BE698414A - - Google Patents

Info

Publication number
BE698414A
BE698414A BE698414DA BE698414A BE 698414 A BE698414 A BE 698414A BE 698414D A BE698414D A BE 698414DA BE 698414 A BE698414 A BE 698414A
Authority
BE
Belgium
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of BE698414A publication Critical patent/BE698414A/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/479—Leadframes on or in insulating or insulated package substrates, interposers, or redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S206/00—Special receptacle or package
    • Y10S206/82—Separable, striplike plural articles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S228/00—Metal fusion bonding
    • Y10S228/903—Metal to nonmetal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/49222—Contact or terminal manufacturing by assembling plural parts forming array of contacts or terminals
BE698414D 1966-05-16 1967-05-12 BE698414A (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US55817266A 1966-05-16 1966-05-16

Publications (1)

Publication Number Publication Date
BE698414A true BE698414A (it) 1967-11-13

Family

ID=24228485

Family Applications (1)

Application Number Title Priority Date Filing Date
BE698414D BE698414A (it) 1966-05-16 1967-05-12

Country Status (7)

Country Link
US (1) US3444619A (it)
BE (1) BE698414A (it)
CH (1) CH475651A (it)
DE (1) DE1614975C3 (it)
GB (1) GB1188375A (it)
NL (1) NL154872B (it)
SE (1) SE357098B (it)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3832770A (en) * 1969-10-24 1974-09-03 Amp Inc Electrical connectors
US3636235A (en) * 1970-06-11 1972-01-18 Sealtronics Inc Header having high-density conductor arrangement and method of making same
US3977075A (en) * 1971-10-28 1976-08-31 Amp Incorporated Method of fabricating multi-layer printed circuit board
US3893235A (en) * 1972-11-17 1975-07-08 Texas Instruments Inc Keyboard electronic apparatus and method of making
US3833753A (en) * 1972-11-30 1974-09-03 V Garboushian Hermetically sealed mounting structure for miniature electronic circuitry
JPS5848425B2 (ja) * 1980-04-10 1983-10-28 富士通株式会社 電子部品の包装方法
US4506438A (en) * 1981-11-02 1985-03-26 Elfab Corporation Apparatus for manufacturing integrated circuit connectors
US4417396A (en) * 1981-11-02 1983-11-29 Elfab Corporation Method for manufacturing integrated circuit connectors
GB8303555D0 (en) * 1983-02-09 1983-03-16 Strain Measurement Dev Ltd Strain gauges
US4628597A (en) * 1983-11-25 1986-12-16 Meehan Robert F Method of making an electrical connector
US4541174A (en) * 1984-06-04 1985-09-17 Allied Corporation Process of making a jack-type electrical connector
US4616406A (en) * 1984-09-27 1986-10-14 Advanced Micro Devices, Inc. Process of making a semiconductor device having parallel leads directly connected perpendicular to integrated circuit layers therein
US4665614A (en) * 1985-04-04 1987-05-19 Molex Incorporated Method of making a multiconductor electrical connector arrangement
US4856189A (en) * 1988-06-16 1989-08-15 Liao Pen Lin Method for manufacturing multiple push-button and conductive members for DIP switches
KR960000793B1 (ko) * 1993-04-07 1996-01-12 삼성전자주식회사 노운 굳 다이 어레이 및 그 제조방법
US6206272B1 (en) * 1999-04-08 2001-03-27 Intel Corporation Alignment weight for floating field pin design
CN107351013B (zh) * 2017-07-12 2022-12-16 蚌埠市创业电子有限责任公司 一种用于传感器基座引线与玻璃胚子的装配工装
CN112707631B (zh) * 2020-12-30 2023-10-31 中国电子科技集团公司第四十研究所 一种THz玻璃绝缘子的烧制组件及烧制方法
CN113035789B (zh) * 2021-02-07 2022-07-05 深圳市星欣磊实业有限公司 一种to封装的高精度夹具及其使用方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2899659A (en) * 1952-03-07 1959-08-11 mcllvaine
US2804581A (en) * 1953-10-05 1957-08-27 Sarkes Tarzian Semiconductor device and method of manufacture thereof
US3109225A (en) * 1958-08-29 1963-11-05 Rca Corp Method of mounting a semiconductor device
NL261280A (it) * 1960-02-25 1900-01-01
US3300832A (en) * 1963-06-28 1967-01-31 Rca Corp Method of making composite insulatorsemiconductor wafer
US3317983A (en) * 1963-11-25 1967-05-09 Philips Corp Method of making a vibratory capacitor
DE1514883C3 (de) * 1965-10-19 1975-02-27 Telefunken Patentverwertungsgesellschaft Mbh, 7900 Ulm Verfahren zur serienmäßigen Herstellung von Halbleiterbauelementen

Also Published As

Publication number Publication date
DE1614975C3 (de) 1981-11-26
DE1614975B2 (de) 1977-11-24
NL154872B (nl) 1977-10-17
CH475651A (it) 1969-07-15
GB1188375A (en) 1970-04-15
SE357098B (it) 1973-06-12
US3444619A (en) 1969-05-20
DE1614975A1 (de) 1971-01-14
NL6706649A (it) 1967-11-17

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