BE603792A - Transmission à deux rapports incorporée dans un moyeu, notamment pour cycle - Google Patents

Transmission à deux rapports incorporée dans un moyeu, notamment pour cycle

Info

Publication number
BE603792A
BE603792A BE603792A BE603792A BE603792A BE 603792 A BE603792 A BE 603792A BE 603792 A BE603792 A BE 603792A BE 603792 A BE603792 A BE 603792A BE 603792 A BE603792 A BE 603792A
Authority
BE
Belgium
Prior art keywords
hub
cycles
speed transmission
transmission incorporated
incorporated
Prior art date
Application number
BE603792A
Other languages
English (en)
Inventor
Edwin Elliot Hood
Original Assignee
Bendix Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bendix Corp filed Critical Bendix Corp
Publication of BE603792A publication Critical patent/BE603792A/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2045—Protection against vibrations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24322—Composite web or sheet
    • Y10T428/24331—Composite web or sheet including nonapertured component

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
BE603792A 1960-07-18 1961-05-15 Transmission à deux rapports incorporée dans un moyeu, notamment pour cycle BE603792A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US43360A US3083259A (en) 1960-07-18 1960-07-18 Vibration dampening printed circuit board

Publications (1)

Publication Number Publication Date
BE603792A true BE603792A (fr) 1961-09-01

Family

ID=21926768

Family Applications (1)

Application Number Title Priority Date Filing Date
BE603792A BE603792A (fr) 1960-07-18 1961-05-15 Transmission à deux rapports incorporée dans un moyeu, notamment pour cycle

Country Status (2)

Country Link
US (1) US3083259A (fr)
BE (1) BE603792A (fr)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3448617A (en) * 1967-05-18 1969-06-10 Gen Electric Liquid level sensor adapted for use in hydrocarbon fuels
US3944181A (en) * 1974-08-09 1976-03-16 Rockwell International Corporation Elastomeric post array mounting structure
US4338758A (en) * 1978-04-18 1982-07-13 Reduc Acoustics Ab Vibration damped structures and objects
GB2186431B (en) * 1986-02-07 1989-11-01 Sperry Sun Inc Assemblies for supporting electrical circuit boards within tubes
US6734363B1 (en) * 1992-07-07 2004-05-11 International Business Machines Corporation Lightweight electronic equipment conductor with coolant permeable support
US5552209A (en) * 1994-07-29 1996-09-03 Minnesota Mining And Manufacturing Company Internally damped circuit articles
US6633489B2 (en) * 2001-07-31 2003-10-14 Hewlett-Packard Development Company, L.P. Dynamic isolating mount for processor packages
CN101683008B (zh) * 2007-05-18 2011-08-17 日本电气株式会社 复合多层配线板
US10561039B2 (en) 2016-08-22 2020-02-11 Woodward, Inc. Frame for printed circuit board support in high vibration
US10021779B1 (en) * 2017-11-28 2018-07-10 TopLine Coporation Quick response particle damper for printed circuit boards and planar surfaces
DE102018205141A1 (de) * 2018-04-05 2019-10-10 Siemens Aktiengesellschaft Schwingungsgedämpfte Schaltungsanordnung, Umrichter und Luftfahrzeug mit einer derartigen Anordnung
US12526920B1 (en) 2024-01-12 2026-01-13 Topline Corporation Indium-niobium superconducting solder columns for cryogenic and quantum computer applications and methods for making same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1973124A (en) * 1931-11-14 1934-09-11 Bakelite Corp Airplane structure
US2237623A (en) * 1935-01-31 1941-04-08 Budd Edward G Mfg Co Laminated sheet and stamped metal panel
US2958064A (en) * 1957-11-26 1960-10-25 Amp Inc Circuit board and socket construction
US3007997A (en) * 1958-07-01 1961-11-07 Gen Electric Printed circuit board

Also Published As

Publication number Publication date
US3083259A (en) 1963-03-26

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