BE756528A - Structure de contact perfectionnee pour dispositifs a semiconducteur - Google Patents

Structure de contact perfectionnee pour dispositifs a semiconducteur

Info

Publication number: BE756528A
Authority: BE; Belgium
Prior art keywords: perfected; semiconductor devices; contact structure; contact; semiconductor
Prior art date: 1969-09-25

Application number

Other languages

English (en)

Inventor

A Fu-Hang Chen

Original Assignee

Rca Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1969-09-25

Publication date

1971-03-01

1971-03-01 Publication of BE756528A publication Critical patent/BE756528A/fr

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D99/00—Subject matter not provided for in other groups of this subclass
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
- H10W20/482—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes for individual devices provided for in groups H10D8/00 - H10D48/00, e.g. for power transistors
- H10W20/484—Interconnections having extended contours, e.g. pads having mesh shape or interconnections comprising connected parallel stripes
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07531—Techniques
- H10W72/07532—Compression bonding, e.g. thermocompression bonding
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07531—Techniques
- H10W72/07532—Compression bonding, e.g. thermocompression bonding
- H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/59—Bond pads specially adapted therefor
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/951—Materials of bond pads
- H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu

BE756528D 1969-09-25 Structure de contact perfectionnee pour dispositifs a semiconducteur BE756528A (fr)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US86103669A	1969-09-25	1969-09-25

Publications (1)

Publication Number	Publication Date
BE756528A true BE756528A (fr)	1971-03-01

Family

ID=25334689

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
BE756528D BE756528A (fr)	1969-09-25		Structure de contact perfectionnee pour dispositifs a semiconducteur

Country Status (8)

Country	Link
JP (1)	JPS4827496B1 (fr)
BE (1)	BE756528A (fr)
DE (1)	DE2046505A1 (fr)
ES (1)	ES383728A1 (fr)
FR (1)	FR2062533A5 (fr)
GB (1)	GB1280096A (fr)
NL (1)	NL7014101A (fr)
SE (1)	SE364808B (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4665424A (en) *	1984-03-30	1987-05-12	Mitsubishi Denki Kabushiki Kaisha	Semiconductor device

0
- BE BE756528D patent/BE756528A/fr unknown
1970
- 1970-09-17 GB GB44444/70A patent/GB1280096A/en not_active Expired
- 1970-09-19 ES ES383728A patent/ES383728A1/es not_active Expired
- 1970-09-21 DE DE19702046505 patent/DE2046505A1/de active Pending
- 1970-09-23 FR FR7034419A patent/FR2062533A5/fr not_active Expired
- 1970-09-24 JP JP45083710A patent/JPS4827496B1/ja active Pending
- 1970-09-24 SE SE12975/70A patent/SE364808B/xx unknown
- 1970-09-24 NL NL7014101A patent/NL7014101A/xx unknown

Also Published As

Publication number	Publication date
NL7014101A (fr)	1971-03-29
JPS4827496B1 (fr)	1973-08-23
ES383728A1 (es)	1973-06-01
SE364808B (fr)	1974-03-04
FR2062533A5 (fr)	1971-06-25
DE2046505A1 (de)	1971-04-01
GB1280096A (en)	1972-07-05

Publication	Publication Date	Title
BE761668A (fr)	1971-06-16	Structure de contact perfectionnee pour semi-conducteurs
BR6915742D0 (pt)	1973-01-02	Dispositivo semicondutor
BE752344A (fr)	1970-12-22	Appareil pour realiser des contacts sur des dispositifs semiconducteur
IT939645B (it)	1973-02-10	Dispositivo contenitore per dispositivi a semiconduttore
IT981860B (it)	1974-10-10	Dispositivo semiconduttore
BR7404876D0 (pt)	1975-01-07	Dispositivo semicondutor
CH507591A (de)	1971-05-15	Halbleitervorrichtung
BE766708A (fr)	1971-10-01	Dispositifs semi-conducteurs de commutation
CH508280A (de)	1971-05-31	Halbleiteranordnung
CH504108A (de)	1971-02-28	Halbleiteranordnung
IT996680B (it)	1975-12-10	Dispositivo semiconduttore
AT300955B (de)	1972-08-10	Kontaktvorrichtung
BR7310275D0 (pt)	1974-09-24	Aperfeicoamento em dispositivo semicondutor de juncoes multiplas
BE747964A (fr)	1970-08-31	Dispositifs semiconducteurs photoactives
BR7106702D0 (pt)	1973-04-17	Um dispositivo semicondutor
BR7308693D0 (pt)	1974-08-22	Dispositivo semicondutor
BE758321A (fr)	1971-04-01	Procede de metallisation de dispositifs a semi-conducteurs
IT986562B (it)	1975-01-30	Dispositivo semiconduttore
BR7310282D0 (pt)	1974-08-15	Aperfeicoamento em dispositivo semicondutor de juncoes multiplas
IT990812B (it)	1975-07-10	Dispositivo semiconduttore
IT977703B (it)	1974-09-20	Dispositivo semiconduttore
CH499204A (de)	1970-11-15	Halbleitervorrichtung
BE756528A (fr)	1971-03-01	Structure de contact perfectionnee pour dispositifs a semiconducteur
BR7017682D0 (pt)	1973-04-17	Dispositivo semicondutor
BE756185A (fr)	1971-03-15	Dispositifs de support