BE744349A - Procede pour fixer des plaquettes a circuit integre sur des systemes decircuits a pellicule epaisse - Google Patents

Procede pour fixer des plaquettes a circuit integre sur des systemes decircuits a pellicule epaisse

Info

Publication number
BE744349A
BE744349A BE744349DA BE744349A BE 744349 A BE744349 A BE 744349A BE 744349D A BE744349D A BE 744349DA BE 744349 A BE744349 A BE 744349A
Authority
BE
Belgium
Prior art keywords
decircuit
systems
integrated circuit
thick film
circuit pads
Prior art date
Application number
Other languages
English (en)
Inventor
R J Galli
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Publication of BE744349A publication Critical patent/BE744349A/fr

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/098—Applying pastes or inks, e.g. screen printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/654—Top-view layouts
    • H10W70/655—Fan-out layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
BE744349D 1969-01-13 1970-01-13 Procede pour fixer des plaquettes a circuit integre sur des systemes decircuits a pellicule epaisse BE744349A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US79073469A 1969-01-13 1969-01-13

Publications (1)

Publication Number Publication Date
BE744349A true BE744349A (fr) 1970-07-13

Family

ID=25151606

Family Applications (1)

Application Number Title Priority Date Filing Date
BE744349D BE744349A (fr) 1969-01-13 1970-01-13 Procede pour fixer des plaquettes a circuit integre sur des systemes decircuits a pellicule epaisse

Country Status (5)

Country Link
US (1) US3589000A (fr)
BE (1) BE744349A (fr)
DE (1) DE2001110A1 (fr)
FR (1) FR2031119A5 (fr)
NL (1) NL7000425A (fr)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE758871A (fr) * 1969-11-13 1971-05-12 Philips Nv Procede pour relier des emplacements de contact metalliques de composants electriques avec des conducteurs metalliques d'un substratflasque
US3851383A (en) * 1970-07-29 1974-12-03 H Peltz Method of contacting a semiconductor body having a plurality of electrodes utilizing sheet metal electric leads
US3680198A (en) * 1970-10-07 1972-08-01 Fairchild Camera Instr Co Assembly method for attaching semiconductor devices
US4004955A (en) * 1973-05-24 1977-01-25 General Motors Corporation Positive selective nickel alignment system
US4065851A (en) * 1974-04-20 1978-01-03 W. C. Heraeus Gmbh Method of making metallic support carrier for semiconductor elements
US4376505A (en) * 1981-01-05 1983-03-15 Western Electric Co., Inc. Methods for applying solder to an article
US4412642A (en) * 1982-03-15 1983-11-01 Western Electric Co., Inc. Cast solder leads for leadless semiconductor circuits
US4754912A (en) * 1984-04-05 1988-07-05 National Semiconductor Corporation Controlled collapse thermocompression gang bonding
FR2564826B1 (fr) * 1984-05-25 1986-08-22 Thomson Csf Procede d'assemblage d'au moins deux pieces en ceramique, presentant chacune au moins une surface plane
US4640499A (en) * 1985-05-01 1987-02-03 The United States Of America As Represented By The Secretary Of The Air Force Hermetic chip carrier compliant soldering pads
DE3817600C2 (de) * 1987-05-26 1994-06-23 Matsushita Electric Works Ltd Verfahren zur Herstellung einer Halbleitervorrichtung mit einem keramischen Substrat und einem integrierten Schaltungskreis
DE3824865A1 (de) * 1988-07-21 1990-01-25 Productech Gmbh Herstellen von loetflaechen
JP2532615B2 (ja) * 1988-10-20 1996-09-11 松下電器産業株式会社 バンプ形成方法
EP0403631B1 (fr) * 1989-01-03 1995-08-09 Motorola, Inc. Procede pour realiser des perles de brasure a haute densite, et socle de substrat pour celles-ci
US5024372A (en) * 1989-01-03 1991-06-18 Motorola, Inc. Method of making high density solder bumps and a substrate socket for high density solder bumps
US5249450A (en) * 1992-06-15 1993-10-05 Micron Technology, Inc. Probehead for ultrasonic forging
EP0647091A1 (fr) * 1993-10-05 1995-04-05 AT&T Corp. Alignement passif de composants à l'aide d'un outil fabriqué par micro usinage
DE19504543C2 (de) * 1995-02-11 1997-04-30 Fraunhofer Ges Forschung Verfahren zur Formung von Anschlußhöckern auf elektrisch leitenden mikroelektronischen Verbindungselementen zum lothöcker-freien Tab-Bonden
US6384344B1 (en) 1995-06-19 2002-05-07 Ibiden Co., Ltd Circuit board for mounting electronic parts
US5765744A (en) * 1995-07-11 1998-06-16 Nippon Steel Corporation Production of small metal bumps
DE69637246T2 (de) 1996-09-12 2008-02-14 Ibiden Co., Ltd., Ogaki Leiterplatte zur montage elektronischer bauelemente
US6056190A (en) * 1997-02-06 2000-05-02 Speedline Technologies, Inc. Solder ball placement apparatus
US6427903B1 (en) 1997-02-06 2002-08-06 Speedline Technologies, Inc. Solder ball placement apparatus
US6641030B1 (en) 1997-02-06 2003-11-04 Speedline Technologies, Inc. Method and apparatus for placing solder balls on a substrate

Also Published As

Publication number Publication date
US3589000A (en) 1971-06-29
DE2001110A1 (de) 1970-07-16
NL7000425A (fr) 1970-07-15
FR2031119A5 (fr) 1970-11-13

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