BE577149R - Electrische halfgeleiderinrichting, (Elektrische Halbleitervorrichtung) - Google Patents

Electrische halfgeleiderinrichting, (Elektrische Halbleitervorrichtung)

Info

Publication number: BE577149R
Authority: BE; Belgium
Prior art keywords: halfgeleiderinrichting; electrische; halbleitervorrichtung; elektrische; elektrische halbleitervorrichtung
Prior art date: 1958-03-29

Application number

BE577149A

Other languages

English (en)

Original Assignee

Bell Telephone Mfg

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1958-03-29

Filing date

1959-03-27

Publication date

1959-09-28

1959-03-27 Application filed by Bell Telephone Mfg filed Critical Bell Telephone Mfg

1959-09-28 Application granted granted Critical

1959-09-28 Publication of BE577149R publication Critical patent/BE577149R/fr

Links

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07531—Techniques
- H10W72/07532—Compression bonding, e.g. thermocompression bonding
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/59—Bond pads specially adapted therefor
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/921—Structures or relative sizes of bond pads
- H10W72/923—Bond pads having multiple stacked layers
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/951—Materials of bond pads
- H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu

BE577149A 1958-03-29 1959-03-27 Electrische halfgeleiderinrichting, (Elektrische Halbleitervorrichtung) BE577149R (fr)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
DEST13591A DE1190580B (de)	1958-03-29	1958-03-29	In ein Gehaeuse eingebauter Hochleistungsgleichrichter

Publications (1)

Publication Number	Publication Date
BE577149R true BE577149R (fr)	1959-09-28

Family

ID=7456090

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
BE577149A BE577149R (fr)	1958-03-29	1959-03-27	Electrische halfgeleiderinrichting, (Elektrische Halbleitervorrichtung)

Country Status (3)

Country	Link
BE (1)	BE577149R (fr)
DE (1)	DE1190580B (fr)
GB (1)	GB903476A (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE19722507B4 (de) *	1997-05-30	2007-06-14	Robert Bosch Gmbh	Verfahren zur Herstellung einer elektrtrisch leitend mit einer integrierten Schaltung verbundenen Litze integrierte Schaltung mit einem Anschluss und Drehzahlsensor
US6790757B1 (en)	1999-12-20	2004-09-14	Agere Systems Inc.	Wire bonding method for copper interconnects in semiconductor devices

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US2763822A (en) *	1955-05-10	1956-09-18	Westinghouse Electric Corp	Silicon semiconductor devices

1958
- 1958-03-29 DE DEST13591A patent/DE1190580B/de active Pending
1959
- 1959-03-26 GB GB10593/59A patent/GB903476A/en not_active Expired
- 1959-03-27 BE BE577149A patent/BE577149R/fr active

Also Published As

Publication number	Publication date
DE1190580B (de)	1965-04-08
GB903476A (en)	1962-08-15

Publication	Publication Date	Title
BE596003A (fr)	1961-02-01	Amino-hydroxy-nitriles.
BE577149R (fr)	1959-09-28	Electrische halfgeleiderinrichting, (Elektrische Halbleitervorrichtung)
BE581628A (fr)	1959-12-01	Etireur-tordeur.
DK103424C (da)	1965-12-27	Høvender.
DK120015B (da)	1971-03-22	Fluidistor.
BE595070A (fr)	1961-01-02	Plansichter.
DK106453C (da)	1967-02-06	Endoradiosonde.
BE589991R (fr)	1960-10-24	Elektrische schakelinricting.
BE578235R (fr)	1959-10-29	Elektrische schakelinrichting
BE577148R (fr)	1959-09-28	Elektrische puls-coderingsinrichting
BE577752R (fr)	1959-10-16	Elektrische comparator.
FI29893A (fi)	1958-09-10	Svällbara, syrafasta vattenglaskitt
GR20174B (el)	1959-10-13	Οπτοπλινθος νεου τυπου.
BE577758R (fr)	1959-10-16	Sorteermachine.
BE577760R (fr)	1959-10-16	Sorteermachine.
BE577759R (fr)	1959-10-16	Roterende registreertrommel.
BE579761R (fr)	1959-12-17	Sorteermachine.
BE577756R (fr)	1959-10-16	Electrisch sorteersysteem.
BE577755R (fr)	1959-10-16	Sorteermachine.
BE573389R (fr)	1959-03-16	Binnenscheepvaartschroef.
DK88955C (da)	1960-05-09	Kærneæltertønde.
DK93868C (da)	1962-07-09	Narresut.
DK94449C (da)	1962-10-01	Spuns.
FR220M (fr)	1961-02-27	Pyridylméthylamines.
DK90912C (da)	1961-05-15	Toldehane.