BE635672A - - Google Patents

Info

Publication number
BE635672A
BE635672A BE635672DA BE635672A BE 635672 A BE635672 A BE 635672A BE 635672D A BE635672D A BE 635672DA BE 635672 A BE635672 A BE 635672A
Authority
BE
Belgium
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication of BE635672A publication Critical patent/BE635672A/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/069—Manufacture or treatment of conductive parts of the interconnections by forming self-aligned vias or self-aligned contact plugs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/056—Manufacture or treatment of conductive parts of the interconnections by filling conductive material into holes, grooves or trenches
    • H10W20/058—Manufacture or treatment of conductive parts of the interconnections by filling conductive material into holes, grooves or trenches by depositing on sacrificial masks, e.g. using lift-off
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/43—Encapsulations, e.g. protective coatings characterised by their materials comprising oxides, nitrides or carbides, e.g. ceramics or glasses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
BE635672D 1962-07-31 BE635672A (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US21369562A 1962-07-31 1962-07-31

Publications (1)

Publication Number Publication Date
BE635672A true BE635672A (da)

Family

ID=22796141

Family Applications (1)

Application Number Title Priority Date Filing Date
BE635672D BE635672A (da) 1962-07-31

Country Status (4)

Country Link
BE (1) BE635672A (da)
DE (1) DE1246127B (da)
GB (1) GB988115A (da)
NL (1) NL295980A (da)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1280416B (de) * 1963-12-09 1968-10-17 Ibm Verfahren zum Herstellen epitaktischer Halbleiterschichten auf elektrisch leitenden Schichten

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2929739C2 (de) * 1979-07-23 1984-10-31 Brown, Boveri & Cie Ag, 6800 Mannheim Verfahren zum Entfernen eines Teiles einer Metallschicht von einer Halbleiterscheibe
US4344817A (en) * 1980-09-15 1982-08-17 Photon Power, Inc. Process for forming tin oxide conductive pattern
US4377633A (en) * 1981-08-24 1983-03-22 International Business Machines Corporation Methods of simultaneous contact and metal lithography patterning

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL204955A (da) * 1956-02-28
FR77789E (fr) * 1957-08-12 1962-04-20 Int Standard Electric Corp Perfectionnements aux dispositifs semi-conducteurs à jonction et méthode de fabrication de ceux-ci
BE570279A (da) * 1957-08-12 1900-01-01
US2981877A (en) * 1959-07-30 1961-04-25 Fairchild Semiconductor Semiconductor device-and-lead structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1280416B (de) * 1963-12-09 1968-10-17 Ibm Verfahren zum Herstellen epitaktischer Halbleiterschichten auf elektrisch leitenden Schichten

Also Published As

Publication number Publication date
GB988115A (en) 1965-04-07
DE1246127B (de) 1967-08-03
NL295980A (da)

Similar Documents

Publication Publication Date Title
BE633529A (da)
BE633444A (da)
BE634640A (da)
NL295980A (da)
BE634506A (da)
BE634261A (da)
BE634080A (da)
BE633213A (da)
BE629880A (da)
BE629216A (da)
BE629079A (da)
BE628244A (da)
BE628808A (da)
BE626869A (da)
CH819562A4 (da)
BE634091A (da)
BE634028A (da)
BE633528A (da)
BE633382A (da)
BE633204A (da)
BE633198A (da)
BE632774A (da)
BE632767A (da)
BE632702A (da)
BE632570A (da)