BE761239A - Dispositifs semi-conducteurs integres - Google Patents

Dispositifs semi-conducteurs integres

Info

Publication number
BE761239A
BE761239A BE761239A BE761239A BE761239A BE 761239 A BE761239 A BE 761239A BE 761239 A BE761239 A BE 761239A BE 761239 A BE761239 A BE 761239A BE 761239 A BE761239 A BE 761239A
Authority
BE
Belgium
Prior art keywords
semiconductor devices
integrated semiconductor
integrated
devices
semiconductor
Prior art date
Application number
BE761239A
Other languages
English (en)
Inventor
J Avins
Original Assignee
Rca Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rca Corp filed Critical Rca Corp
Publication of BE761239A publication Critical patent/BE761239A/fr

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/60—Arrangements for protection of devices protecting against electrostatic charges or discharges, e.g. Faraday shields
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
BE761239A 1970-01-07 1971-01-05 Dispositifs semi-conducteurs integres BE761239A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US124670A 1970-01-07 1970-01-07

Publications (1)

Publication Number Publication Date
BE761239A true BE761239A (fr) 1971-06-16

Family

ID=21695080

Family Applications (1)

Application Number Title Priority Date Filing Date
BE761239A BE761239A (fr) 1970-01-07 1971-01-05 Dispositifs semi-conducteurs integres

Country Status (8)

Country Link
US (1) US3614546A (fr)
JP (1) JPS4942427B1 (fr)
BE (1) BE761239A (fr)
DE (1) DE2100103B2 (fr)
FR (1) FR2075958B1 (fr)
GB (1) GB1282251A (fr)
MY (1) MY7500147A (fr)
SE (1) SE376114B (fr)

