BE768009A - SEMICONDUCTOR ELEMENT AND PROCESS FOR ITS MANUFACTURING - Google Patents

SEMICONDUCTOR ELEMENT AND PROCESS FOR ITS MANUFACTURING

Info

Publication number
BE768009A
BE768009A BE768009A BE768009A BE768009A BE 768009 A BE768009 A BE 768009A BE 768009 A BE768009 A BE 768009A BE 768009 A BE768009 A BE 768009A BE 768009 A BE768009 A BE 768009A
Authority
BE
Belgium
Prior art keywords
manufacturing
semiconductor element
semiconductor
Prior art date
Application number
BE768009A
Other languages
French (fr)
Original Assignee
Bosch Gmbh Robert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert filed Critical Bosch Gmbh Robert
Publication of BE768009A publication Critical patent/BE768009A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
BE768009A 1970-06-03 1971-06-02 SEMICONDUCTOR ELEMENT AND PROCESS FOR ITS MANUFACTURING BE768009A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2027105A DE2027105C3 (en) 1970-06-03 1970-06-03 Method for manufacturing a semiconductor component

Publications (1)

Publication Number Publication Date
BE768009A true BE768009A (en) 1971-11-03

Family

ID=5772836

Family Applications (1)

Application Number Title Priority Date Filing Date
BE768009A BE768009A (en) 1970-06-03 1971-06-02 SEMICONDUCTOR ELEMENT AND PROCESS FOR ITS MANUFACTURING

Country Status (6)

Country Link
BE (1) BE768009A (en)
CH (1) CH520401A (en)
DE (1) DE2027105C3 (en)
FR (1) FR2093995B3 (en)
GB (1) GB1303382A (en)
NL (1) NL7107559A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5754043B2 (en) * 1973-05-21 1982-11-16
DE2700463A1 (en) * 1977-01-07 1978-07-13 Siemens Ag Semiconductor component edge passivating process - involves stacking of semiconductor components and passivating outer surface of stack
JPS59113648A (en) * 1982-12-20 1984-06-30 Hitachi Ltd Plastic molded type semiconductor device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3379356A (en) * 1964-09-25 1968-04-23 Int Standard Electric Corp Arrangement for an insulating panel soldering device according to the flowsolder process
US3426098A (en) * 1965-05-20 1969-02-04 Schenectady Chemical Polyester-polyimide wire enamel
US3411122A (en) * 1966-01-13 1968-11-12 Ibm Electrical resistance element and method of fabricating
DE6751565U (en) * 1968-08-01 1969-02-06 Licentia Gmbh ARRANGEMENT FOR ISOLATION OF RECTIFIERS
US3615913A (en) * 1968-11-08 1971-10-26 Westinghouse Electric Corp Polyimide and polyamide-polyimide as a semiconductor surface passivator and protectant coating

Also Published As

Publication number Publication date
FR2093995B3 (en) 1973-10-19
DE2027105A1 (en) 1971-12-16
FR2093995A7 (en) 1972-02-04
GB1303382A (en) 1973-01-17
NL7107559A (en) 1971-12-07
CH520401A (en) 1972-03-15
DE2027105B2 (en) 1980-06-26
DE2027105C3 (en) 1981-03-26

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