BE581648A - Perfectionnements aux dispositifs semi-conducteurs. - Google Patents

Perfectionnements aux dispositifs semi-conducteurs.

Info

Publication number
BE581648A
BE581648A BE581648A BE581648A BE581648A BE 581648 A BE581648 A BE 581648A BE 581648 A BE581648 A BE 581648A BE 581648 A BE581648 A BE 581648A BE 581648 A BE581648 A BE 581648A
Authority
BE
Belgium
Prior art keywords
semiconductor devices
semiconductor
devices
Prior art date
Application number
BE581648A
Other languages
English (en)
Inventor
G King
G D Hedston
G N Roberts
Original Assignee
Bell Telephone Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bell Telephone Mfg filed Critical Bell Telephone Mfg
Publication of BE581648A publication Critical patent/BE581648A/fr

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/50—Alloying conductive materials with semiconductor bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/161—Containers comprising no base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/555—Materials of bond wires of outermost layers of multilayered bond wires, e.g. material of a coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
BE581648A 1958-08-14 1959-08-13 Perfectionnements aux dispositifs semi-conducteurs. BE581648A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB26120/58A GB891934A (en) 1958-08-14 1958-08-14 Improvements in or relating to semi-conductor devices

Publications (1)

Publication Number Publication Date
BE581648A true BE581648A (fr) 1960-02-15

Family

ID=10238696

Family Applications (1)

Application Number Title Priority Date Filing Date
BE581648A BE581648A (fr) 1958-08-14 1959-08-13 Perfectionnements aux dispositifs semi-conducteurs.

Country Status (3)

Country Link
BE (1) BE581648A (fr)
DE (1) DE1808381U (fr)
GB (1) GB891934A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118444255A (zh) * 2024-05-10 2024-08-06 长春理工大学 一种基于vmd和vi-cfar的车载毫米波雷达回波信号的抗干扰方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111834302B (zh) * 2020-07-28 2022-03-11 武汉邮埃服光电科技有限公司 一种晶体管管座及晶体管气密封装结构

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118444255A (zh) * 2024-05-10 2024-08-06 长春理工大学 一种基于vmd和vi-cfar的车载毫米波雷达回波信号的抗干扰方法
CN118444255B (zh) * 2024-05-10 2025-01-24 长春理工大学 一种基于vmd和vi-cfar的车载毫米波雷达回波信号的抗干扰方法

Also Published As

Publication number Publication date
DE1808381U (de) 1960-03-24
GB891934A (en) 1962-03-21

Similar Documents

Publication Publication Date Title
CH372932A (de) Ventileinrichtung
DK104185C (da) Halvlederapparat.
BE580578A (fr) Diode semi-conductrice.
CH367570A (de) Transistoranordnung
FR1240436A (fr) Transistor
FR1222090A (fr) Dispositifs semi-conducteurs
CH386566A (de) Halbleitervorrichtung
CH372034A (de) Abdichtungsvorrichtung
CH441508A (de) Halbleiteranordnung
CH381041A (de) Manipuliereinrichtung
FR1221292A (fr) Dispositifs semi-conducteurs
FR1225813A (fr) Dispositifs à semi-conducteurs
AT205413B (de) Transportgerät
FR1239605A (fr) Dispositifs thermo-électriques
CH386483A (de) Codierungseinrichtung
FR1201290A (fr) Perfectionnements aux biberons
FR1265417A (fr) Perfectionnement aux dispositifs anti-éblouissants
FR1220319A (fr) Perfectionnements aux dispositifs photoconducteurs
BE576746A (fr) Semi-conducteurs.
FR1244590A (fr) Perfectionnement aux dispositifs de télévision
AT218070B (de) Halbleitervorrichtung
BE582082A (fr) Dispositifs échantillonneurs.
BE598058A (fr) Perfectionnements relatifs aux dispositifs semi-conducteurs.
BE598599A (fr) Dispositifs semi-conducteurs.
BE577997A (fr) Perfectionnements aux dispositifs tendeurs.