BE585448A - Procédé de cuivrage non électrolytique et solution utilisées. - Google Patents

Procédé de cuivrage non électrolytique et solution utilisées.

Info

Publication number
BE585448A
BE585448A BE585448A BE585448A BE585448A BE 585448 A BE585448 A BE 585448A BE 585448 A BE585448 A BE 585448A BE 585448 A BE585448 A BE 585448A BE 585448 A BE585448 A BE 585448A
Authority
BE
Belgium
Prior art keywords
solution used
copper plating
plating process
electrolytic copper
electrolytic
Prior art date
Application number
BE585448A
Other languages
English (en)
Inventor
Frederick W Schneble Jr
John Mccormack
Rudolph J Zeblisky
Original Assignee
Photocircuits Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Photocircuits Corp filed Critical Photocircuits Corp
Publication of BE585448A publication Critical patent/BE585448A/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
BE585448A 1958-12-08 1959-12-08 Procédé de cuivrage non électrolytique et solution utilisées. BE585448A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US778736A US3033703A (en) 1958-12-08 1958-12-08 Electroless plating of copper

Publications (1)

Publication Number Publication Date
BE585448A true BE585448A (fr) 1960-06-08

Family

ID=25114268

Family Applications (1)

Application Number Title Priority Date Filing Date
BE585448A BE585448A (fr) 1958-12-08 1959-12-08 Procédé de cuivrage non électrolytique et solution utilisées.

Country Status (4)

Country Link
US (1) US3033703A (fr)
BE (1) BE585448A (fr)
CH (1) CH413539A (fr)
GB (1) GB924049A (fr)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3164908A (en) * 1961-09-18 1965-01-12 United Aircraft Corp Measurement methods and gauges
US3222195A (en) * 1962-02-23 1965-12-07 Pearlstein Fred Stabilized electroless copper solution
US3340164A (en) * 1963-12-26 1967-09-05 Sperry Rand Corp Method of copper plating anodized aluminum
US3313642A (en) * 1964-01-17 1967-04-11 Thomas Bonar & Co Canada Ltd Process of modifying the surface properties of polyolefin film
US3340161A (en) * 1964-02-19 1967-09-05 Sperry Rand Corp Printed circuits and method of manufacture thereof
US3341350A (en) * 1964-09-30 1967-09-12 Philip D Anderson Method of preparing a uranium article for a protective coating
US3421922A (en) * 1965-03-08 1969-01-14 Bruce W Wilson Process for preconditioning a nonmetallic surface for chemically depositing a metal thereon
US3370974A (en) * 1965-10-20 1968-02-27 Ivan C. Hepfer Electroless plating on non-conductive materials
US3449176A (en) * 1966-01-14 1969-06-10 Minnesota Mining & Mfg Coating of solid substrates
US3725108A (en) * 1969-03-05 1973-04-03 Enthone Chemical reduction metal plated diallylphthalate polymer and preparation process
USRE29039E (en) * 1969-11-26 1976-11-16 Imperial Chemical Industries Limited Metal deposition process
US3853589A (en) * 1970-11-09 1974-12-10 Ici Ltd Metal deposition process
US4066804A (en) * 1969-11-26 1978-01-03 Imperial Chemical Industries Limited Metal deposition process
CA949398A (en) * 1970-10-07 1974-06-18 Sumitaka Tatsuta Method for production of photographic material
US4039714A (en) * 1971-05-28 1977-08-02 Dr. -Ing. Max Schloetter Pretreatment of plastic materials for metal plating
US3791848A (en) * 1972-05-19 1974-02-12 Western Electric Co A method of improving the adherence of a metal deposit to a polyimide surface
US4981725A (en) * 1972-07-11 1991-01-01 Amp-Akzo Corporation Process and composition for sensitizing articles for metallization
DE2425196A1 (de) * 1974-05-24 1975-12-11 Hoechst Ag Verfahren zur herstellung elektrisch leitender vliese
USRE31694E (en) * 1976-02-19 1984-10-02 Macdermid Incorporated Apparatus and method for automatically maintaining an electroless copper plating bath
US4272570A (en) * 1980-04-11 1981-06-09 Sunbeam Corporation Provision of surface layers of copper or copper alloyed with zinc on die castings of zinc or zinc alloys
DE3307901A1 (de) * 1983-03-05 1984-09-06 Degussa Ag, 6000 Frankfurt Verfahren zum einbringen von badbestandteilen in galvanische und stromlose baeder
US4839023A (en) * 1987-09-16 1989-06-13 Exxon Research And Engineering Company Once-through coking with hydrotreating and fluid catalytic cracking
US5419926A (en) * 1993-11-22 1995-05-30 Lilly London, Inc. Ammonia-free deposition of copper by disproportionation
US7828872B2 (en) * 2004-08-20 2010-11-09 Ishihara Sangyo Kaisha, Ltd. Copper microparticle and process for producing the same
BR112013008950A2 (pt) * 2010-10-13 2019-09-24 Univ Of Windsor processo para galvanização eletroquímica de um metal galvânico sobre um substrato, processo para galvanização eletroquímica de metal galvânico de níquel ou de liga de nível sobre um substrato metálico de magnésio, processo para galvanização eletroquímica de sobre sobre um substrato, processo para galvanização eletroquímica de cibre galvânico sobre um substrato, e processo para galvanização eletroquímica de metal galvânico de níquel-boro sobre um substrato de magnésio
US8900998B2 (en) 2012-11-21 2014-12-02 University Of Windsor Process for electroless deposition of gold and gold alloys on silicon

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2454610A (en) * 1946-08-13 1948-11-23 Narcus Harold Method for metalization on nonconductors
US2702253A (en) * 1950-11-01 1955-02-15 Gasaccumulator Svenska Ab Surface metallizing method
US2874072A (en) * 1956-09-17 1959-02-17 Gen Electric Autocatalytic copper plating process and solution
US2872359A (en) * 1956-12-03 1959-02-03 Sylvania Electric Prod Copper sensitizers
US2930106A (en) * 1957-03-14 1960-03-29 American Felt Co Gaskets

Also Published As

Publication number Publication date
GB924049A (en) 1963-04-18
CH413539A (de) 1966-05-15
US3033703A (en) 1962-05-08

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