BE685232A - - Google Patents
Info
- Publication number
- BE685232A BE685232A BE685232DA BE685232A BE 685232 A BE685232 A BE 685232A BE 685232D A BE685232D A BE 685232DA BE 685232 A BE685232 A BE 685232A
- Authority
- BE
- Belgium
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
- H10W76/15—Containers comprising an insulating or insulated base
- H10W76/153—Containers comprising an insulating or insulated base having interconnections in passages through the insulating or insulated base
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/45—Differential amplifiers
- H03F3/45071—Differential amplifiers with semiconductor devices only
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/45—Differential amplifiers
- H03F3/45071—Differential amplifiers with semiconductor devices only
- H03F3/45479—Differential amplifiers with semiconductor devices only characterised by the way of common mode signal rejection
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Casings For Electric Apparatus (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US480992A US3292050A (en) | 1965-08-19 | 1965-08-19 | Mounting of solid state electronic components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BE685232A true BE685232A (2) | 1967-01-16 |
Family
ID=23910152
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BE685232D BE685232A (2) | 1965-08-19 | 1966-08-08 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US3292050A (2) |
| BE (1) | BE685232A (2) |
| DE (1) | DE1564022A1 (2) |
| GB (1) | GB1097296A (2) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3463970A (en) * | 1966-10-26 | 1969-08-26 | Gen Electric | Integrated semiconductor rectifier assembly |
| US3659164A (en) * | 1970-11-23 | 1972-04-25 | Rca Corp | Internal construction for plastic semiconductor packages |
| US3735209A (en) * | 1972-02-10 | 1973-05-22 | Motorola Inc | Semiconductor device package with energy absorbing layer |
| US3794886A (en) * | 1972-06-26 | 1974-02-26 | W Goldman | Fluid cooled semiconductor socket |
| US3859570A (en) * | 1973-02-20 | 1975-01-07 | Bose Corp | Power transistor mounting |
| US4749821A (en) * | 1986-07-10 | 1988-06-07 | Fic Corporation | EMI/RFI shield cap assembly |
| JPH0766331A (ja) * | 1993-08-02 | 1995-03-10 | Motorola Inc | 半導体デバイス・パッケージの製造方法 |
| US5957375A (en) * | 1996-10-28 | 1999-09-28 | Eaton Corporation | Sunload sensor for automatic climate control systems |
| CA2255441C (en) * | 1997-12-08 | 2003-08-05 | Hiroki Sekiya | Package for semiconductor power device and method for assembling the same |
-
1965
- 1965-08-19 US US480992A patent/US3292050A/en not_active Expired - Lifetime
-
1966
- 1966-07-29 GB GB34169/66A patent/GB1097296A/en not_active Expired
- 1966-08-08 BE BE685232D patent/BE685232A/xx unknown
- 1966-08-18 DE DE19661564022 patent/DE1564022A1/de active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| DE1564022A1 (de) | 1970-01-22 |
| US3292050A (en) | 1966-12-13 |
| GB1097296A (en) | 1968-01-03 |