会社 アクリル系感圧性接着剤組成物とその接着シ―ト類
JP2001081438A (ja) * 1999-09-14 2001-03-27 Sony Chem Corp 接続材料
JP4607270B2 (ja) * 1999-11-24 2011-01-05 日東電工株式会社 熱硬化型接着剤とその接着シ―ト類
US6867539B1 (en) 2000-07-12 2005-03-15 3M Innovative Properties Company Encapsulated organic electronic devices and method for making same
JP2002129127A (ja) * 2000-10-20 2002-05-09 Shin Etsu Polymer Co Ltd 絶縁性接着剤、異方導電接着剤、ヒートシールコネクタ、及びヒートシールコネクタの製造方法
US6936131B2 (en) 2002-01-31 2005-08-30 3M Innovative Properties Company Encapsulation of organic electronic devices using adsorbent loaded adhesives
JP5111711B2 (ja) * 2002-01-31 2013-01-09 日立化成工業株式会社 接着剤組成物、回路接続用接着剤組成物及び回路接続方法
US6919504B2 (en) 2002-12-19 2005-07-19 3M Innovative Properties Company Flexible heat sink
US20070116961A1 (en) * 2005-11-23 2007-05-24 3M Innovative Properties Company Anisotropic conductive adhesive compositions
ATE555177T1 (de) * 2006-07-24 2012-05-15 3M Innovative Properties Co Elektrisch leitende haftklebstoffe
JP2007284676A (ja) * 2007-04-02 2007-11-01 Hitachi Chem Co Ltd 電極接続用接着剤
US9207373B2 (en) 2007-04-10 2015-12-08 Stoncor Group, Inc. Methods for fabrication and highway marking usage of agglomerated retroreflective beads
JP5126233B2 (ja) * 2007-10-05 2013-01-23 日立化成工業株式会社 接着剤組成物及びこれを用いた回路接続材料、並びに、回路部材の接続方法、回路接続体及び接着剤組成物の硬化物
JP2010121007A (ja) * 2008-11-18 2010-06-03 Sumitomo Electric Ind Ltd 異方導電性フィルム
JP5728804B2 (ja) * 2009-10-07 2015-06-03 デクセリアルズ株式会社 熱硬化性接着組成物、熱硬化性接着シート、その製造方法及び補強フレキシブルプリント配線板
US20110132537A1 (en) * 2009-12-03 2011-06-09 3M Innovative Properties Company Composition, tape, and use thereof
WO2012070871A2 (ko) 2010-11-23 2012-05-31 주식회사 엘지화학 접착제 조성물
US9056438B2 (en) 2012-05-02 2015-06-16 3M Innovative Properties Company Curable composition, articles comprising the curable composition, and method of making the same
US9346992B2 (en) * 2013-07-31 2016-05-24 E I Du Pont De Nemours And Company Thermally conductive dielectric for thermoformable circuits
KR20150069593A (ko) * 2013-12-13 2015-06-24 (주)엘지하우시스 접착력이 향상된 단열재용 접착제 조성물
RU2561201C1 (ru) * 2014-01-20 2015-08-27 Открытое акционерное общество "Композит" (ОАО "Композит") Композиция для теплопроводного клеевого состава
JP6355954B2 (ja) * 2014-04-07 2018-07-11 デクセリアルズ株式会社 接着フィルム及びその製造方法
WO2017134282A1 (en) * 2016-02-05 2017-08-10 Technische Universität München Joining of components by means of energetically activated reactive particles
EP3459979B1 (en) 2016-05-19 2021-12-08 Mitsubishi Chemical Corporation Macromonomer copolymer and production process therefor
WO2019178788A1 (en) * 2018-03-20 2019-09-26 Johnson Electric (Shenzhen) Co., Ltd. Rotor assembly for dc motor
CN110591583A (zh) * 2019-09-20 2019-12-20 上海精珅新材料有限公司 一种uv增粘后可高温降粘的制程用的过程膜生产方法及其产品
JP7446095B2 (ja) * 2019-12-03 2024-03-08 デクセリアルズ株式会社 フィルム巻装体及び接続体の製造方法
CN112300712A (zh) * 2020-11-18 2021-02-02 江苏皇冠新材料科技有限公司 紫外光固化胶黏剂及紫外光固化保护膜
JP7136364B1 (ja) * 2021-02-15 2022-09-13 Dic株式会社 二液硬化型接着剤、積層フィルム、積層フィルム製造装置、積層フィルムの製造方法
WO2022172436A1 (ja) * 2021-02-15 2022-08-18 Dic株式会社 二液硬化型接着剤、積層フィルム、積層フィルム製造装置、積層フィルムの製造方法
WO2022181564A1 (ja) * 2021-02-24 2022-09-01 東亞合成株式会社 ゴムと金属用の二液型接着剤及びこれを用いた接着方法
TWM621431U (zh) * 2021-07-26 2021-12-21 英豪科技股份有限公司 柔性扁平電纜
CN114231186B (zh) * 2021-12-15 2023-04-18 武汉市科达云石护理材料有限公司 一种快速固化改性干挂胶及其制备方法与应用
CN114539954B (zh) * 2022-03-31 2023-09-12 四川中久国峰科技有限公司 可丝网印刷的丙烯酸酯类压敏胶黏剂、制备方法及应用
TWM633612U (zh) * 2022-04-29 2022-11-01 英豪科技股份有限公司 柔性扁平電纜

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5110388A (en) * 1988-07-21 1992-05-05 Lintec Corporation Method of dicing and bonding semiconductor chips using a photocurable and heat curable adhesive tape
US5283007A (en) * 1992-04-28 1994-02-01 E. I. Du Pont De Nemours And Company Conductive polymer compositions

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4825050A (2) * 1971-08-02 1973-04-02
US4535012A (en) * 1983-09-30 1985-08-13 Electro Materials Corp. Of America Fast curing solderable conductor
EP0161854B1 (en) * 1984-04-29 1988-11-02 Nitto Electric Industrial Co., Ltd. Method of adhering metal alloy to metal sheet with resin composition
CA2009566A1 (en) * 1989-03-09 1990-09-09 Shinobu Sato Epoxy-acrylate blend pressure-sensitive thermosetting adhesives
WO1992020073A2 (en) * 1991-05-01 1992-11-12 E.I. Du Pont De Nemours And Company Conductive polymer compositions
JP3408301B2 (ja) * 1993-12-16 2003-05-19 ミネソタ マイニング アンド マニュファクチャリング カンパニー 異方性導電膜

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5110388A (en) * 1988-07-21 1992-05-05 Lintec Corporation Method of dicing and bonding semiconductor chips using a photocurable and heat curable adhesive tape
US5118567A (en) * 1988-07-21 1992-06-02 Lintec Corporation Adhesive tape and use thereof
US5283007A (en) * 1992-04-28 1994-02-01 E. I. Du Pont De Nemours And Company Conductive polymer compositions

Also Published As

Publication number Publication date
JP4154513B2 (ja) 2008-09-24
DE69635929D1 (de) 2006-05-11
CA2254883A1 (en) 1997-11-20
EP0898603A1 (en) 1999-03-03
WO1997043352A1 (en) 1997-11-20
EP0898603B1 (en) 2006-03-15
JP2000509425A (ja) 2000-07-25
AU7734096A (en) 1997-12-05

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Legal Events

Date Code Title Description
MK14 Patent ceased section 143(a) (annual fees not paid) or expired