Families Citing this family (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2116353B1 (fr) * 1970-10-19 1976-04-16 Ates Componenti Elettron
US3846907A (en) * 1970-12-18 1974-11-12 B Ivanovic Continuous guidance method and apparatus for installing dip devices on circuit boards
JPS547196B2 (fr) * 1971-08-26 1979-04-04
DE2514011C2 (de) * 1975-03-29 1983-10-27 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Gehäuse für ein Halbleiterelement
US4177480A (en) * 1975-10-02 1979-12-04 Licentia Patent-Verwaltungs-G.M.B.H. Integrated circuit arrangement with means for avoiding undesirable capacitive coupling between leads
DE2543968A1 (de) * 1975-10-02 1977-04-07 Licentia Gmbh Integrierte schaltungsanordnung
JPS5271168A (en) * 1975-12-11 1977-06-14 Futaba Denshi Kogyo Kk Multiidigit fluorescent display tube
JPS52120768A (en) * 1976-04-05 1977-10-11 Nec Corp Semiconductor device
JPS5387663A (en) * 1977-01-12 1978-08-02 Hitachi Ltd Protection method of semiconductor element in hybrid integrated circuit
EP0001890B1 (fr) * 1977-10-12 1981-07-22 The Secretary of State for Defence in Her Britannic Majesty's Government of the United Kingdom of Great Britain and Perfectionnements aux boîtiers pour circuits intégrés à micro-ondes
JPS55163850A (en) * 1979-06-08 1980-12-20 Fujitsu Ltd Semiconductor device
US4393581A (en) * 1980-01-22 1983-07-19 Amp Incorporated Method of forming leads on a lead frame
US5007083A (en) * 1981-03-17 1991-04-09 Constant James N Secure computer
US4463217A (en) * 1981-09-14 1984-07-31 Texas Instruments Incorporated Plastic surface mounted high pinout integrated circuit package
JPS58159360A (ja) * 1982-03-17 1983-09-21 Fujitsu Ltd 半導体装置
JPS60211960A (ja) * 1984-04-06 1985-10-24 Hitachi Ltd 半導体装置
DE3430849A1 (de) * 1984-08-22 1986-03-06 Gerd 7742 St Georgen Kammerer Verfahren zur raeumlichen ausweitung der elektrischen verbindung zwischen den anschlusskontakten hochintegrierter elektronischer bauelemente und den kontaktstellen einer elektrischen anschlussvorrichtung auf einem bauelementetraeger
US4752717A (en) * 1984-08-27 1988-06-21 Edwards Industries, Inc. Shielded electroluminescent lamp
JPS61269345A (ja) * 1985-05-24 1986-11-28 Hitachi Ltd 半導体装置
SE458004C (sv) * 1987-10-09 1991-10-07 Carmis Enterprises Sa Anordning foer elektrisk avkoppling av integrerade kretsar
US4953002A (en) * 1988-03-31 1990-08-28 Honeywell Inc. Semiconductor device housing with magnetic field protection
US4907978A (en) * 1988-11-02 1990-03-13 Robinson Nugent, Inc. Self-retaining connector
US5089929A (en) * 1990-03-08 1992-02-18 The United States Of America As Represented By The Secretary Of The Air Force Retrofit integrated circuit terminal protection device
JPH0521655A (ja) * 1990-11-28 1993-01-29 Mitsubishi Electric Corp 半導体装置および半導体装置用パツケージ
US5043534A (en) * 1990-07-02 1991-08-27 Olin Corporation Metal electronic package having improved resistance to electromagnetic interference
US5031027A (en) * 1990-07-13 1991-07-09 Motorola, Inc. Shielded electrical circuit
US5270488A (en) * 1990-07-27 1993-12-14 Mitsubishi Denki Kabushiki Kaisha Shield construction for electrical devices
US5367766A (en) * 1990-08-01 1994-11-29 Staktek Corporation Ultra high density integrated circuit packages method
US5475920A (en) * 1990-08-01 1995-12-19 Burns; Carmen D. Method of assembling ultra high density integrated circuit packages
US5446620A (en) * 1990-08-01 1995-08-29 Staktek Corporation Ultra high density integrated circuit packages
US5377077A (en) * 1990-08-01 1994-12-27 Staktek Corporation Ultra high density integrated circuit packages method and apparatus
AU8519891A (en) * 1990-08-01 1992-03-02 Staktek Corporation Ultra high density integrated circuit packages, method and apparatus
US5119047A (en) * 1990-11-19 1992-06-02 General Dynamics Corp., Air Defense Systems Div. Stripline shielding and grounding system
US5557142A (en) * 1991-02-04 1996-09-17 Motorola, Inc. Shielded semiconductor device package
JP2887956B2 (ja) * 1991-07-11 1999-05-10 日本電気株式会社 携帯無線機
US5448450A (en) * 1991-08-15 1995-09-05 Staktek Corporation Lead-on-chip integrated circuit apparatus
US5311059A (en) * 1992-01-24 1994-05-10 Motorola, Inc. Backplane grounding for flip-chip integrated circuit
US5702985A (en) * 1992-06-26 1997-12-30 Staktek Corporation Hermetically sealed ceramic integrated circuit heat dissipating package fabrication method
US5289002A (en) * 1992-11-20 1994-02-22 Eastman Kodak Company Optical sensor and method of production
US5484959A (en) * 1992-12-11 1996-01-16 Staktek Corporation High density lead-on-package fabrication method and apparatus
US6205654B1 (en) 1992-12-11 2001-03-27 Staktek Group L.P. Method of manufacturing a surface mount package
US5644161A (en) * 1993-03-29 1997-07-01 Staktek Corporation Ultra-high density warp-resistant memory module
US5369056A (en) * 1993-03-29 1994-11-29 Staktek Corporation Warp-resistent ultra-thin integrated circuit package fabrication method
US5801437A (en) * 1993-03-29 1998-09-01 Staktek Corporation Three-dimensional warp-resistant integrated circuit module method and apparatus
US5355016A (en) * 1993-05-03 1994-10-11 Motorola, Inc. Shielded EPROM package
WO1995031826A1 (fr) * 1994-05-17 1995-11-23 Olin Corporation Boitier electronique presentant des proprietes electriques ameliorees
US6025642A (en) * 1995-08-17 2000-02-15 Staktek Corporation Ultra high density integrated circuit packages
US5945732A (en) * 1997-03-12 1999-08-31 Staktek Corporation Apparatus and method of manufacturing a warp resistant thermally conductive integrated circuit package
US6572387B2 (en) 1999-09-24 2003-06-03 Staktek Group, L.P. Flexible circuit connector for stacked chip module
US6608763B1 (en) 2000-09-15 2003-08-19 Staktek Group L.P. Stacking system and method
US6462408B1 (en) 2001-03-27 2002-10-08 Staktek Group, L.P. Contact member stacking system and method
KR102447435B1 (ko) * 2016-03-11 2022-09-23 삼성전자주식회사 Emi 감소를 위한 전력 전송 네트워크를 포함하는 기판과 이를 포함하는 장치들

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3274458A (en) * 1964-04-02 1966-09-20 Int Rectifier Corp Extremely high voltage silicon device
US3518494A (en) * 1964-06-29 1970-06-30 Signetics Corp Radiation resistant semiconductor device and method
US3489953A (en) * 1964-09-18 1970-01-13 Texas Instruments Inc Stabilized integrated circuit and process for fabricating same
US3387190A (en) * 1965-08-19 1968-06-04 Itt High frequency power transistor having electrodes forming transmission lines
US3465210A (en) * 1967-05-23 1969-09-02 Rca Corp Housing and lead assembly for high-frequency semiconductor devices
US3436810A (en) * 1967-07-17 1969-04-08 Jade Corp Method of packaging integrated circuits
US3520054A (en) * 1967-11-13 1970-07-14 Mitronics Inc Method of making multilevel metallized ceramic bodies for semiconductor packages
US3509430A (en) * 1968-01-31 1970-04-28 Micro Science Associates Mount for electronic component

Also Published As

Publication number Publication date
MY7500147A (en) 1975-12-31
DE2100103B2 (de) 1977-06-30
US3614546A (en) 1971-10-19
SE376114B (fr) 1975-05-05
GB1282251A (en) 1972-07-19
DE2100103A1 (de) 1971-07-15
FR2075958B1 (fr) 1976-05-28
FR2075958A1 (fr) 1971-10-15
JPS4942427B1 (fr) 1974-11-14

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